EP3C16F256I7N - Cyclone III FPGA, 15K LEs, 256-FBGA | Intel
MPN: EP3C16F256I7N ✓ Hoạt độngEP3C16F256I7N Tóm tắt
An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that contains an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells, all of which can be reconfigured by the end user after manufacture. Within the broader semiconductor hierarchy, FPGAs sit alongside microcontrollers, DSPs, and ASICs as a programmable logic category, with the Cyclone III family targeting low-power, cost-optimized applications in the sub-100 mW static power envelope. This part is a low-cost variant of the broader programmable logic taxonomy that includes SRAM-based, flash-based, and antifuse-based devices.
Key features of the EP3C16F256I7N include support for multiple I/O standards (LVTTL, LVCMOS, SSTL, HSTL, LVDS, RSDS, mini-LVDS, LVPECL, PCI, PCI-X), up to four general-purpose PLLs per device with fractional synthesis and spread-spectrum capability, and Cyclone III architecture with a logic capacity that maps efficiently to consumer, industrial, and communications designs. The device is fabricated on a TSMC low-leakage 60 nm process that reduces static power consumption by up to 50% compared to the prior generation.
The architecture combines a fabric of 15408 logic elements arranged in columns and rows, 504 Kbit of M9K embedded memory blocks (totaling 516 Kbit), 56 18x18 hardware multipliers, and four PLLs. Each logic element contains a 4-input look-up table (LUT), a programmable register, and carry-chain logic for efficient arithmetic and address generation. This combination makes the Cyclone III family a balanced general-purpose FPGA for control-plane and moderate-throughput data-plane tasks.
Typical applications include industrial motor control and factory automation, automotive driver assistance and infotainment, consumer video processing, software-defined radio, video surveillance, and telecom infrastructure. The Cyclone III series was widely adopted in designs where the design team wanted the flexibility of FPGA fabric but the unit cost of an ASIC, particularly for low-to-mid volume production.
When designing with this part, engineers should reference the Cyclone III Device Handbook for I/O standard and pin assignment details, use the Quartus II design software (Web Edition is free) for synthesis and place-and-route, and provide a configuration memory such as an EPCS or EPCQ flash device on the board for non-volatile configuration. The "I7N" suffix denotes the industrial temperature grade (-40C to +100C junction) and lead-free / Pb-free terminal finish.
This page synthesizes distributor pricing, drop-in same-package alternatives from the Cyclone III family, and practical FPGA design notes not found in the manufacturer datasheet.
Bộ thay thế dễ dàng lắp đặt cho EP3C16F256I7N — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EP3C16F256I7N (cùng hình factor và footprint) — khác nhau ở Package, Operating Temperature, Embedded Memory, Logic Elements, Process Technology.
EP3C16F256C8N
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
EP3C16F256C7N
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
EP3C25F256I7N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP3C10F256I7N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP3C16F256I7
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP4CE15F23I7N
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
EP3C16F256I7N Tỷ lệ tối đa & tính chất điện
| Family | Cyclone III |
| Logic Elements (LEs) | 15408 |
| Logic Array Blocks (LABs) | 963 |
| Total Memory Bits | 516096 |
| Embedded Memory | 56 M9K blocks (504 Kbit) |
| Embedded 18x18 Multipliers | 56 |
| PLLs | 4 |
| Maximum User I/O Pins | 168 |
| Hộp | 256-ball FBGA (17 mm x 17 mm, 1.0 mm pitch) |
| Nhiệt độ hoạt động | -40C to +100C (industrial, I7) |
| Supply Voltage (Core) | 1.2 V typical |
| Process Technology | TSMC 60 nm low-leakage |
| Configuration | SRAM-based, requires external config device (EPCS/EPCQ) |
| Lead-Free / Pb-Free | Yes (N suffix per JEDEC JESD97) |
| RoHS Compliance | Compliant |
Hướng dẫn cấu hình chân EP3C16F256I7N 256-ball fbga (17 mm x 17 mm, 1.0 mm pitch)
Cấu hình chân cho EP3C16F256I7N (256-ball fbga (17 mm x 17 mm, 1.0 mm pitch) gói). IC số này bao gồm chân GPIO, giao diện truyền thông (UART, SPI, I2C) và chân nguồn. Tham khảo tài liệu thông số kỹ thuật của nhà sản xuất để biết các chức năng chân thay thế và tùy chọn cấu hình. Cực kỳ quan trọng cho thiết kế hệ thống tích hợp và lập trình PCB.
Không có dữ liệu chân cụ thể sẵn có cho EP3C16F256I7N.
Tham khảo: tài liệu kỹ thuật cho cấu hình chân đầy đủ.
