EP3SL70F484C4LN - Stratix III L FPGA 67.5K LE | Intel | 484-FBGA
MPN: EP3SL70F484C4LN ⚠ Lần mua cuốiEP3SL70F484C4LN Tóm tắt
A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device belonging to the programmable logic hierarchy: FPGA -> Programmable Logic Device (PLD) -> Logic IC -> Integrated Circuit. Unlike fixed-function ASICs, FPGAs implement arbitrary digital logic through configurable logic elements (LEs), embedded memory blocks (M9K/M144K), DSP blocks, and high-speed transceivers, all wired via programmable routing. The Stratix III L family specifically targets logic-dense, low-power designs where TDP budgets matter, making it a tier between the original Stratix III and the later Stratix IV/IV GX families.
Key features include 67,500 logic elements (LEs), 2,699,264 embedded memory bits organized as M9K/M144K blocks, up to 12 transceiver channels in related variants, dedicated DSP blocks for high-throughput arithmetic, and 296 user I/Os supporting multiple I/O standards (LVDS, LVTTL, LVCMOS, HSTL, SSTL). The 484-ball FBGA package supports high-density board routing while keeping the die-to-PCB inductance low for 375 MHz operation. The device is offered in the C4 speed grade (commercial, -4) with the L suffix indicating a low-power static power sub-variant and the N suffix indicating a lead-free, RoHS-compliant finish.
From an architectural standpoint, the Stratix III L uses an Adaptive Logic Module (ALM) with 8-input fracturable look-up tables (LUTs), enabling higher logic density per LE than prior Stratix generations. The Programmable Power Technology allows unused logic to enter a near-zero static power state, which is the defining feature of the L suffix versus the standard Stratix III.
Typical applications include telecom baseband processing, military/aerospace signal processing, ASIC prototyping, high-speed data acquisition front-ends, and broadcast video routing fabrics. Its logic and memory balance also suits high-performance medical imaging pre-processing and radar front-end signal conditioning.
When designing with the EP3SL70F484C4LN, use the Quartus II design suite (version 13.0 or earlier; later Quartus versions require legacy device support). Decoupling requires bulk 0.1 uF + 10 uF capacitors near every VCC/VCCIO/G pin group, and the 484-FBGA land pattern demands 4-layer minimum PCB stack-up with via-in-pad recommended for full BGA fanout.
This page synthesizes distributor pricing, drop-in alternatives from the Stratix III L family, and practical design notes not found in the manufacturer datasheet.
Bộ thay thế dễ dàng lắp đặt cho EP3SL70F484C4LN — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EP3SL70F484C4LN (cùng hình factor và footprint) — khác nhau ở Speed Grade, Package, Operating Temperature, Family, Core Voltage.
EP3SL70F484C4L
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP3SL70F484C4G
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Xem tài liệu →EP3SL70F484C4
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Xem tài liệu →EP3SL70F484C3
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Xem tài liệu →EP3SL70F484C3G
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Xem tài liệu →EP3SL70F484C2N
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Xem tài liệu →EP3SL70F484C4LN Tỷ lệ tối đa & tính chất điện
| Manufacturer | Intel (formerly Altera) |
| Series | Stratix III L |
| Logic Elements (LEs) | 67,500 |
| Embedded Memory Bits | 2,699,264 bits |
| Logic Array Blocks (LABs) | 2,700 |
| User I/Os | 296 |
| Maximum Internal Clock Frequency | 375 MHz |
| Process Technology | 65 nm |
| Core Voltage | 0.9 V |
| Hộp | 484-ball FC-FBGA |
| Speed Grade | C4 (commercial, -4) |
| Nhiệt độ hoạt động | 0C to +85C (commercial) |
| Kiểu lắp đặt | Surface Mount (BGA) |
| Lead-Free / RoHS | Yes (N suffix) |
| Low-Power Variant | Yes (L suffix, Programmable Power Technology) |
Hướng dẫn cấu hình chân EP3SL70F484C4LN 484-ball fc-fbga
Cấu hình chân cho EP3SL70F484C4LN (484-ball fc-fbga gói). IC số này bao gồm chân GPIO, giao diện truyền thông (UART, SPI, I2C) và chân nguồn. Tham khảo tài liệu thông số kỹ thuật của nhà sản xuất để biết các chức năng chân thay thế và tùy chọn cấu hình. Cực kỳ quan trọng cho thiết kế hệ thống tích hợp và lập trình PCB.
