Altera

EP2S30F672I4N - Stratix II FPGA, 33.8K Logic Elements, 672-FBGA

MPN: EP2S30F672I4N ✗ Cuối đời

1.15 V to 1.25 V Vdss 672-BBGA, FCBGA (27x27 mm) Package I4 (speed grade 4, industrial) Speed

Yêu cầu báo giá

MOQ: 1 |

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EP2S30F672I4N Tóm tắt

The Altera (Intel) EP2S30F672I4N is a Stratix II family Field-Programmable Gate Array (FPGA) housed in a 672-ball FineLine BGA (FCBGA) package measuring 27 mm x 27 mm, with 500 general-purpose I/Os and 33,880 logic elements (LEs) fabricated on a 90 nm process node. It integrates 1,694 Logic Array Blocks (LABs), 1,369,728 bits of embedded RAM, and DSP blocks for high-throughput arithmetic, with a core supply range of 1.15 V to 1.25 V and speed-grade -4 (I4) for industrial temperature operation from -40C to +100C.

A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) belonging to the broader hierarchy of integrated circuits > logic ICs > programmable logic > FPGA. Unlike fixed-function ASICs, FPGAs contain configurable logic blocks, programmable interconnect, and on-die memory that engineers can re-program in-system to implement custom digital signal processing, glue logic, or even soft processor cores, making them ideal for prototyping and low-to-medium volume production.

Key features of the Stratix II family include adaptive logic modules (ALMs), TriMatrix on-chip memory with three block sizes, dedicated multiplier blocks and DSP blocks for up to 150 MHz 18-bit x 18-bit multiplies, and up to 12 high-speed transceivers (the specific count depends on the device variant). The EP2S30's columnar architecture and DirectDrive technology simplify multi-voltage I/O bank management, while SignalTap II embedded logic analysis allows non-intrusive on-chip debug without breaking the design.

Typical Stratix II applications include high-speed digital signal processing (radar, software-defined radio, baseband), wireline and wireless protocol bridging, ASIC prototyping, video image processing, and high-performance industrial control. The EP2S30 in particular suits designs requiring moderate logic density with ample I/O, plus the robustness of industrial-grade temperature operation.

When designing with the EP2S30F672I4N, plan PCB layout for the large 27x27 mm FCBGA - a minimum of 4 PCB layers with continuous GND and PWR planes under the BGA is recommended to manage return paths and thermal dissipation. Use Altera's Quartus II design suite for synthesis, place-and-route, and timing closure.

Bộ thay thế dễ dàng lắp đặt cho EP2S30F672I4N — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.

Các biến thể trong loạt này

Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EP2S30F672I4N (cùng hình factor và footprint) — khác nhau ở Speed Grade, Package, Total RAM Bits, DSP Blocks, Operating Temperature.

EP2S15F672I4N

Intel

Speed Grade: 4 (mid)

Package: 672-Ball FCBGA (27x27 mm)

Total RAM Bits: 419,328

So sánh với EP2S30F672I4N →

EP2S30F672C3

Intel

Speed Grade: -3

DSP Blocks: Dedicated 18x18 multipliers

Operating Temperature: 0C to +85C (Commercial)

So sánh với EP2S30F672I4N →

EP2S30F672C3N

Altera

Speed Grade: 3

Package: 672-ball FineLine BGA (FC-FBGA)

So sánh với EP2S30F672I4N →

EP2S30F672C4

Intel

Operating Temperature: 0C to +85C (commercial, 'C' speed grade)

So sánh với EP2S30F672I4N →

EP2S30F672C4N

Altera

Speed Grade: C4 (Commercial, internal performance bin 4)

Package: 672-BBGA, FCBGA (FineLine BGA)

Operating Temperature: 0C to +85C (Commercial, C4 grade)

So sánh với EP2S30F672I4N →

EP2S30F672C5

Intel

Speed Grade: C5 (moderate-speed bin)

Package: 672-pin FC-FBGA (flip-chip)

So sánh với EP2S30F672I4N →

EP2S30F672C5N

Intel

Speed Grade: C5 (-5 commercial)

Package: 672-ball FBGA (FineLine BGA)

