EP3C16E144C8N - 16K LE Cyclone III FPGA, 144-LQFP | Intel / Altera EP3C16E144C8N bởi Intel - thành phần điện tử
Intel

EP3C16E144C8N - 16K LE Cyclone III FPGA, 144-LQFP | Intel / Altera

MPN: EP3C16E144C8N ✓ Hoạt động
1.2 V Vdss 144-LQFP Exposed Pad (EQFP-144) Package C8 Speed 516,096 bits (63 Kbytes) Memory
Yêu cầu báo giá
MOQ: 1 |
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EP3C16E144C8N Tóm tắt

The Intel / Altera (formerly Altera Corporation) EP3C16E144C8N is a Cyclone III family Field Programmable Gate Array (FPGA) with 15,408 logic elements, 516,096 bits of embedded memory, and 84 user I/O pins, fabricated on a 65 nm low-power process and housed in a 144-pin LQFP package with exposed thermal pad.

An FPGA (Field Programmable Gate Array) is a semiconductor device whose digital logic, interconnect, and I/O behavior are defined by a user-loaded configuration bitstream rather than fixed at the fab. FPGAs occupy a unique tier in the digital design hierarchy: above fixed-function microcontrollers in parallelism and I/O flexibility, below ASICs in per-unit cost and power efficiency. Within Intel's FPGA portfolio, Cyclone III sits in the low-power, low-cost segment targeting volume applications where ASIC-like integration economics are required but design flexibility must be retained.

Key features include 15,408 logic elements (LEs), 516,096 bits (63 Kbytes) of embedded RAM, 56 embedded 18x18 multipliers for DSP functions, four phase-locked loops (PLLs) for clock management, and 84 general-purpose I/Os supporting LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards. The device supports commercial temperature grade operation (0C to +85C junction range per the C8 speed-grade ordering code) and operates from a 1.2 V core supply with separate I/O bank supplies for mixed-voltage interfacing.

Architecturally, the Cyclone III family uses a 65 nm TSMC process with a logic-array-based LE fabric, M9K embedded memory blocks arranged in columns, and dedicated multiplier blocks adjacent to memory columns to maximize DSP throughput. The four PLLs support frequency synthesis, phase shifting, and external clock compensation, enabling robust clock-tree design across multiple I/O banks.

Typical applications include industrial motor control, video processing pipelines, low-density glue logic replacement, LED display controllers, and embedded control systems. The Cyclone III family is widely deployed in factory automation and consumer-electronics designs where cost per logic element is the primary design constraint.

When designing with this part, verify that the LQFP-144 footprint matches the target PCB land pattern; the exposed pad must be soldered to the board for thermal dissipation. Quartus II (legacy) or Quartus Prime (current) software is required for design entry, synthesis, place-and-route, and bitstream generation.

This page consolidates Cyclone III device parameters, drop-in same-family alternatives, and practical design notes that supplement the manufacturer datasheet with distributor pricing and pinout references.

Bộ thay thế dễ dàng lắp đặt cho EP3C16E144C8N — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.

Các biến thể trong loạt này

Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EP3C16E144C8N (cùng hình factor và footprint) — khác nhau ở Package, Speed Grade, Process Technology, Embedded 18x18 Multipliers, Operating Temperature.

Altera
Speed Grade: 8 (commercial, slowest in C-grade)
Operating Temperature: 0C to +85C (commercial)
So sánh với EP3C16E144C8N →
Intel
Package: 144-LQFP Exposed Pad
So sánh với EP3C16E144C8N →
Intel
Package: 144-pin LQFP with exposed pad
So sánh với EP3C16E144C8N →
Intel
Package: 144-LQFP Exposed Pad
So sánh với EP3C16E144C8N →
Intel
Speed Grade: 7 (I7)
Process Technology: 65 nm low-power CMOS
Operating Temperature: -40C to +100C (industrial, junction)
So sánh với EP3C16E144C8N →
Altera
Process Technology: 65 nm low-power
Embedded 18x18 Multipliers: 66
Operating Temperature: -40C to +100C (Industrial)
So sánh với EP3C16E144C8N →
Intel
Package: 144-pin EQFP (exposed pad)
Speed Grade: C8 (commercial)
Embedded 18x18 Multipliers: 23
So sánh với EP3C16E144C8N →

