Intel

EP4SGX530KF43C3N - Stratix IV GX FPGA, 531K LE, 1760-BGA | Intel

MPN: EP4SGX530KF43C3N ⚠ Lần mua cuối

1760-BBGA / FCBGA Package 800 MHz Speed 28,033,024 bits Memory

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MOQ: 1 |

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EP4SGX530KF43C3N Tóm tắt

The Intel EP4SGX530KF43C3N is a high-density Stratix IV GX Field Programmable Gate Array (FPGA) housed in a 1760-ball Fine-pitch Ball Grid Array (FBGA) package measuring 42.50 x 42.50 mm. It integrates 531,200 logic elements, 28,033,024 bits of embedded memory, and a high-speed serial interface fabric, delivering a flexible platform for bandwidth-intensive applications including wireline backplane aggregation, wireless baseband processing, and high-performance digital signal processing.

A Field Programmable Gate Array (FPGA) is a programmable logic device that allows engineers to implement custom digital circuits through configuration rather than fabrication. Within the broader programmable logic taxonomy, an FPGA sits above simple programmable logic devices (SPLDs) and complex programmable logic devices (CPLDs), offering far higher logic density, embedded multipliers, block RAM, clock management tiles, and high-speed transceivers. The Stratix IV GX family specifically targets applications requiring multi-gigabit serial connectivity (up to 8.5 Gbps per channel).

Key features include 21248 logic array blocks (LABs), 880 user I/O pins, integrated transceivers capable of 600 Mbps to 8.5 Gbps operation, and support for up to 24 transceiver channels. The device operates across the commercial 0C to 85C temperature range and is built on a 40 nm process technology. Quartus II design software is used for synthesis, place-and-route, and timing closure.

The architecture combines adaptive logic modules (ALMs), TriMatrix embedded memory blocks, DSP blocks for fixed- and floating-point arithmetic, and phase-locked loops (PLLs) for clock generation. The high-speed serial interface is hardened with physical coding sublayer (PCS) and physical medium attachment (PMA) blocks supporting protocols such as PCI Express Gen1/Gen2, Serial RapidIO, Gigabit Ethernet, XAUI, CEI-6G, and CPRI.

Typical applications include high-end wireline transport equipment (100G/40G line cards), wireless LTE and WiMAX baseband processing, military secure communication systems, broadcast video infrastructure, and high-performance computing acceleration. The combination of high logic density, multi-gigabit transceivers, and ample DSP blocks makes it well suited to packet processing, encryption, and forward-error-correction pipelines.

When designing with this device, careful attention to PCB layout is critical: controlled-impedance routing for transceiver channels, decoupling capacitor placement around the core and I/O rails, and thermal management via heatsink or airflow to keep junction temperature within the 0C to 85C commercial range. Quartus II power analysis and SignalTap II logic analyzer tools are recommended for sign-off.

This page synthesizes distributor pricing, package-compatible alternatives from the Stratix IV GX family, and practical PCB/thermal design guidance not found in the manufacturer datasheet alone.

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Các biến thể trong loạt này

Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EP4SGX530KF43C3N (cùng hình factor và footprint) — khác nhau ở Package, Operating Temperature, Speed Grade, Transceivers, Process Technology.

EP4SGX530KF43C2

Intel

Package: 1760-ball FCBGA, 42.5 x 42.5 mm

Operating Temperature: 0 C to +85 C (Commercial)

Speed Grade: C2