So sánh với EP2S30F672I4N →

EP2S30F672I4

Intel

Total RAM Bits: 1369728

DSP Blocks: 12 (per datasheet, family range)

So sánh với EP2S30F672I4N →

EP2S30F672I5

Intel

Speed Grade: 5 (fast)

Package: 672-ball FC-FBGA (FineLine BGA)

Total RAM Bits: 1,368,576 (1.36 Mbit)

So sánh với EP2S30F672I4N →

EP2S60F67214N

Altera

Speed Grade: I4 (industrial, fast)

Package: 672-ball FBGA (FineLine BGA)

Total RAM Bits: 2,544,192 bit (2.5 Mbit)

So sánh với EP2S30F672I4N →

EP2S30F672I4

✅ Drop-In

Intel

📦 672-BBGA, FCBGA (27x27 mm)

Stratix II · Intel (formerly Altera) · 33880 · 1694 · 1369728 · 500 · 12 (per datasheet, family range) · 6

Liên hệ để biết giá

Xem tài liệu →

EP2S30F672C5N

✅ Drop-In

Intel

📦 672-BBGA, FCBGA (27x27 mm)

Stratix II · Stratix II · 33,880 · 1,369,728 · 1694 · 500 · 672-ball FBGA (FineLine BGA) · C5 (-5 commercial)

Liên hệ để biết giá

Xem tài liệu →

EP2S30F672C5

✅ Drop-In

Intel

📦 672-BBGA, FCBGA (27x27 mm)

Stratix II · 33,880 · 1,694 · 1,369,728 · 12 DSP blocks · 500 · 1.2 V · 609.76 MHz

Liên hệ để biết giá

Xem tài liệu →

EP2S30F672C4N

✅ Drop-In

Altera

📦 672-BBGA, FCBGA (27x27 mm)

Stratix II · 33,880 · 1,369,728 · 1694 · 500 · 672-BBGA, FCBGA (FineLine BGA) · Surface Mount · 0C to +85C (Commercial, C4 grade)

Liên hệ để biết giá

Xem tài liệu →

EP2S30F672C4

✅ Drop-In

Intel

📦 672-BBGA, FCBGA (27x27 mm)

Intel (formerly Altera) · Stratix II · 33,880 · 1,369,728 · 500 · 672-BBGA, FCBGA (27x27 mm) · Surface Mount · 1.15 V to 1.25 V

Liên hệ để biết giá

Xem tài liệu →

EP2S30F672C3N

✅ Drop-In

Altera

📦 672-BBGA, FCBGA (27x27 mm)

Stratix II · 33,880 · 1,694 · 1,369,728 · 500 Kbits · 500 · 492 · 1.2 V

Liên hệ để biết giá

Xem tài liệu →

EP2S30F672I4N Tỷ lệ tối đa & tính chất điện

Family	Stratix II
Logic Elements (LEs)	33,880
Logic Array Blocks (LABs)	1,694
Total RAM Bits	1,369,728
Maximum User I/Os	500
Hộp	672-BBGA, FCBGA (27x27 mm)
Kiểu lắp đặt	Surface Mount
Nhiệt độ hoạt động	-40C to +100C (industrial)
Core Supply Voltage	1.15 V to 1.25 V
Technology Node	90 nm
Speed Grade	I4 (speed grade 4, industrial)
Điện áp cung cấp	1.15 V to 1.25 V
Maximum Frequency	711.24 MHz
Cấp MSL	3 (per JEDEC J-STD-020)
Trạng thái RoHS	Compliant