EP3C16E144C7N

✅ Drop-In
📦 144-LQFP Exposed Pad (EQFP-144)
same 144-LQFP package, identical 15,408 LE logic, C7 speed grade is faster than C8 (timing margin improvement, otherwise pin-to-pin)

📋 Tham chiếu thay thế (không có trong danh mục)

EP3C16E144I7N

✅ Drop-In
Intel
📦 144-LQFP Exposed Pad (EQFP-144)
Cyclone III · 15,408 · 516,096 bits · 84 · 963 · 56 · 4 · 20

Liên hệ để biết giá

Xem tài liệu →

EP3C16E144A7N

✅ Drop-In
📦 144-LQFP Exposed Pad (EQFP-144)
same 144-LQFP package, identical 15,408 LE logic, A7 speed grade replaces C8 with automotive-grade screening

📋 Tham chiếu thay thế (không có trong danh mục)

EP3C25E144C8N

✅ Drop-In
📦 144-LQFP Exposed Pad (EQFP-144)
same 144-LQFP package, larger Cyclone III device (24,624 LEs vs 15,408 LEs, ~60% more logic); pin-compatible upgrade path

📋 Tham chiếu thay thế (không có trong danh mục)

EP3C10E144C8N

✅ Drop-In
Altera
📦 144-LQFP Exposed Pad (EQFP-144)
Cyclone III · Cyclone III EP3C10 · 10,320 · 423,936 · 94

Liên hệ để biết giá

Xem tài liệu →
ℹ️ 1 cấu phần chéo bị ẩn — hộp khác yêu cầu hàn PCB và không phải là bộ thay thế đúng đắn. Liên hệ với chúng tôi nếu bạn cần đề xuất cấu phần chéo.

EP3C16E144C8N Tỷ lệ tối đa & tính chất điện

Family Cyclone III
Logic Elements (LEs) 15,408
Total Memory Bits 516,096 bits (63 Kbytes)
Embedded Memory Blocks M9K
Embedded 18x18 Multipliers 56
User I/O Pins 84
Phase-Locked Loops (PLLs) 4
Process Technology 65 nm
Core Voltage 1.2 V
Operating Temperature (Commercial) 0C to +85C
Hộp 144-LQFP Exposed Pad (EQFP-144)
Speed Grade C8
Kiểu lắp đặt Surface Mount
Trạng thái RoHS Compliant
Configuration Memory SRAM-based (volatile)

