EP3SL70F780I3 - 67.5K Logic Elements Stratix III L FPGA | Intel
MPN： EP3SL70F780I3 ⚠ 最後購買機會EP3SL70F780I3 概覽
An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard-IP blocks such as transceivers, memory controllers, and DSP slices. FPGAs sit in the wider taxonomy as programmable logic devices under the umbrella of digital logic ICs, between ASICs (fixed function, high NRE) and microcontrollers (software-defined, lower throughput). Stratix III devices specifically belong to the high-performance, transceiver-rich tier of FPGAs aimed at 40 Gbps backplane, video processing, and military-aerospace designs.
Key features of the EP3SL70F780I3 include 488 user I/O pins supporting multiple I/O standards (LVDS, LVTTL, LVCMOS, SSTL, HSTL, PCI Express), dedicated on-chip memory blocks totaling approximately 2.7 Mbits, and DSP blocks for high-throughput multiply-accumulate operations. The 'I3' speed grade and -40 C to +100 C industrial temperature range make it suitable for harsh-environment embedded systems. It also supports configuration via JTAG (IEEE Std 1149.1) and passive/active serial modes.
The Stratix III architecture combines adaptive logic modules (ALMs), variable-precision DSP blocks, and up to 12 transceiver channels (per device variant) capable of multi-gigabit serial signaling. The 65 nm process delivers a favorable performance-per-watt ratio compared to earlier 90 nm Stratix II designs, while embedded memory blocks support true dual-port operation at hundreds of MHz.
Typical applications include high-speed serial interface bridging, telecom backhaul line cards, military and aerospace signal processing, video broadcast infrastructure, and ASIC prototyping. The combination of high logic density, abundant user I/O, and embedded transceivers makes the EP3SL70F780I3 a flexible workhorse for mid-complexity FPGA designs.
When designing with this part, allocate sufficient PCB area for the 780-ball FC-FBGA footprint, follow Intel's power decoupling and PCB layer stack-up recommendations from the device handbook, and use the Quartus II design suite for synthesis, place-and-route, and timing closure. Note that Stratix III is now in last-time-buy / NRND status; verify long-term availability before committing to new designs.
直接替換替代品，適用於 EP3SL70F780I3 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP3SL70F780I3 （相同外形與佔位） — 差異在於 Package, Speed Grade, RoHS Status, Process Technology, Operating Temperature.
EP3SL70F780I4N
✅ 直接替換聯絡詢價
查看資料表 →EP3SL70F780I4
✅ 直接替換聯絡詢價
查看資料表 →EP3SL70F780C4N
✅ 直接替換聯絡詢價
查看資料表 →EP3SL70F780C4LN
✅ 直接替換聯絡詢價
查看資料表 →EP3SL70F780C3N
✅ 直接替換聯絡詢價
查看資料表 →EP3SL70F780C2N
✅ 直接替換聯絡詢價
查看資料表 →EP3SL70F780I3 最大額定值與電氣特性
| Family | Stratix III L |
| Logic Elements | 67,500 |
| Embedded Memory Bits | 2,699,264 bits |
| Maximum User I/O | 488 |
| 工作溫度 | -40 C to +100 C (Industrial) |
| Speed Grade | I3 (industrial) |
| Core Voltage | 1.1 V |
| Process Node | 65 nm |
| 封裝 | 780-ball FineLine BGA (FC-FBGA), 28x28 mm |
| Package Code | BGA780,28X28,40 |
| 安裝類型 | Surface Mount |
| Configuration Mode | JTAG IEEE 1149.1, Passive Serial, Active Serial |
| Number of Terminals | 780 |
| Supplier Device Package | 780-BBGA, FCBGA |
EP3SL70F780I3 780-bbga, fcbga 腳位配置指南
EP3SL70F780I3（780-bbga, fcbga 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP3SL70F780I3.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP3SL70F780I3 適用於 6 應用s: Telecom Backhaul Line Card, Military & Aerospace Signal Processing, Video Broadcast Infrastructure, ASIC Prototyping, Industrial Automation Controller, Test & Measurement Instrumentation.
Telecom Backhaul Line Card
The EP3SL70F780I3's 67,500 logic elements and 2.7 Mbits of embedded memory make it a strong fit for telecom backhaul line cards that need high-throughput packet processing, QoS scheduling, and SERDES bridging between framer ICs and network processors. Its 488 user I/O pins easily handle parallel data buses plus LVDS sidebands, while the industrial -40C to +100C range supports outdoor cabinet deployments. Compared to ASIC alternatives the FPGA offers reprogrammable logic for protocol updates such as OTN or CPRI without respin.
推薦
Military & Aerospace Signal Processing
The EP3SL70F780I3 in industrial temperature grade I3 is qualified for military and aerospace signal-processing applications such as radar front-end digitization, electronic warfare subsystems, and secure communications. Its 65 nm low-power process, embedded DSP blocks, and large I/O count support multi-channel ADC interfacing and real-time FFT pipelines. The 780-ball FC-FBGA package withstands shock and vibration when properly underfilled, and the Stratix III family has a long heritage in defense programs.
推薦
Video Broadcast Infrastructure
Broadcast video routers, multi-viewers, and SDI-to-IP gateways benefit from the EP3SL70F780I3's abundant logic and 488 user I/O for bridging HDMI/SDI/DisplayPort interfaces with on-board video processing. The 2.7 Mbits of embedded memory buffer line-rate video streams, while DSP blocks accelerate chroma upsampling and scaling operations. Industrial temperature rating allows chassis mounted in air-conditioned but warm equipment rooms, and Quartus II IP libraries provide ready-made SDI/HDMI reference designs.