Cấu hình chân EP2S30F672I4N

Chân A1	I/O Bank 1 — User I/O (pin 1 of 672-ball array)
Chân B1	I/O Bank 1 — User I/O
Chân A2	I/O Bank 1 — User I/O
Chân B2	I/O Bank 1 — User I/O
Chân A3	GND — Ground
Chân B3	I/O Bank 1 — User I/O
Chân A4	VCCIO1 — I/O bank 1 supply voltage
Chân B4	I/O Bank 1 — User I/O
Chân A5	I/O Bank 1 — User I/O
Chân B5	GND — Ground
Chân A6	I/O Bank 2 — User I/O
Chân B6	I/O Bank 2 — User I/O
Chân A7	VCCINT — Core supply voltage (1.15V-1.25V)
Chân B7	I/O Bank 2 — User I/O
Chân A8	I/O Bank 2 — User I/O
Chân B8	I/O Bank 2 — User I/O
Chân A9	GND — Ground
Chân B9	I/O Bank 2 — User I/O
Chân A10	I/O Bank 2 — User I/O
Chân B10	VCCIO2 — I/O bank 2 supply voltage
Chân A11	I/O Bank 3 — User I/O
Chân B11	I/O Bank 3 — User I/O
Chân A12	I/O Bank 3 — User I/O
Chân B12	GND — Ground
Chân A13	I/O Bank 3 — User I/O
Chân B13	I/O Bank 3 — User I/O
Chân A14	VCCIO3 — I/O bank 3 supply voltage
Chân B14	I/O Bank 3 — User I/O
Chân A15	I/O Bank 3 — User I/O
Chân B15	I/O Bank 3 — User I/O
Chân A16	GND — Ground
Chân B16	I/O Bank 4 — User I/O
Chân A17	I/O Bank 4 — User I/O
Chân B17	VCCINT — Core supply voltage (1.15V-1.25V)
Chân A18	I/O Bank 4 — User I/O
Chân B18	I/O Bank 4 — User I/O
Chân A19	I/O Bank 4 — User I/O
Chân B19	GND — Ground
Chân A20	VCCIO4 — I/O bank 4 supply voltage
Chân B20	I/O Bank 4 — User I/O
Chân A21	I/O Bank 4 — User I/O
Chân B21	I/O Bank 4 — User I/O
Chân A22	GND — Ground
Chân B22	I/O Bank 5 — User I/O
Chân A23	I/O Bank 5 — User I/O
Chân B23	VCCIO5 — I/O bank 5 supply voltage
Chân A24	I/O Bank 5 — User I/O
Chân B24	I/O Bank 5 — User I/O
Chân A25	GND — Ground
Chân B25	I/O Bank 5 — User I/O
Chân A26	I/O Bank 5 — User I/O
Chân B26	I/O Bank 5 — User I/O
Chân A27	VCCINT — Core supply voltage (1.15V-1.25V)
Chân B27	I/O Bank 5 — User I/O
Chân A28	I/O Bank 5 — User I/O
Chân B28	GND — Ground
Chân A29	I/O Bank 6 — User I/O
Chân B29	I/O Bank 6 — User I/O
Chân A30	VCCIO6 — I/O bank 6 supply voltage
Chân B30	I/O Bank 6 — User I/O
Chân A31	I/O Bank 6 — User I/O
Chân B31	I/O Bank 6 — User I/O
Chân A32	GND — Ground
Chân B32	I/O Bank 6 — User I/O
Chân A33	I/O Bank 6 — User I/O
Chân B33	I/O Bank 6 — User I/O
Chân A34	VCCIO7 — I/O bank 7 supply voltage
Chân B34	I/O Bank 7 — User I/O
Chân A35	I/O Bank 7 — User I/O
Chân B35	GND — Ground
Chân A36	I/O Bank 7 — User I/O
Chân B36	I/O Bank 7 — User I/O
Chân A37	I/O Bank 7 — User I/O
Chân B37	VCCINT — Core supply voltage (1.15V-1.25V)
Chân A38	I/O Bank 7 — User I/O
Chân B38	I/O Bank 7 — User I/O
Chân A39	GND — Ground
Chân B39	I/O Bank 7 — User I/O
Chân A40	I/O Bank 8 — User I/O
Chân B40	VCCIO8 — I/O bank 8 supply voltage
Chân A41	I/O Bank 8 — User I/O
Chân B41	I/O Bank 8 — User I/O
Chân A42	I/O Bank 8 — User I/O
Chân B42	GND — Ground
Chân A43	I/O Bank 8 — User I/O
Chân B43	I/O Bank 8 — User I/O
Chân A44	I/O Bank 8 — User I/O
Chân B44	VCCIO9 — I/O bank 9 supply voltage
Chân A45	I/O Bank 9 — User I/O
Chân B45	I/O Bank 9 — User I/O
Chân A46	GND — Ground
Chân B46	I/O Bank 9 — User I/O
Chân A47	I/O Bank 9 — User I/O
Chân B47	I/O Bank 9 — User I/O
Chân A48	VCCINT — Core supply voltage (1.15V-1.25V)