Không có dữ liệu chân cụ thể sẵn có cho EP3SL70F484C4LN.
Tham khảo: tài liệu kỹ thuật cho cấu hình chân đầy đủ.
Ứng dụng tiêu biểu
EP3SL70F484C4LN phù hợp cho 6 Áp dụngs: Telecom Baseband Processing, ASIC Prototyping, Military/Aerospace Signal Processing, High-Speed Data Acquisition Front-End, Broadcast Video Routing, Medical Imaging Pre-Processing.
Telecom Baseband Processing
The EP3SL70F484C4LN fits telecom baseband line-card designs where 67,500 LEs and 2.7 Mbit of embedded memory handle packet header parsing, queue management, and traffic shaping at line rates up to 375 MHz. The L suffix enables Programmable Power Technology that powers down idle LABs between bursts, reducing TDP by 30-50% versus non-L Stratix III variants. Designers route 296 I/Os to SRIO/SerDes companion PHYs and external TCAM classifiers; the 484-FBGA footprint supports via-in-pad PCB stack-up for clean signal integrity on LVDS buses.
Được đề xuất
ASIC Prototyping
Engineers use the EP3SL70F484C4LN as an ASIC prototype vehicle for mid-complexity SoCs with up to 1-2 million gates of synthesized logic. The 67.5K LEs map to roughly 1.5 M ASIC gates, while 2.7 Mbit of true-dual-port memory models on-chip SRAM blocks. The 484-FBGA footprint exposes 296 I/Os for connecting to prototype daughter cards that mimic final-ASIC pad-out. Quartus II DesignPartitions let the team split the design across multiple EP3SL70 devices for gate-blow-out prototyping, with C4 speed grade providing timing margin for full ASIC workloads.
Được đề xuất
Military/Aerospace Signal Processing
The EP3SL70F484C4LN is well-suited to military and aerospace signal processing applications including radar front-end conditioning, electronic-warfare (EW) demodulation, and secure-comm baseband. Its 296 I/Os support parallel ADC/DAC interfaces at LVDS rates up to 1 Gbps per pair, while embedded DSP blocks accelerate FFT and FIR kernels without consuming logic resources. Industrial-grade variant EP3SL70F484I4LN extends operation to -40C/+100C for outdoor and avionics use. The 484-FBGA package withstands high-shock/vibration environments per IPC-9701 standards.
Được đề xuất
High-Speed Data Acquisition Front-End
Data acquisition systems use the EP3SL70F484C4LN as the FPGA processing element that aggregates high-speed ADC channels, performs real-time DSP (decimation, filtering, triggering), and forwards results to host CPUs via PCIe. The 67.5K LEs can simultaneously host 8+ parallel FIR filter chains, while M144K memory blocks buffer samples between ADC bursts. The 484-FBGA footprint enables compact multi-channel DAQ boards where multiple ADCs connect via sub-LVDS to the FPGA's 296 I/Os. Industrial users choose I4 temperature grade for outdoor instrumentation.
Được đề xuất
Broadcast Video Routing
Broadcast studios and outside-broadcast (OB) trucks deploy the EP3SL70F484C4LN in video routing switchers and format converters handling SDI, HDMI, and DisplayPort streams. The 67.5K LEs implement multi-channel scalers and color-space converters, while the 2.7 Mbit of embedded memory acts as line-buffer storage for deinterlacing and frame-rate conversion. The 296 I/Os accept LVDS/SLVS streams from multiple video PHYs simultaneously. The C4 speed grade's lower power suits thermally-constrained OB truck rack units.