推薦
ASIC Prototyping
Engineers prototyping ASIC designs of moderate complexity (roughly 60-100K ASIC gates) use the EP3SL70F780I3 to validate RTL, run real-world software stacks, and benchmark performance before taping out. The 67.5K logic elements and 2.7 Mbits of block RAM map comfortably to many mid-complexity SoCs, and Quartus II's TimeQuest timing analyzer provides ASIC-quality static timing reports. Industrial temperature and high I/O count also let prototypes run in target environments with real peripherals.
推薦
Industrial Automation Controller
Industrial automation controllers using the EP3SL70F780I3 benefit from 488 user I/O to interface with parallel sensor arrays, motor-control peripherals, and multi-axis servo loops simultaneously. The industrial -40C to +100C temperature range supports factory-floor cabinets and outdoor installations, while the 1.1 V core and 65 nm process keep power consumption manageable for fanless enclosures. Embedded DSP blocks accelerate PID and field-oriented control math for high-performance motion control.
推薦
Test & Measurement Instrumentation
The EP3SL70F780I3 doubles as a flexible processing engine inside high-end test and measurement equipment such as protocol analyzers, BERT testers, and oscilloscope acquisition back-ends. Its 488 user I/O accommodate parallel ADC/DAC interfaces and trigger fan-out, while 2.7 Mbits of block RAM capture deep snapshots at high sample rates. Quartus II IP for PCIe, JTAG, and memory controllers simplifies instrument host integration, and the industrial temperature range ensures stable performance in lab environments.
推薦
推薦產品摘要
工程參考資料，適用於 EP3SL70F780I3 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP3SL70F780I4N | EP3SL70F780C4N | EP3SL70F780I4 | EP3SL70F780C4LN | EP3SL70F780C3N | EP3SL70F780C2N |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel (same) | Intel (same) | Intel (same) | Intel (same) | Intel (same) | Intel (same) |
| Package | 780-ball FineLine BGA (FC-FBGA), 28x28 mm | 780-ball FineLine BGA - same | 780-ball FineLine BGA - same | 780-ball FineLine BGA - same | 780-ball FineLine BGA - same | 780-ball FineLine BGA - same | 780-ball FineLine BGA - same |
| Logic Elements | 67,500 | 67,500 | 67,500 | 67,500 | 67,500 | 67,500 | 67,500 |
| Embedded Memory (bits) | 2,699,264 | 2,699,264 | 2,699,264 | 2,699,264 | 2,699,264 | 2,699,264 | 2,699,264 |
| Max User I/O | 488 | 488 | 488 | 488 | 488 | 488 | 488 |
| Speed Grade | I3 (industrial) | I4 (faster industrial) | C4 (commercial) | I4 (faster industrial) | C4 (commercial) | C3 (commercial) | C2 (commercial) |
| Operating Temperature | -40 C to +100 C (Industrial) | -40 C to +100 C (Industrial) | 0 C to +85 C (Commercial) | -40 C to +100 C (Industrial) | 0 C to +85 C (Commercial) | 0 C to +85 C (Commercial) | 0 C to +85 C (Commercial) |
| Process Node | 65 nm | 65 nm | 65 nm | 65 nm | 65 nm | 65 nm | 65 nm |
主要差異化特點
- Mid-density Stratix III L with industrial temperature and I3 speed grade (對比EP3SL70F780C2N)
- Higher speed grade option for tighter timing margins (對比EP3SL70F780I3)
- Identical 67.5K LE architecture as other 780-FBGA Stratix III L parts (對比EP3SL50F780I3)
設計說明
The 780-ball FC-FBGA package uses a 1.0 mm ball pitch on a 28x28 mm substrate, which demands a 4- to 8-layer PCB with microvia or via-in-pad construction for breakout. Follow Intel's Stratix III board design guidelines for power plane stitching, controlled-impedance routing for high-speed transceivers, and matched-length skew control on DDR2/DDR3 interfaces. A solid ground reference plane beneath the BGA is essential to suppress simultaneous switching noise (SSN) on the 488 I/O pins.
Estimated: at full utilization of 67,500 LEs switching at 100 MHz with the I3 speed grade, core power is typically 3-5 W, well within the FC-FBGA's thermal envelope when paired with moderate airflow. Compute thermal loading using the Quartus II PowerPlay early power estimator before PCB fabrication, and add a heatsink or thermal interface material if junction temperature approaches 100 C in your enclosure. Industrial-temperature designs must derate properly across the full -40 C to +100 C range.
Configuration mode selection is a frequent source of board bring-up issues: confirm the MSEL pins are tied to the correct mode for your configuration scheme (AS, PS, JTAG, or FPP). The JTAG chain must observe IEEE 1149.1 TCK/TMS/TDO/TDI pull-up and pull-down values per datasheet. Ensure the nCONFIG, nSTATUS, and CONF_DONE pins have the recommended pull-ups and decoupling. Finally, verify that your Quartus II version supports the EP3SL70F780 device ID before synthesis.
合規資訊
Stratix III devices are industrial-grade FPGAs not subject to AEC-Q100 automotive qualification. RoHS/REACH/lead-free status was not present in the verified web data and is marked unknown; confirm via the official Intel material declaration before PCB assembly.
