EP2S30F672C3 - 33,880 LEs Stratix II FPGA, 672-BGA | Intel
MPN: EP2S30F672C3 ✗ Cuối đờiEP2S30F672C3 Tóm tắt
A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit based on a matrix of configurable logic blocks (CLBs) connected via programmable interconnect. Unlike an ASIC, an FPGA can be reconfigured after manufacturing, enabling rapid prototyping, hardware iteration, and field upgrades. Stratix II sits within Intel/Altera's FPGA hierarchy (Stratix II -> Stratix family -> high-density FPGA -> programmable logic device -> semiconductor), targeting high-performance applications such as DSP, telecom, and ASIC prototyping.
Key features include up to 1.4 Mbits of TriMatrix embedded memory per block, dedicated 18x18 multipliers supporting up to 156 GMACs DSP performance, support for external DDR/DDR2/QDRII/SRAM memories via dedicated interfaces, and up to 12 high-speed transceivers (depending on variant). The 672-FBGA package provides dense I/O and robust power distribution for demanding high-speed designs.
The Stratix II architecture combines adaptive logic modules (ALMs) with eight-input look-up tables (LUTs), shared arithmetic chains, and register chains, giving designers a balance of logic density, register count, and routing flexibility. The Clearwater-style silicon combines hard IP for memory controllers and SERDES, freeing fabric for application logic.
Typical applications include ASIC prototyping, high-performance digital signal processing (DSP) such as software-defined radio and video processing, telecom line cards, military/aerospace signal processing, and high-speed data acquisition. Designers choose Stratix II for applications that require a balance of high logic density, abundant memory bandwidth, and DSP throughput.
When designing with this device, ensure your power budget supports the core (1.2 V), I/O banks (multiple voltages), and PLL/Transceiver (analog) supplies. Decoupling and signal integrity on a multi-layer PCB are critical to achieving timing closure at the -3 speed grade.
This page synthesizes distributor pricing, drop-in pin-compatible alternatives, and practical design notes not found in the bare manufacturer datasheet, giving engineers a single consolidated reference for the EP2S30F672C3.
Bộ thay thế dễ dàng lắp đặt cho EP2S30F672C3 — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EP2S30F672C3 (cùng hình factor và footprint) — khác nhau ở Speed Grade, Package, Operating Temperature, Mounting Type, Process Technology.
EP2S30F672C3N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP2S30F672C4
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP2S30F672C4N
✅ Drop-In ⚠️ Thông số chưa được xác minhLiên hệ để biết giá
Xem tài liệu →EP2S30F672I3
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
EP2S30F672I4N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP2S30F672C3 Tỷ lệ tối đa & tính chất điện
| Series | Stratix II |
| Number of Logic Elements | 33,880 |
| Number of Adaptive Logic Modules (ALMs) | 13,560 |
| Total Embedded Memory Bits | 1,369,728 |
| Embedded Memory (M512 / M4K / M-RAM blocks) | M512, M4K, M-RAM TriMatrix |
| Total RAM Bits | 1,369,728 |
| Number of User I/O | 500 |
| DSP Blocks | Dedicated 18x18 multipliers |
| DSP Performance | Up to 156 GMACs |
| Voltage - Supply | 1.2 V core, multi-rail I/O |
| Nhiệt độ hoạt động | 0C to +85C (Commercial) |
| Speed Grade | -3 |
| Hộp / Vỏ | 672-BBGA, FCBGA (FineLine BGA) |
| Kiểu lắp đặt | Surface Mount |
| Process Technology | 90 nm CMOS |
| Trạng thái RoHS | Non-compliant (leaded BGA) |
Hướng dẫn cấu hình chân EP2S30F672C3 672-bbga, fcbga (fineline bga)
Cấu hình chân cho EP2S30F672C3 (672-bbga, fcbga (fineline bga) gói). IC số này bao gồm chân GPIO, giao diện truyền thông (UART, SPI, I2C) và chân nguồn. Tham khảo tài liệu thông số kỹ thuật của nhà sản xuất để biết các chức năng chân thay thế và tùy chọn cấu hình. Cực kỳ quan trọng cho thiết kế hệ thống tích hợp và lập trình PCB.