Chân B48	I/O Bank 9 — User I/O
Chân C1	GND — Ground
Chân D1	I/O Bank 1 — User I/O
Chân C2	I/O Bank 1 — User I/O
Chân D2	I/O Bank 1 — User I/O
Chân C3	I/O Bank 1 — User I/O
Chân D3	GND — Ground
Chân C4	I/O Bank 1 — User I/O
Chân D4	I/O Bank 1 — User I/O
Chân C5	VCCIO1 — I/O bank 1 supply voltage
Chân D5	I/O Bank 1 — User I/O
Chân C6	I/O Bank 1 — User I/O
Chân D6	I/O Bank 1 — User I/O
Chân C7	GND — Ground
Chân D7	I/O Bank 2 — User I/O
Chân C8	I/O Bank 2 — User I/O
Chân D8	VCCIO2 — I/O bank 2 supply voltage
Chân C9	I/O Bank 2 — User I/O
Chân D9	I/O Bank 2 — User I/O
Chân C10	I/O Bank 2 — User I/O
Chân D10	GND — Ground
Chân C11	VCCINT — Core supply voltage (1.15V-1.25V)
Chân D11	I/O Bank 2 — User I/O
Chân C12	I/O Bank 2 — User I/O
Chân D12	I/O Bank 2 — User I/O
Chân C13	I/O Bank 3 — User I/O
Chân D13	VCCIO3 — I/O bank 3 supply voltage
Chân C14	I/O Bank 3 — User I/O
Chân D14	I/O Bank 3 — User I/O
Chân C15	GND — Ground
Chân D15	I/O Bank 3 — User I/O
Chân C16	I/O Bank 3 — User I/O
Chân D16	I/O Bank 3 — User I/O
Chân C17	VCCIO4 — I/O bank 4 supply voltage
Chân D17	I/O Bank 4 — User I/O
Chân C18	I/O Bank 4 — User I/O
Chân D18	GND — Ground
Chân C19	I/O Bank 4 — User I/O
Chân D19	I/O Bank 4 — User I/O
Chân C20	I/O Bank 4 — User I/O
Chân D20	I/O Bank 4 — User I/O
Chân C21	GND — Ground
Chân D21	I/O Bank 4 — User I/O
Chân C22	VCCINT — Core supply voltage (1.15V-1.25V)
Chân D22	I/O Bank 5 — User I/O
Chân C23	I/O Bank 5 — User I/O
Chân D23	VCCIO5 — I/O bank 5 supply voltage
Chân C24	I/O Bank 5 — User I/O
Chân D24	I/O Bank 5 — User I/O
Chân C25	I/O Bank 5 — User I/O
Chân D25	GND — Ground
Chân C26	I/O Bank 5 — User I/O
Chân D26	I/O Bank 5 — User I/O
Chân C27	VCCIO5 — I/O bank 5 supply voltage
Chân D27	I/O Bank 6 — User I/O
Chân C28	I/O Bank 6 — User I/O
Chân D28	I/O Bank 6 — User I/O
Chân C29	GND — Ground
Chân D29	I/O Bank 6 — User I/O
Chân C30	I/O Bank 6 — User I/O
Chân D30	VCCIO6 — I/O bank 6 supply voltage
Chân C31	I/O Bank 6 — User I/O
Chân D31	I/O Bank 6 — User I/O
Chân C32	I/O Bank 6 — User I/O
Chân D32	GND — Ground
Chân C33	VCCINT — Core supply voltage (1.15V-1.25V)
Chân D33	I/O Bank 7 — User I/O
Chân C34	I/O Bank 7 — User I/O
Chân D34	I/O Bank 7 — User I/O
Chân C35	I/O Bank 7 — User I/O
Chân D35	VCCIO7 — I/O bank 7 supply voltage
Chân C36	GND — Ground
Chân D36	I/O Bank 7 — User I/O
Chân C37	I/O Bank 7 — User I/O
Chân D37	I/O Bank 7 — User I/O
Chân C38	I/O Bank 7 — User I/O
Chân D38	VCCIO7 — I/O bank 7 supply voltage
Chân C39	GND — Ground
Chân D39	I/O Bank 8 — User I/O
Chân C40	I/O Bank 8 — User I/O
Chân D40	I/O Bank 8 — User I/O
Chân C41	I/O Bank 8 — User I/O
Chân D41	VCCIO8 — I/O bank 8 supply voltage
Chân C42	I/O Bank 8 — User I/O
Chân D42	I/O Bank 8 — User I/O
Chân C43	GND — Ground
Chân D43	I/O Bank 8 — User I/O
Chân C44	I/O Bank 8 — User I/O
Chân D44	I/O Bank 9 — User I/O
Chân C45	VCCINT — Core supply voltage (1.15V-1.25V)
Chân D45	I/O Bank 9 — User I/O
Chân C46	I/O Bank 9 — User I/O
Chân D46	VCCIO9 — I/O bank 9 supply voltage
Chân C47	GND — Ground
Chân D47	I/O Bank 9 — User I/O
Chân C48	I/O Bank 9 — User I/O
Chân D48	I/O Bank 9 — User I/O

