Intel

EP3SE260F1152C2N - Stratix III E FPGA, 255K LE, 1152-FCBGA | Intel

MPN: EP3SE260F1152C2N ✗ Cuối đời

1.1 V Vdss 1152-BBGA, FCBGA Package 600 MHz Speed 16672768 Memory

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MOQ: 1 |

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EP3SE260F1152C2N Tóm tắt

The Intel EP3SE260F1152C2N is a high-density Stratix® III E Field Programmable Gate Array (FPGA) delivering 255,000 logic elements and 10,200 LABs/CLBs in a 1152-pin FCBGA package, fabricated on a 65 nm process node with 1.1 V core supply. It provides 744 maximum user I/Os and 16,672,768 bits of embedded memory, targeting high-throughput digital signal processing, telecommunications backplanes, and ASIC prototyping.

An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs/LABs), programmable interconnects, and dedicated silicon resources such as block RAM, DSP blocks, and high-speed transceivers. FPGAs occupy the programmable-logic tier of the broader integrated-circuit hierarchy: IC > digital IC > programmable logic > FPGA. Unlike ASICs, FPGAs are reconfigurable in the field via SRAM-based configuration cells, allowing rapid design iteration and post-deployment upgrades without respinning silicon.

Key features of the EP3SE260F1152C2N include up to 600 MHz core fabric performance, sixteen global clock networks, and Stratix III E-series enhanced DSP blocks that support high-precision multiply-accumulate operations. The device integrates high-speed serial transceivers supporting multi-gigabit serial protocols and dedicated external memory interfaces supporting DDR/DDR2/QDRII+ SRAM. A rich mixture of PLL resources and high-performance I/O standards (LVDS, HSTL, SSTL) suits parallel high-bandwidth chip-to-chip links.

Architecturally, the Stratix III E family combines adaptive logic modules (ALMs) with 8-input fracturable look-up tables, distributed MLAB memory, and dedicated DSP slices that each support 9-bit, 18-bit, and 36-bit arithmetic. The 65 nm process and 1.1 V core voltage deliver a favorable performance-per-watt ratio versus the prior Stratix II generation, while the high pin-count package supports wide parallel buses and multiple transceiver channels.

Typical applications include high-end wireless baseband processing, video broadcast infrastructure, military radar prototyping, high-speed networking ASIC prototyping, and medical imaging accelerators. Designers select this part when their design requires >250K logic elements, hundreds of I/Os, and abundant DSP throughput.

When designing with the EP3SE260F1152C2N, ensure the PCB provides a sufficient copper area and via array under the FCBGA to manage thermal dissipation, and follow Intel's pinout guidelines for power-decoupling and transceiver reference-clock routing.

This page consolidates distributor stock, price tiers, drop-in Stratix III E siblings, and design guidance not found in a single manufacturer document, giving procurement and design teams a single decision-ready reference.

Bộ thay thế dễ dàng lắp đặt cho EP3SE260F1152C2N — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.

Các biến thể trong loạt này

Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EP3SE260F1152C2N (cùng hình factor và footprint) — khác nhau ở Package, Speed Grade, Operating Temperature, Process Technology, Series.

EP3SE110F1152C2N

Altera

Package: 1152-ball FC-FBGA (35x35 mm)

Speed Grade: C2

Operating Temperature: 0 °C to +85 °C (Commercial)