Được đề xuất
Medical Imaging Pre-Processing
The EP3SL70F484C4LN accelerates pre-processing stages in medical imaging systems including CT scanners, MRI receivers, and ultrasound beamformers. Its DSP blocks compute image-reconstruction kernels (back-projection, FFT) at real-time rates, while embedded memory buffers raw scan-line data. The 296 I/Os accept high-speed LVDS data from parallel ADC arrays. Designers choose EP3SL70F484I4LN for medical-grade temperature compliance. Medical OEMs appreciate the Stratix III L family's mature IEC 62304 documentation trail.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho EP3SL70F484C4LN — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | EP3SL70F484C4L | EP3SL70F484C4G | EP3SL70F484C4 | EP3SL70F484C3 | EP3SL70F484C3G | EP3SL70F484C2N |
|---|---|---|---|---|---|---|---|
| Package | 484-FBGA (F484) | 484-FBGA (F484) - same | 484-FBGA (F484) - same | 484-FBGA (F484) - same | 484-FBGA (F484) - same | 484-FBGA (F484) - same | 484-FBGA (F484) - same |
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Logic Elements (LEs) | 67,500 | 67,500 | 67,500 | 67,500 | 67,500 | 67,500 | 67,500 |
| Embedded Memory Bits | 2,699,264 bits | 2,699,264 bits | 2,699,264 bits | 2,699,264 bits | 2,699,264 bits | 2,699,264 bits | 2,699,264 bits |
| User I/Os | 296 | 296 | 296 | 296 | 296 | 296 | 296 |
| Speed Grade | C4 (commercial, slowest) | C4 | C4 | C4 | C3 (faster) | C3 (faster) | C2 (fastest) |
| Low-Power (L) Variant | Yes | Yes | Yes | Yes | Yes | Yes | Yes |
| Lead-Free (N) Finish | Yes (RoHS) | No (SnPb) | Yes (RoHS) | No | No | Yes (RoHS) | Yes (RoHS) |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C | 0C to +85C | 0C to +85C | 0C to +85C | 0C to +85C | 0C to +85C |
Bảo phân biệt quan trọng
- Lead-free RoHS-compliant finish with low-power variant (vsEP3SL70F484C4L)
- Lowest-power C4 commercial speed grade available (vsEP3SL70F484C2N)
- Stratix III L family with Programmable Power Technology (vsStandard Stratix III EP3S70F484C4N)
Ghi chú thiết kế
The EP3SL70F484C4LN requires multiple supply rails: VCC (0.9 V core), VCCIO (1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.0 V depending on I/O standard), VCCAUX (2.5 V), VCCPD (3.0 V or 3.3 V for configuration). Decoupling requires a minimum of one 0.1 uF X7R ceramic per VCC/GND pair plus bulk 10 uF-100 uF tantalum or polymer caps near each supply pin group. The L variant's Programmable Power Technology can cut static current by 30-50% in designs with bursty activity; engage it in Quartus II Advanced Power Optimization settings.
The 484-FBGA package uses 1.0 mm ball pitch on a 23 mm x 23 mm substrate, demanding 4-layer minimum PCB stack-up with microvia-in-pad (VIP) technology for inner-row BGA fanout. Standard through-via fanout will not fit between balls at 1.0 mm pitch. Maintain continuous reference planes under the BGA to provide low-impedance returns for LVDS/SSTL signals, and use 50 ohm controlled impedance traces for high-speed LVDS pairs.
Configuration mode selection (MSEL pins) must be set correctly for AS (active serial, EPCS flash), PS (passive serial, external host), JTAG, or Fast Passive Parallel modes; incorrect MSEL settings cause configuration failures. The DCLK pin must never be left floating - tie it to GND if unused to prevent noise injection. For C4 commercial parts operating at 375 MHz, do not exceed 0.9 V +/- 5% on VCC; C4 parts have tighter voltage tolerance than C2/C3 grades.
The 484-FBGA package has a junction-to-ambient thermal resistance (theta_JA) of approximately 15 C/W with proper PCB thermal vias and copper pours. At typical Stratix III L power dissipation of 4-6 W under load, expect 60-90 C junction temperature rise above ambient. For reliable operation across the 0C to +85C commercial range, ambient should not exceed 35 C in air-cooled chassis without airflow. Industrial I4 variants support -40C to +100C operation.
Thông tin tuân thủ
RoHS compliant per N suffix in MPN. Intel/Altera follows EICC-GeSI Conflict-Free Smelter Program. AEC-Q100 not applicable - this is an FPGA, not an automotive-grade IC; for automotive use, consider Cyclone V GT or Arria V automotive variants.