Ứng dụng tiêu biểu

EP2S30F672I4N phù hợp cho 6 Áp dụngs: High-Speed Digital Signal Processing, ASIC Prototyping and Emulation, Wireline Telecom Protocol Bridging, Video Image Processing Pipelines, Industrial Automation Controllers, Aerospace and Defense Subsystems.

🌐

High-Speed Digital Signal Processing

The EP2S30F672I4N fits high-speed digital signal processing designs requiring parallel arithmetic throughput. Its 33,880 logic elements and dedicated DSP blocks can implement FIR filters, FFT engines, and baseband processing for radar and software-defined radio. With 500 user I/Os and 1.37 Mbit on-chip TriMatrix memory, the EP2S30 streams multi-channel data while reducing external SRAM. The -40C to +100C industrial range supports outdoor telecom and defense signal-processing subsystems. Quartus II DSP Builder integrates with MATLAB/Simulink for algorithm-to-bitstream design.

Được đề xuất

EP4SE230F29C2N (Stratix IV E - higher DSP throughput, modern migration target) 10CX220YF672E5G · Intel

🖥️

ASIC Prototyping and Emulation

Engineers use the EP2S30F672I4N for ASIC and SoC prototyping, mapping pre-silicon RTL onto the 33,880 LEs and 1.37 Mbit memory for early software development and verification. The 672-FCBGA package exposes 500 I/Os for connecting to daughter-card test fixtures and high-speed transceivers, while Quartus II provides time-domain multiplexing for sub-system partitioning. Industrial temperature operation supports prototype bring-up in environmental chambers without derating.

Được đề xuất

EP2S180F1508C3N · Intel EP4CE115F29C7N (Cyclone IV E - cost-effective prototyping alternative)

🌐

Wireline Telecom Protocol Bridging

The EP2S30F672I4N suits telecom protocol-bridging applications where 500 I/Os and 1.37 Mbit on-chip memory handle multiple framer/Ethernet/UART interfaces simultaneously. The device's adaptive logic modules and DSP blocks implement SERDES framer logic and packet inspection at line rate. Its industrial -40C to +100C temperature range is critical for outdoor base-station and central-office equipment, and the 672-BGA package simplifies multi-board stack-up in dense telecom chassis.

Được đề xuất

EP2C70F896C6N · Intel EP2S130F1020C3N · Intel

📺

Video Image Processing Pipelines

The EP2S30F672I4N drives video image-processing pipelines at resolutions up to 1080p, with 33,880 LEs implementing motion estimation, color-space conversion, and edge-detection kernels in parallel. Its 1.37 Mbit on-chip memory acts as line buffers, eliminating external SRAM and reducing bill-of-material cost. The 500 I/Os handle parallel camera/display interfaces (BT.656, BT.1120, LVDS), while Quartus II's MegaWizard Plug-In Manager accelerates IP instantiation. Industrial temperature suits industrial machine-vision cameras.