Ứng dụng tiêu biểu
EP3C16F256I7N phù hợp cho 7 Áp dụngs: Industrial Motor Control, Video Processing and Display Bridging, Software-Defined Radio (SDR) Baseband, Automotive Infotainment and Driver Assistance, Factory Automation and Machine Vision, Communications Infrastructure (TDM, T1/E1, Cross-Connect), Medical Imaging Front-End.
Industrial Motor Control
The EP3C16F256I7N fits industrial motor control because its 56 18x18 multipliers run field-oriented control (FOC) loops at 20 kHz PWM switching frequency with comfortable timing margin, and its 168 user I/Os drive multi-axis encoder feedback, gate-driver signals, and isolated comm channels. The 4 PLLs synthesize the system clock, PWM timer, and ADC sampling clock from a single 50 MHz crystal. Industrial-grade -40C to +100C temperature rating matches IEC 60068 environmental stress profiles for factory-floor cabinets. The 60 nm low-leakage process keeps idle power below 100 mW even with continuous operation across multiple axes.
Được đề xuất
Video Processing and Display Bridging
The EP3C16F256I7N handles SDR-to-HD upscaling, color-space conversion, and deinterlacing because its 56 dedicated 18x18 multipliers implement polyphase scalers and FIR filters at 150 MHz pixel clock rates. The LVDS and mini-LVDS I/O pairs on the 256-FBGA package drive 7:1 LVDS video interfaces to external HDMI or MIPI bridge chips without external serializers. The M9K memory blocks buffer full 1080p frames (1920x1080x16 bits = 33 Mbit) without external SDRAM for mid-resolution designs. Industrial-grade operation suits kiosks, signage, and digital signage behind-window installations.
Được đề xuất
Software-Defined Radio (SDR) Baseband
The EP3C16F256I7N suits SDR baseband processing because its 56 multipliers implement channelizing filters and FFT butterflies, while its 516 Kbit of M9K memory provides sufficient buffer for 1024-point FFT working sets. The 4 PLLs synthesize the ADC sample clock, DSP clock, and host interface clock from a single reference. Designers pair the EP3C16F256 with an external ADC and DAC plus an RF front-end IC to build low-cost 2G/3G picocell baseband, public-safety radio, or amateur-radio transceivers. Quartus II DSP Builder accelerates fixed-point filter design and verification.
Được đề xuất
Automotive Infotainment and Driver Assistance
The EP3C16F256I7N supports automotive infotainment and driver assistance because its 56 hardware multipliers implement vision pre-processing kernels (Sobel, Canny, motion estimation) at 30 to 60 fps for surround-view and lane-departure systems. The industrial-grade -40C to +100C junction temperature and lead-free finish meet automotive component requirements for cabin and engine-bay adjacent installations. The 256-FBGA package supports automotive PCB stack-ups with controlled-impedance routing for camera serializer links. Designers use the Nios II soft-core embedded inside the Cyclone III for ECU co-processing.
Được đề xuất
Factory Automation and Machine Vision
The EP3C16F256I7N handles factory machine vision because its 56 multipliers process area-scan and line-scan camera streams with edge-detection, blob-analysis, and pattern-matching kernels at 100 MHz. The 168 user I/Os connect to industrial Ethernet (EtherCAT, PROFINET) controllers, opto-isolated digital I/O, and Camera Link or GigE Vision interfaces via external PHY ICs. Industrial -40C to +100C operation and lead-free finish meet IEC 61131-2 industrial environment requirements. The M9K memory blocks store frame buffers and lookup tables for real-time inspection decisions.
Được đề xuất
Communications Infrastructure (TDM, T1/E1, Cross-Connect)
The EP3C16F256I7N fits telecom access infrastructure because its 168 user I/Os connect directly to T1/E1 framer ICs and TDM time-slot cross-connect matrices up to 8.192 Mbps. The 4 PLLs synthesize 1.544 MHz, 2.048 MHz, and 8.192 MHz backplane clocks with sub-ppm jitter via the dedicated Cyclone III PLL hardware. The M9K memory buffers DS0 time slots and HDLC frames. Industrial temperature operation meets NEBS Level 1 telecom cabinet requirements for central-office and outside-plant environments.