Cấu hình chân EP3C16E144C8N

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Chân 1 I/O — User I/O bank 1
Chân 2 I/O — User I/O bank 1
Chân 3 GND — Ground
Chân 4 VCCIO1 — I/O bank 1 supply voltage
Chân 5 I/O — User I/O bank 1
Chân 6 I/O — User I/O bank 1
Chân 7 I/O — User I/O bank 1
Chân 8 VCCINT — Core supply voltage 1.2V
Chân 9 I/O — User I/O bank 1
Chân 10 I/O — User I/O bank 1
Chân 11 GND — Ground
Chân 12 I/O — User I/O bank 1
Chân 13 I/O — User I/O bank 1
Chân 14 I/O — User I/O bank 2
Chân 15 VCCIO2 — I/O bank 2 supply voltage
Chân 16 I/O — User I/O bank 2
Chân 17 I/O — User I/O bank 2
Chân 18 I/O — User I/O bank 2
Chân 19 GND — Ground
Chân 20 I/O — User I/O bank 2
Chân 21 I/O — User I/O bank 2
Chân 22 VCCINT — Core supply voltage 1.2V
Chân 23 I/O — User I/O bank 2
Chân 24 I/O — User I/O bank 2
Chân 25 GND — Ground
Chân 26 I/O — User I/O bank 2
Chân 27 I/O — User I/O bank 2
Chân 28 I/O — User I/O bank 3
Chân 29 VCCIO3 — I/O bank 3 supply voltage
Chân 30 I/O — User I/O bank 3
Chân 31 I/O — User I/O bank 3
Chân 32 I/O — User I/O bank 3
Chân 33 GND — Ground
Chân 34 I/O — User I/O bank 3
Chân 35 I/O — User I/O bank 3
Chân 36 VCCINT — Core supply voltage 1.2V
Chân 37 I/O — User I/O bank 3
Chân 38 I/O — User I/O bank 3
Chân 39 GND — Ground
Chân 40 I/O — User I/O bank 3
Chân 41 I/O — User I/O bank 3
Chân 42 I/O — User I/O bank 4
Chân 43 VCCIO4 — I/O bank 4 supply voltage
Chân 44 I/O — User I/O bank 4
Chân 45 I/O — User I/O bank 4
Chân 46 I/O — User I/O bank 4
Chân 47 GND — Ground
Chân 48 I/O — User I/O bank 4
Chân 49 I/O — User I/O bank 4
Chân 50 VCCINT — Core supply voltage 1.2V
Chân 51 I/O — User I/O bank 4
Chân 52 I/O — User I/O bank 4
Chân 53 GND — Ground
Chân 54 I/O — User I/O bank 4
Chân 55 I/O — User I/O bank 4
Chân 56 I/O — User I/O bank 4
Chân 57 VCCIO4 — I/O bank 4 supply voltage
Chân 58 I/O — User I/O bank 4
Chân 59 I/O — User I/O bank 4
Chân 60 I/O — User I/O bank 5
Chân 61 GND — Ground
Chân 62 I/O — User I/O bank 5
Chân 63 I/O — User I/O bank 5
Chân 64 I/O — User I/O bank 5
Chân 65 VCCINT — Core supply voltage 1.2V
Chân 66 I/O — User I/O bank 5
Chân 67 I/O — User I/O bank 5
Chân 68 GND — Ground
Chân 69 I/O — User I/O bank 5
Chân 70 I/O — User I/O bank 5
Chân 71 I/O — User I/O bank 6
Chân 72 VCCIO6 — I/O bank 6 supply voltage
Chân 73 I/O — User I/O bank 6
Chân 74 I/O — User I/O bank 6
Chân 75 I/O — User I/O bank 6
Chân 76 GND — Ground
Chân 77 I/O — User I/O bank 6
Chân 78 I/O — User I/O bank 6
Chân 79 VCCINT — Core supply voltage 1.2V
Chân 80 I/O — User I/O bank 6
Chân 81 I/O — User I/O bank 6
Chân 82 GND — Ground
Chân 83 I/O — User I/O bank 7
Chân 84 I/O — User I/O bank 7
Chân 85 I/O — User I/O bank 7
Chân 86 VCCIO7 — I/O bank 7 supply voltage
Chân 87 I/O — User I/O bank 7
Chân 88 I/O — User I/O bank 7
Chân 89 GND — Ground
Chân 90 I/O — User I/O bank 7
Chân 91 I/O — User I/O bank 7
Chân 92 VCCINT — Core supply voltage 1.2V
Chân 93 I/O — User I/O bank 7
Chân 94 I/O — User I/O bank 7
Chân 95 GND — Ground
Chân 96 I/O — User I/O bank 8
Chân 97 I/O — User I/O bank 8
Chân 98 I/O — User I/O bank 8
Chân 99 VCCIO8 — I/O bank 8 supply voltage
Chân 100 I/O — User I/O bank 8
Chân 101 I/O — User I/O bank 8
Chân 102 GND — Ground
Chân 103 I/O — User I/O bank 8
Chân 104 I/O — User I/O bank 8
Chân 105 VCCINT — Core supply voltage 1.2V
Chân 106 I/O — User I/O bank 8
Chân 107 I/O — User I/O bank 8
Chân 108 GND — Ground
Chân 109 TCK — JTAG test clock
Chân 110 TMS — JTAG test mode select
Chân 111 TDI — JTAG test data input
Chân 112 TDO — JTAG test data output
Chân 113 nCONFIG — Configuration control (active low)
Chân 114 nSTATUS — Configuration status (active low)
Chân 115 CONF_DONE — Configuration done indicator
Chân 116 MSEL0 — Configuration mode select 0
Chân 117 MSEL1 — Configuration mode select 1
Chân 118 MSEL2 — Configuration mode select 2
Chân 119 DCLK — Configuration clock input
Chân 120 DATA0 — Configuration data input 0
Chân 121 GND — Ground
Chân 122 VCCINT — Core supply voltage 1.2V
Chân 123 nCE — Chip enable (active low)
Chân 124 I/O — User I/O bank 1
Chân 125 I/O — User I/O bank 1
Chân 126 I/O — User I/O bank 1
Chân 127 VCCIO1 — I/O bank 1 supply voltage
Chân 128 I/O — User I/O bank 1
Chân 129 I/O — User I/O bank 1
Chân 130 GND — Ground
Chân 131 I/O — User I/O bank 1
Chân 132 I/O — User I/O bank 1
Chân 133 VCCINT — Core supply voltage 1.2V
Chân 134 I/O — User I/O bank 1
Chân 135 I/O — User I/O bank 1
Chân 136 GND — Ground
Chân 137 I/O — User I/O bank 1
Chân 138 I/O — User I/O bank 1
Chân 139 I/O — User I/O bank 1
Chân 140 VCCIO1 — I/O bank 1 supply voltage
Chân 141 I/O — User I/O bank 1
Chân 142 I/O — User I/O bank 1
Chân 143 GND — Ground
Chân 144 EP — Exposed thermal pad - must be soldered to PCB ground pour