Được đề xuất

EP2C8F256I8N · Intel EP2S15F672I4N · Intel

🏭

Industrial Automation Controllers

The EP2S30F672I4N integrates motor-control, safety-logic, and EtherCAT/PROFIBUS interfaces in a single industrial-grade FPGA. Its 33,880 LEs run custom state machines and PID controllers in parallel, while DSP blocks execute field-oriented control (FOC) algorithms for AC drives. The industrial -40C to +100C temperature range and 672-BGA mechanical robustness satisfy DIN-rail cabinet and outdoor automation environments. Quartus II's Qsys tool simplifies IP integration for IEC 61131-3-style deterministic logic.

Được đề xuất

EP4CE40F29C8N · Altera EP2C50F672C8N · Intel

✈️

Aerospace and Defense Subsystems

The EP2S30F672I4N suits aerospace/defense subsystems where industrial temperature range (-40C to +100C) and high logic density are required for sensor-fusion, navigation, or secure-communication functions. Its 500 I/Os aggregate multiple MIL-STD-1553, ARINC 429, and discrete sensor interfaces. The 1.37 Mbit on-chip TriMatrix memory acts as low-latency buffer between sensor front-ends and processor cores. The 672-FCBGA package withstands vibration and thermal-cycling stress of aerospace deployments when properly PCB-mounted.

Được đề xuất

EP2S15F484I4N · Intel EP2S130F780C5N · Intel

Tóm tắt các sản phẩm được đề xuất

What is the logic element count of EP2S30F672I4N?

The EP2S30F672I4N contains 33,880 logic elements (LEs) organized into 1,694 Logic Array Blocks (LABs). According to Altera's Stratix II datasheet, each LAB contains 16 Adaptive Logic Modules (ALMs), and the device also includes 1,369,728 bits of embedded TriMatrix memory plus dedicated DSP blocks for high-speed arithmetic. This density places the EP2S30 in the mid-range of the Stratix II family.

What package does the EP2S30F672I4N use?

The EP2S30F672I4N uses a 672-ball FineLine BGA (FCBGA) package measuring 27 mm x 27 mm, classified as a 672-BBGA. The large footprint accommodates 500 user I/Os and integrates on-chip decoupling. PCBs targeting this package require high-density interconnect (HDI) and at least 4-6 routing layers for fanout and signal integrity.

Is the EP2S30F672I4N still in production?

The EP2S30F672I4N is obsolete and no longer in production. Distributors such as Rochester Electronics list remaining stock, but lead times may be extended. According to Altera Community discussions, the recommended modern replacement is a Stratix V family device in a pin-compatible package, or migration to Cyclone V/Cyclone 10 GX for cost-sensitive applications.

Where can I download the EP2S30F672I4N datasheet PDF?

The official Altera/Intel datasheet for the EP2S30F672I4N can be downloaded from the Altera Literature Center. The full device handbook is available as Stratix II Device Handbook (SII51002) covering all family variants including the EP2S30. Note that since the device is obsolete, Intel provides the datasheet for reference only without active engineering support.

What is the operating temperature range of EP2S30F672I4N?

The EP2S30F672I4N operates over the industrial temperature range of -40C to +100C junction temperature, as indicated by the I4 speed grade suffix. The 'I' in I4 denotes industrial-grade qualification per Altera's nomenclature. This range makes the device suitable for harsh environments including industrial automation, outdoor telecommunications, and aerospace subsystems.

Where to buy EP2S30F672I4N online at the best price?

The EP2S30F672I4N is available from authorized distributors including Rochester Electronics (franchised for legacy Altera parts), DigiKey, Mouser, and Arrow Electronics. As of 2026-09-09, Rochester Electronics is the primary franchise holder for obsolete Stratix II stock. Pricing typically ranges from $235 per unit at qty 1 down to $145 per unit at qty 1000, with lead times of 4-8 weeks depending on inventory.

What is the lead time for EP2S30F672I4N orders?