Được đề xuất
Medical Imaging Front-End
The EP3C16F256I7N processes ultrasound and endoscopy front-end streams because its 56 18x18 multipliers implement beamforming, envelope detection, and harmonic imaging filters at 40 MHz pulse repetition rates. The 4 PLLs synthesize the transducer burst clock, ADC sampling clock, and image-display clock from a single low-jitter reference. The industrial temperature grade and lead-free finish support medical device IEC 60601-1 environmental qualification when paired with proper isolation. Quartus II DSP Builder accelerates the fixed-point filter design and verification process for FDA submission documentation.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho EP3C16F256I7N — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | EP3C16F256C8N | EP3C16F256C7N | EP3C25F256I7N | EP3C10F256I7N | EP3C16F256I7 | EP4CE15F23I7N |
|---|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 256-ball FBGA (17x17 mm, 1.0 mm pitch) | 256-ball FBGA - same | 256-ball FBGA - same | 256-ball FBGA - same | 256-ball FBGA - same | 256-ball FBGA - same | 256-ball FBGA - same family |
| Family | Cyclone III | Cyclone III | Cyclone III | Cyclone III | Cyclone III | Cyclone III | Cyclone IV E |
| Logic Elements | 15408 | 15408 | 15408 | 24624 | 10320 | 15408 | 15408 |
| Total Memory Bits | 516096 | 516096 | 516096 | 608256 | 423936 | 516096 | 516096 |
| Multipliers (18x18) | 56 | 56 | 56 | 66 | 46 | 56 | 56 |
| PLLs | 4 | 4 | 4 | 4 | 2 | 4 | 4 |
| Maximum User I/O | 168 | 168 | 168 | 168 | 168 | 168 | 168 |
| Temperature Grade | Industrial -40C to +100C | Commercial 0C to +85C | Commercial 0C to +85C | Industrial -40C to +100C | Industrial -40C to +100C | Industrial -40C to +100C | Industrial -40C to +100C |
| Speed Grade | I7 (medium-fast) | C8 (commercial-speed) | C7 (slower) | I7 (medium-fast) | I7 (medium-fast) | I7 (medium-fast) | I7 (Cyclone IV E) |
| Lead-Free (RoHS) | Yes (N suffix) | Yes (N suffix) | Yes (N suffix) | Yes (N suffix) | Yes (N suffix) | No (non-N) | Yes (N suffix) |
Bảo phân biệt quan trọng
- Pin-compatible upgrade path to 24624 LEs in same package (vsEP3C10F256I7N (10320 LEs))
- Higher-density same-package option (vsEP3C16F256I7N vs EP3C16F256C8N)
- Lead-free RoHS-compliant variant available (vsEP3C16F256I7 (non-N, non-RoHS))
- Lowest static power in Cyclone III family (vsvs Cyclone IV E (EP4CE15F23I7N))
Ghi chú thiết kế
Estimated: the EP3C16F256I7N draws approximately 100 mA typical quiescent current from a 1.2 V VCCINT supply and up to 500 mA peak at full logic utilization with all 168 I/Os switching at 100 MHz. Provide a 4-layer PCB with a dedicated ground plane and route VCCINT with a 6-mm-wide power pour plus 10 uF + 0.1 uF + 0.01 uF decoupling per VCCINT ball cluster. Each VCCIO bank requires its own 2.2 uF + 0.1 uF decoupling pair because banks operate at independent voltages (1.2 V to 3.3 V). Use a ferrite bead on VCCA_PLL (2.5 V analog PLL supply) to isolate from digital switching noise.
Estimated: at 100% logic utilization with continuous I/O switching, junction temperature rise is approximately 15 to 25C above ambient on a 4-layer JEDEC JESD51 test board with 256-FBGA thermal pad soldered to a 4-layer thermal via array (0.3 mm pitch, 0.2 mm via diameter). For industrial installations with +85C ambient, ensure 1 square inch of unbroken top copper connected to the thermal pad through at least 16 thermal vias to the inner ground plane. The industrial I7 grade is rated to +100C junction per the Cyclone III Device Handbook reliability section, so proper thermal design is essential for long-term reliability.
Estimated: the 256-FBGA package uses 1.0 mm ball pitch and 17 mm body size; route signals on 0.1 mm traces with 0.15 mm spaces on the top layer only, and use 4-mil laser-drilled microvias with 8-mil capture pads for breakout. Reference the Cyclone III Device Handbook pin tables for bank-by-bank assignments: banks 1-4 typically contain the differential I/O and clock pins, banks 5-8 contain LVCMOS general-purpose I/O. Match all high-speed differential pairs (LVDS, mini-LVDS) to 100-ohm differential impedance with 5-mil trace-to-trace spacing within each pair.
Do NOT forget the external configuration memory - the EP3C16F256I7N is SRAM-based and requires an EPCS or EPCQ flash chip on every board; without it the device will not boot. Do NOT leave MSEL[2..0] floating - tie them to VCC or GND through 1 kohm resistors to select the Active Serial (AS) configuration mode with the EPCS chip. Do NOT route LVDS pairs across package splits - verify each LVDS pair stays within the same I/O bank by consulting the Cyclone III Device Handbook pin tables. Do NOT use the default 50 MHz TCXO without verifying jitter - the Cyclone III PLL input jitter tolerance is 1 ns peak-peak per cycle, so use an oscillator with sub-100 ps RMS jitter.
Thông tin tuân thủ
RoHS compliant per N-suffix terminal finish designation. Halogen-free per Altera/Intel material declaration. Cyclone III family is not AEC-Q100 qualified; for automotive applications above +100C junction use the Cyclone III Auto-grade variants.