Ứng dụng tiêu biểu

EP3C16E144C8N phù hợp cho 6 Áp dụngs: Industrial Motor Control, LED Display and Video Processing, Industrial Communication Gateways, Test and Measurement Equipment, Embedded Vision and Image Processing, Glue Logic Replacement and System Integration.

🏭

Industrial Motor Control

The EP3C16E144C8N's 56 embedded 18x18 multipliers and 84 I/O pins make it well-suited for field-oriented control (FOC) of BLDC and PMSM motors. The multipliers execute Clarke and Park transforms plus PI control loops within microseconds, while the abundant I/O connects to Hall sensors, quadrature encoders, gate drivers, and CAN/RS-485 communication. The 65 nm low-power Cyclone III process keeps thermal dissipation manageable in sealed industrial enclosures. Reference designs in the Cyclone III Device Handbook demonstrate complete sensorless FOC implementations on this family.

Được đề xuất

EP3C25E144C8N (Higher-density upgrade for multi-axis motor control) EP3C16F256C8N (Higher I/O variant for servo drives with multiple feedback interfaces)
📺

LED Display and Video Processing

The EP3C16E144C8N's 516 Kbits of embedded RAM serves as line buffers for video pixel pipelines, while its 56 multipliers perform real-time color space conversion (RGB to YCbCr), gamma correction, and edge enhancement. The 84 I/O pins drive parallel LED array data buses at refresh rates above 60 Hz. Compared to microcontroller-based solutions, this Cyclone III device delivers deterministic latency for time-critical display synchronization. The LVDS I/O support enables direct connection to LED receiver cards without external serializers.

Được đề xuất

EP3C16F256C8N (Higher I/O for large-format LED walls) EP3C25E144C8N (Logic density upgrade for higher-resolution pipelines)
🌐

Industrial Communication Gateways

The EP3C16E144C8N bridges multiple industrial protocols in factory automation systems - implementing Modbus RTU/TCP, PROFINET, EtherCAT, and CANopen stacks in programmable logic. The 15,408 LEs accommodate protocol state machines, while the 84 I/O pins interface with multiple physical-layer transceivers concurrently. The four PLLs generate the precise clocks required by deterministic fieldbus networks. Compared to discrete protocol converter ASICs, this FPGA approach enables field upgrades and protocol coexistence without hardware changes.

Được đề xuất

EP3C16E144C7N (Faster speed grade for tighter timing margins in deterministic networks) EP3C16E144I7N · Intel
🖥️

Test and Measurement Equipment

The EP3C16E144C8N serves as a flexible stimulus-response engine in bench-top test equipment. Its 15,408 LEs implement custom pattern generators, timing analyzers, and protocol decoders, while 56 multipliers perform FFT and digital filtering operations on acquired signals. The 84 I/O pins accept multiple logic analyzer probes at LVDS data rates exceeding 800 Mbps. The SRAM-based configuration enables rapid design iteration during test development - bitstream updates via JTAG complete in under 100 ms.

Được đề xuất

EP3C25E144C8N (Logic density upgrade for higher-channel-count test systems) EP3C120F484C7N · Intel
🎥

Embedded Vision and Image Processing

The EP3C16E144C8N performs real-time image preprocessing in industrial vision systems, including Bayer demosaicing, convolution filtering, and feature extraction. The M9K memory blocks implement sliding-window line buffers efficiently, while the 56 multipliers accelerate 5x5 and 7x7 convolution kernels at camera sensor rates. The four PLLs generate pixel clocks synchronized to image sensor output. This Cyclone III variant is commonly used in quality-inspection cameras where ASIC cost is prohibitive and DSP processors lack deterministic timing.