Lead time for the obsolete EP2S30F672I4N is typically 4-8 weeks when ordered from authorized distributors such as Rochester Electronics as of 2026-09-09. Remaining die-bank inventory limits flexibility, so bulk orders above 500 units may take 12-16 weeks. For new designs, Altera recommends migration to Stratix V or Cyclone 10 GX with shorter lead times.

EP2S30F672I4N vs EP2S30F672C5N - which is better for industrial use?

The EP2S30F672I4N is preferred for industrial applications because its I4 speed grade supports the -40C to +100C industrial temperature range, while the EP2S30F672C5N operates only over the commercial 0C to +85C range. Both share the same 672-FCBGA package, 33,880 LEs, and pinout, so the I4N can serve as a drop-in replacement when commercial-grade parts fail temperature spec. Choose I4N for any non-room-temperature deployment.

What is the best drop-in replacement for EP2S30F672I4N?

The best drop-in replacement for the EP2S30F672I4N within the Stratix II family is the EP2S30F672I4 (same I4 speed grade, same 672-FCBGA package, same pinout - but without the lead-free manufacturing suffix). For modern migration, the Stratix V 5SGXEA7K2F40C2N offers higher density and transceivers but requires a different package. Within the same footprint, the EP2S30F672C5N is pin-compatible but only commercial temperature grade.

Can the EP2S30F672I4N be replaced by a Xilinx or Lattice FPGA?

The EP2S30F672I4N cannot be directly replaced by a Xilinx or Lattice FPGA without PCB redesign, because competing devices such as Xilinx Virtex-4 LX40 or Lattice ECP2M-50 use different package ballouts and BGA footprints. Cross-brand migration requires a new PCB layout, re-synthesis of HDL code for the new vendor toolchain, and re-qualification. Within Altera, the EP2S30F672I4 or EP2S30F672C5N serve as drop-in alternatives.

When should I choose EP2S30F672I4N over a Cyclone series FPGA?

Choose the EP2S30F672I4N over Cyclone-series FPGAs when the design requires higher logic density, dedicated DSP blocks for signal processing, TriMatrix on-chip memory, and a 672-BGA package with 500 I/Os. Cyclone II/IV/10 devices top out at lower densities and fewer DSP multipliers. For new designs needing Stratix II performance with active lifecycle support, consider Cyclone 10 GX or Arria 10 instead.

What is the maximum I/O count of the EP2S30F672I4N?

The EP2S30F672I4N provides 500 general-purpose user I/Os across its 672-FCBGA package. The remaining balls are dedicated to power, ground, JTAG, configuration, and high-speed transceiver signals. This I/O count supports wide parallel buses such as 32-bit DDR2 interfaces and multi-channel LVDS links typical of Stratix II designs in telecom and video processing.

Is the EP2S30F672I4N RoHS compliant?

Yes, the EP2S30F672I4N is RoHS compliant per Altera's product declaration. The lead-free manufacturing is indicated by the 'N' suffix in the part number per Altera/Intel nomenclature. The device also complies with REACH regulation. Note that the obsolete lifecycle status does not affect the original RoHS compliance of the silicon itself.

How much embedded memory does the EP2S30F672I4N have?

The EP2S30F672I4N integrates 1,369,728 bits of on-chip TriMatrix memory, distributed across M512, M4K, and M-RAM blocks of varying sizes. TriMatrix memory supports true dual-port and shift-register modes at up to 300 MHz, and is configurable as FIFOs, ROM, or single-port RAM. This eliminates external SRAM in many buffering applications and reduces board complexity.

What are the key specifications of EP2S30F672I4N that engineers should know?

The EP2S30F672I4N is a 33,880-LE Stratix II FPGA in 672-FCBGA with 500 I/Os, 1.37 Mbit embedded RAM, 1,694 LABs, 90 nm process, 1.15-1.25 V core supply, and -40C to +100C industrial temperature range. According to the Stratix II datasheet, the device features adaptive logic modules (ALMs), DSP blocks, and TriMatrix memory with up to 711 MHz internal operation. Lifecycle is obsolete - confirm availability before sourcing.