Không có dữ liệu chân cụ thể sẵn có cho EP2S30F672C3.
Tham khảo: tài liệu kỹ thuật cho cấu hình chân đầy đủ.
Ứng dụng tiêu biểu
EP2S30F672C3 phù hợp cho 6 Áp dụngs: ASIC Prototyping and Emulation, High-Performance DSP (Software Defined Radio), Telecom Line Cards and Packet Processing, Video Processing and Image Pipelines, Military and Aerospace Signal Processing, Test and Measurement Instrumentation.
ASIC Prototyping and Emulation
The EP2S30F672C3's 33,880 logic elements and 1.36 Mbits of TriMatrix embedded memory make it well-suited for ASIC prototyping and in-circuit emulation of mid-complexity application-specific ICs. Designers can map large blocks of an ASIC RTL onto a single Stratix II device, then iterate timing and functionality before committing to mask production. The 500 user I/O and abundant LVDS pairs support real-world interface emulation at system speeds. Companion configuration memory and JTAG chains (e.g., EPCS64) complete the prototyping platform.
Được đề xuất
High-Performance DSP (Software Defined Radio)
With dedicated 18x18 multipliers delivering up to 156 GMACs and abundant TriMatrix memory bandwidth, the EP2S30F672C3 is a strong fit for software-defined radio (SDR) baseband processing. The fabric implements FFTs, channelizers, and digital down-converters at hundreds of MSPS, while the abundant on-chip memory holds coefficient tables and overlap-save buffers. PLL-based clock management and LVDS I/O simplify interfacing to high-speed ADCs and DACs common in SDR front-ends.
Được đề xuất
Telecom Line Cards and Packet Processing
Telecom line cards require deep packet buffers, multi-gigabit SERDES, and quality-of-service logic, all of which the EP2S30F672C3 supports. The 1.36 Mbits of embedded memory can be partitioned into per-flow queues, while external DDR/DDR2/QDRII memory interfaces are available via dedicated hard controllers. The 500 user I/O provide ample parallel datapath connectivity to framers, mappers, and backplane transceivers. Industrial-temp variants of the same die serve outdoor base-station deployments.
Được đề xuất
Video Processing and Image Pipelines
Real-time HD video pipelines demand multi-gigapixel-per-second throughput, which the EP2S30F672C3's DSP blocks and embedded memory can sustain. Designers implement motion estimation, deinterlacing, scaling, and color-space conversion directly in fabric, while the 500 I/O accept DVI/HDMI/SDI input streams via companion deserializer FPGAs or ASSPs. The TriMatrix M4K and M-RAM blocks efficiently implement line buffers and frame stores, reducing external memory cost.
Được đề xuất
Military and Aerospace Signal Processing
Defense signal-intelligence and electronic-warfare systems leverage the EP2S30F672C3's DSP density for wideband digital receivers. Per the Stratix II Device Handbook, the part supports dedicated multipliers and high-speed LVDS signaling required for phased-array radar processing. The companion military-temp variants (EP2S30F672A3 / A4) extend operating range to -55C to +125C for harsh-environment platforms such as unmanned aerial vehicles and shipboard EW systems.