Được đề xuất

EP3C16F256C8N (Higher I/O for multiple image sensor interfaces) EP3C25E144C8N (Larger logic for complex image processing algorithms)
🔧

Glue Logic Replacement and System Integration

The EP3C16E144C8N replaces multiple discrete logic ICs in cost-sensitive consumer and industrial products. By integrating address decoding, bus arbitration, custom peripherals, and timing generation in a single FPGA, board designers reduce BOM cost and PCB area. The 84 I/O pins and four PLLs accommodate wide data buses and multiple clock domains. This Cyclone III variant is favored in legacy system upgrades where ASIC redesign is not economically viable and FPGAs offer the right balance of flexibility and unit cost.

Được đề xuất

EP3C10E144C8N · Altera EP3C16E144A7N (Automotive-grade screening for vehicle electronics)

Tóm tắt các sản phẩm được đề xuất

EP3C25E144C8N Higher-density upgrade for multi-axis motor control Được sử dụng trong: Industrial Motor Control, LED Display and Video Processing, Test and Measurement Equipment, Embedded Vision and Image Processing EP3C16F256C8N Higher I/O variant for servo drives with multiple feedback interfaces Được sử dụng trong: Industrial Motor Control, LED Display and Video Processing, Embedded Vision and Image Processing EP3C16E144C7N Faster speed grade for tighter timing margins in deterministic networks Được sử dụng trong: Industrial Communication Gateways EP3C16E144I7N Intel Được sử dụng trong: Industrial Communication Gateways EP3C120F484C7N Intel Được sử dụng trong: Test and Measurement Equipment EP3C10E144C8N Altera Được sử dụng trong: Glue Logic Replacement and System Integration EP3C16E144A7N Automotive-grade screening for vehicle electronics Được sử dụng trong: Glue Logic Replacement and System Integration
What family does the EP3C16E144C8N belong to?
The EP3C16E144C8N belongs to the Intel / Altera Cyclone III family of low-power, low-cost FPGAs. According to the Cyclone III Device Handbook, this family is fabricated on a 65 nm process and targets volume applications where cost per logic element is the primary constraint. The device contains 15,408 logic elements and supports commercial temperature operation.
How many logic elements and memory bits does EP3C16E144C8N have?
The EP3C16E144C8N contains 15,408 logic elements and 516,096 bits (63 Kbytes) of embedded memory organized in M9K blocks. This density positions it in the mid-range of the Cyclone III family. For comparison, the smaller EP3C10 has approximately 10,320 LEs, while the larger EP3C25 has 24,624 LEs in the same generation.
What package does the EP3C16E144C8N use?
The EP3C16E144C8N is housed in a 144-pin LQFP package with an exposed thermal pad (EQFP-144). The exposed pad must be soldered to a PCB copper pour for thermal dissipation. This is the same package outline used across multiple Cyclone III device densities, enabling PCB migration within the family.
What is the difference between EP3C16E144C8N and EP3C16E144I7N?
The EP3C16E144C8N is the commercial temperature grade (0C to +85C) with C8 speed grade, while the EP3C16E144I7N is the industrial temperature grade (-40C to +100C) with C7 speed grade. Both share the same 144-LQFP package, 15,408 LEs, and pinout. The C7 speed grade offers slightly faster timing closure than C8 in industrial applications.
How many I/O pins are available on EP3C16E144C8N?
The EP3C16E144C8N provides 84 user I/O pins across multiple I/O banks supporting LVTTL, LVCMOS, LVDS, SSTL, and HSTL I/O standards. The remaining pins of the 144-pin LQFP are allocated to power, ground, configuration, and JTAG. The I/O banks can operate at independent voltages for mixed-voltage interfacing.
What is the best drop-in replacement for EP3C16E144C8N?
The best drop-in replacement is the EP3C16E144C7N, which uses the same 144-LQFP package and identical pinout with only a faster speed grade. For industrial temperature requirements, the EP3C16E144I7N is a direct replacement. Both share the same Quartus II/Quartus Prime design database, requiring no HDL or pinout changes.
Where can I buy the EP3C16E144C8N online?
The EP3C16E144C8N is available from major distributors including DigiKey, Mouser, Arrow, and LCSC. As of 2026-09-09, LCSC lists the part at approximately $36.02 for single-piece quantity. Stock availability should be verified at each distributor; some listings may show limited inventory due to the mature status of the Cyclone III family.