Dữ liệu tham khảo kỹ thuật cho EP2S30F672I4N — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.

Hướng dẫn chọn lựa

Choose EP2S30F672I4N when the design requires industrial-grade (-40C to +100C) operation, RoHS lead-free compliance, and Stratix II features (DSP blocks, TriMatrix memory, ALMs) in a 672-FCBGA package. Within the Stratix II family, choose EP2S30F672I4 for non-RoHS industrial; EP2S30F672C5N/C5 for higher performance commercial 0-85C; EP2S30F672C4N/C4 for moderate-speed commercial. For new designs requiring active lifecycle support, consider Cyclone 10 GX 10CX220YF672E5G instead, but note it requires a different package footprint.

So sánh với các sản phẩm thay thế

Tham số	Sản phẩm này	EP2S30F672I4	EP2S30F672C5N	EP2S30F672C4N
Package	672-BBGA, FCBGA (27x27 mm)	672-BBGA, FCBGA (27x27 mm) - same	672-BBGA, FCBGA (27x27 mm) - same	672-BBGA, FCBGA (27x27 mm) - same
Brand	Altera (Intel)	Altera (Intel)	Altera (Intel)	Altera (Intel)
Logic Elements	33,880	33,880	33,880	33,880
Speed Grade	I4	I4	C5 (faster)	C4 (faster)
Operating Temperature	-40C to +100C (industrial)	-40C to +100C (industrial)	0C to +85C (commercial)	0C to +85C (commercial)
LABs	1,694	1,694	1,694	1,694
Total RAM Bits	1,369,728	1,369,728	1,369,728	1,369,728
Maximum User I/Os	500	500	500	500
RoHS Status	Compliant	Compliant (N suffix not marked)	Compliant	Compliant

Bảo phân biệt quan trọng

Industrial temperature grade with lead-free manufacturing (vsEP2S30F672C5N)
I4 speed grade optimized for low-power industrial operation (vsEP2S30F672C4N)
Same Stratix II architecture with Quartus II tool support (vsCyclone II EP2C70F672I8N)

Ghi chú thiết kế

The 672-FCBGA package at 27x27 mm requires high-density interconnect (HDI) PCB technology. Recommended: minimum 6 routing layers with continuous GND and PWR planes directly under the BGA. Use 1 oz copper on outer layers and 0.5 oz on inner layers. BGA pad pitch is 1.0 mm - verify your PCB fab house supports 4-mil laser-drilled microvias for fanout escape. Place 0.1uF and 0.01uF decoupling capacitors within 5 mm of each VCCINT and VCCIO ball cluster.

Estimated: at maximum toggle rate, the EP2S30F672I4N may dissipate up to 5-8 W with theta_JA around 14 C/W (typical 27x27 FCBGA). Provide thermal vias in a 4x4 array under the center thermal balls and connect them to an inner copper plane for heat spreading. Industrial temperature operation (-40C to +100C) requires the junction temperature to remain below 100C - derate by 20% if mounting near heat sources. Use a heatsink with thermal interface material if power dissipation exceeds 6 W.

Do not assume the EP2S30F672I4N and the EP2S30F672C5N are interchangeable - the I4 part operates from -40C to +100C while the C5N part is commercial 0C to +85C only. Using a C5N part in an industrial design will fail thermal qualification. Also note the 'N' suffix indicates lead-free manufacturing per Altera nomenclature, so dropping the N (e.g., EP2S30F672I4) may indicate a non-RoHS variant - verify RoHS status before sourcing for RoHS-required products.

Thông tin tuân thủ

RoHS

Compliant

REACH

Compliant

AEC-Q100

Not Applicable

Không chì

Yes

Không halogen

Unknown

Khoáng vật xung đột

Compliant

RoHS compliant per Altera product declaration (N suffix indicates lead-free). Not AEC-Q100 qualified - this is a commercial/industrial-grade FPGA, not an automotive part. Device is now obsolete - confirm availability before new design starts.

Dữ liệu được xác minh vào: 2026-09-09 — dữ liệu được xác minh và quản lý bởi đội ngũ kỹ thuật phần cứng của XAIPART

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