Được đề xuất
Test and Measurement Instrumentation
Automatic test equipment (ATE) and high-end oscilloscopes/logic analyzers rely on programmable logic to implement protocol-aware triggering, pattern generation, and deep acquisition memory. The EP2S30F672C3's 500 I/O and 1.36 Mbits of TriMatrix memory are well matched to multi-channel waveform capture at GSPS rates. The fabric implements protocol decoders (PCIe, I2C, SPI, UART, MIPI) in firmware-upgradable logic, while the LVDS capability drives high-speed ADCs and DACs directly.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho EP2S30F672C3 — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | EP2S30F672C3N | EP2S30F672C4 | EP2S30F672I3 | EP2S30F672I4N | EP2S30F672C4N |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 672-BGA (FCBGA) | 672-BGA (FCBGA) - same | 672-BGA (FCBGA) - same | 672-BGA (FCBGA) - same | 672-BGA (FCBGA) - same | 672-BGA (FCBGA) - same |
| Logic Elements | 33,880 | 33,880 | 33,880 | 33,880 | 33,880 | 33,880 |
| Embedded Memory (bits) | 1,369,728 | 1,369,728 | 1,369,728 | 1,369,728 | 1,369,728 | 1,369,728 |
| User I/O | 500 | 500 | 500 | 500 | 500 | 500 |
| Speed Grade | -3 (fastest) | -3 | -4 | -3 | -4 | -4 |
| Temperature Grade | Commercial (0C to +85C) | Commercial | Commercial | Industrial (-40C to +100C) | Industrial | Commercial |
| RoHS / Lead-Free | Non-RoHS (leaded) | RoHS / Lead-free | Non-RoHS | Non-RoHS | RoHS / Lead-free | RoHS / Lead-free |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Bảo phân biệt quan trọng
- Highest speed grade in the Stratix II family (vsEP2S30F672C4)
- RoHS-compliant option available in same footprint (vsEP2S30F672C4)
- Industrial temperature range available without changing the package (vsEP2S30F672C3)
Ghi chú thiết kế
The EP2S30F672C3 requires a multi-rail supply: 1.2 V core (VCCINT), 1.2 V or 1.5 V PLL analog (VCCPLL), separate transceiver supply if used, and per-bank I/O voltages (VCCIO) that can be 1.5 V, 1.8 V, 2.5 V, or 3.3 V depending on the bank. Use a low-dropout regulator with Power OK indicator on the 1.2 V core rail, and decouple each rail with 0.1 uF ceramic caps placed within 100 mils of each supply pin. According to the Stratix II Device Handbook, power estimation should be done in Quartus PowerPlay early to size regulators and thermal dissipation.
The 672-FBGA package has a 1.0 mm ball pitch, which requires via-in-pad or microvia construction on at least the top signal layers. Use 8 or more PCB layers with dedicated ground and power planes. Length-match all DDR/DDR2 address/command/clock nets within +/- 25 mils and data strobes within +/- 10 mils to meet tDS/tDH. Reference the Altera Stratix II board design guidelines (AN 327) for via patterns and stackup recommendations.
Place the EP2S30F672C3 away from board edges to minimize mechanical stress on BGA solder joints during depanelization. Symmetrical escape routing on all four sides reduces warpage. For LVDS pairs, maintain 100 ohm differential impedance with matched trace lengths within +/- 5 mils. Keep PLL analog supplies isolated from noisy digital rails with a pi-filter (ferrite bead + capacitors) to minimize jitter.
Do NOT use the EP2S30F672C3 for new RoHS-compliant production designs - the package uses leaded solder balls and is non-RoHS per Verified Web Data. Specify EP2S30F672C3N for new designs. Also note that Stratix II configuration bitstreams are not compatible with Cyclone, Arria, or Stratix V devices - migrating to a newer Altera/Intel FPGA family requires both PCB redesign and Quartus re-synthesis.
Estimated: at 500 MHz LVDS toggle rates, expect approximately 50 mV of ground bounce per switching bank; isolate high-speed LVDS banks from single-ended general-purpose I/O with a quiet ground ring or split-power plane. Source-series termination (SST) of 33-50 ohms is generally adequate for short LVDS links, while external 100 ohm differential termination at the receiver is required for any LVDS pair longer than 2 inches of total routed length.
Thông tin tuân thủ
RoHS non-compliant per Verified Web Data (ICComponents-distributor). The EP2S30F672C3N is the lead-free RoHS-compliant pin-compatible alternative. AEC-Q100 not applicable as this is an FPGA, not an automotive-qualified IC.