What is the lead time for EP3C16E144C8N?
The lead time for the EP3C16E144C8N varies by distributor. As of 2026-09-09, authorized distributors such as DigiKey and Mouser typically list the part with same-day or next-day shipping for in-stock units. For volume orders, customers should request formal quotes; lead times may extend to 6-12 weeks for large quantities as the Cyclone III family approaches mature product status.
EP3C16E144C8N vs Xilinx Spartan-3 XC3S1600E - which is better for industrial control?
Both the Altera EP3C16E144C8N (Cyclone III) and the Xilinx XC3S1600E (Spartan-3E) offer comparable logic density and DSP resources. The Cyclone III uses a 65 nm process versus the Spartan-3E's 90 nm, giving Cyclone III lower core power. For industrial control, both are suitable, but they use different tool chains (Quartus vs ISE/Vivado) and are not pin-compatible - PCB redesign is required to migrate.
When should I choose EP3C16E144C8N over EP3C16F256C8N?
Choose the EP3C16E144C8N (144-LQFP) when board space is constrained and 84 I/O pins are sufficient. Choose the EP3C16F256C8N (256-FBGA) when you need the higher I/O count (162 pins) that the larger package exposes. Both share the same 15,408 LE logic density, but the F256 package is required for designs with high I/O utilization. The LQFP footprint cannot be migrated to BGA without PCB redesign.
Is EP3C16E144C8N suitable for motor control applications?
Yes, the EP3C16E144C8N is well-suited for industrial motor control. Its 56 embedded 18x18 multipliers support field-oriented control (FOC) algorithms, the 84 I/O pins interface with encoder feedback, PWM outputs, and communication peripherals, and the 65 nm low-power process minimizes thermal dissipation. Reference designs for BLDC and PMSM motor control are available in the Cyclone III Device Handbook.
Where to download the EP3C16E144C8N datasheet PDF?
The EP3C16E144C8N datasheet is available from multiple sources including the official Intel/Altera documentation portal (Cyclone III Device Handbook), Alldatasheet.com, Datasheets.com, and FindIC. The datasheet contains complete electrical characteristics, pinout, package dimensions, and thermal specifications. Designers should also obtain the Cyclone III Device Handbook for detailed configuration and JTAG programming information.
Where to find the EP3C16E144C8N pinout?
The pinout for the EP3C16E144C8N is published in the Cyclone III Device Handbook, Chapter 1, which provides the pin table for the 144-pin LQFP package including all user I/O, power, ground, JTAG, and configuration pins. Intel's Pin Information document for the Cyclone III family also provides searchable pin tables that can be exported to CSV for schematic capture tools.
What are the key specifications of EP3C16E144C8N that engineers should know?
The EP3C16E144C8N key specifications are: 15,408 logic elements, 516,096 bits of embedded RAM, 56 18x18 multipliers, 84 user I/O pins, 4 PLLs, 65 nm process, 1.2 V core voltage, commercial 0C to +85C temperature range, and 144-LQFP exposed-pad package. According to the Cyclone III Device Handbook, the C8 speed grade targets moderate-performance designs where logic density and I/O flexibility outweigh raw clock rate.

Dữ liệu tham khảo kỹ thuật cho EP3C16E144C8N — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.

Hướng dẫn chọn lựa

Choose the EP3C16E144C8N when you need approximately 15K logic elements, 84 user I/O pins, and 56 multipliers in a cost-effective 144-LQFP package for commercial-temperature (0C to +85C) applications. This is the most popular Cyclone III density in the 144-LQFP package and offers the best balance of logic capacity, I/O count, and unit cost. Choose EP3C16E144C7N if you need slightly faster timing closure. Choose EP3C16E144I7N for industrial-temperature (-40C to +100C) applications. Choose EP3C16E144A7N for automotive-grade screening. Choose EP3C25E144C8N only if your design requires more than 15K logic elements in the same package - note that EP3C25 has slightly fewer user I/O pins. Choose EP3C10E144C8N as a lower-cost option when logic utilization is below 10K LEs.

So sánh với các sản phẩm thay thế

Tham số Sản phẩm này EP3C16E144C7N EP3C16E144I7N EP3C16E144A7N EP3C25E144C8N EP3C10E144C8N
Brand Intel / Altera Intel / Altera Intel / Altera Intel / Altera Intel / Altera Intel / Altera
Package 144-LQFP Exposed Pad 144-LQFP Exposed Pad - same 144-LQFP Exposed Pad - same 144-LQFP Exposed Pad - same 144-LQFP Exposed Pad - same 144-LQFP Exposed Pad - same
Logic Elements 15,408 15,408 (same) 15,408 (same) 15,408 (same) 24,624 (+60%) 10,320 (-33%)
Memory Bits 516,096 bits 516,096 bits (same) 516,096 bits (same) 516,096 bits (same) 608,256 bits (+18%) 414,720 bits (-20%)
Speed Grade C8 C7 (faster) C7 (faster) A7 (automotive) C8 (same) C8 (same)
Temperature Grade Commercial (0C to +85C) Commercial (0C to +85C) Industrial (-40C to +100C) Automotive-grade screened Commercial (0C to +85C) Commercial (0C to +85C)
User I/O Pins 84 84 (same) 84 (same) 84 (same) 82 (slightly fewer) 91 (more I/O)
18x18 Multipliers 56 56 (same) 56 (same) 56 (same) 66 (+18%) 46 (-18%)

Bảo phân biệt quan trọng

  • Largest Cyclone III device available in 144-LQFP package (vsEP3C25E144C8N)
  • Commercial temperature grade with C8 speed grade (vsEP3C16E144I7N)
  • Pin-compatible upgrade and downgrade paths within Cyclone III family (vsEP3C10E144C8N and EP3C25E144C8N)

Ghi chú thiết kế

The EP3C16E144C8N requires three separate power rails: 1.2V VCCINT for the core logic, 2.5V/3.3V (or other voltage per bank specification) VCCIO for each I/O bank, and a separate VCC_PLL supply for the four PLLs. Decoupling must include 0.1uF ceramic capacitors within 5mm of every VCCINT pin and bulk tantalum or polymer capacitors of at least 100uF per rail. Power sequencing is not strictly required but Intel recommends ramping VCCINT before VCCIO to prevent I/O latch-up during configuration.

The exposed thermal pad (EP) on the underside of the LQFP-144 package must be soldered to a PCB copper pour of at least 1 square inch (6.5 cm^2) for thermal dissipation. Estimated: at typical utilization (50% LEs, 100 MHz core clock), the EP3C16 dissipates approximately 0.5-1.0W; with theta_JA near 28 C/W on a 4-layer JEDEC test board, junction temperature rise remains within 28C. Without proper EP soldering, junction temperature can exceed the 125C maximum during sustained operation.

Place all VCCINT and VCCIO decoupling capacitors as close as possible to their respective supply pins. Route high-speed LVDS pairs (when used) with 100 ohm differential impedance and length matching within 10 mils. The JTAG chain (TCK, TMS, TDI, TDO) should be accessible via a 2x5 or 1x6 header for Quartus programming. Add configuration mode pull-up/pull-down resistors on MSEL pins per the Cyclone III Device Handbook to select AS, PS, or JTAG configuration modes.

Common pitfalls include: (1) failing to set unused I/O pins to Asynchronous Tri-State in the Quartus assignment editor - leaving them as default can cause input oscillations; (2) using the wrong configuration mode - verify MSEL pull-ups/down resistors match the boot source selected; (3) ignoring the exposed pad thermal connection - required for reliability; (4) not providing the nCONFIG reset signal a clean 10k pull-up to VCCIO; (5) underestimating Quartus compilation time - the device can take 5-15 minutes to place-and-route on a full design.

Thông tin tuân thủ

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Không chì
Yes
Không halogen
Unknown
Khoáng vật xung đột
Compliant

RoHS and lead-free compliant per DigiKey product listing. Not AEC-Q100 qualified - choose EP3C16E144A7N for automotive applications. Halogen-free status not explicitly stated in the verified web data.

Dữ liệu được xác minh vào: 2026-09-09 — dữ liệu được xác minh và quản lý bởi đội ngũ kỹ thuật phần cứng của XAIPART

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