EPM570GF256C5N - 570 LEs MAX II CPLD 5.4ns 256-FBGA | Intel
MPN: EPM570GF256C5N ✓ Hoạt độngEPM570GF256C5N Tóm tắt
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that sits in the hierarchy between simple PLDs (PALs/GALs) and FPGAs. It is characterized by coarse-grained macrocell architecture, deterministic timing (fixed pin-to-pin delays), and instant-on behavior from internal Flash configuration memory. Within the broader taxonomy, CPLDs belong to programmable logic devices -> logic ICs -> integrated circuits -> semiconductors. The MAX II family from Intel/Altera pioneered low-power, low-cost CPLDs targeting glue-logic, bus bridging, I/O expansion, and power-up sequencing tasks that previously required discrete logic or small FPGAs.
Key features of the EPM570GF256C5N include a 5.4 ns tPD (fastest speed grade), 304 MHz fMAX, 8 Kbits of user Flash memory (UFM), 3.3 V core operation with multi-voltage I/O support (1.5 V, 1.8 V, 2.5 V, 3.3 V LVCMOS/LVTTL), and IEEE 1149.1 JTAG boundary-scan support. The 256-ball FineLine BGA measures 17 mm x 17 mm with 1 mm ball pitch, allowing vertical migration with the EPM1270 and EPM2210 in the same footprint.
The architecture uses a MultiVolt core, MultiTrack interconnect, and four logic array blocks (LABs), each containing 16 macrocells. Per the datasheet, the I/O structure supports slew-rate control, bus-hold, and pull-up resistors, which simplifies board design by eliminating external termination in many cases. The UFM block can store user data such as serial numbers, lookup tables, or boot parameters.
Typical applications include bus-bridging logic (e.g., I²C-to-SPI, PCIe-to-Local bus), power-sequencer controllers for multi-rail systems, I/O expansion for microcontrollers and ASICs, LED display drivers, and industrial glue-logic replacement. The wide operating temperature range (-40 °C to +125 °C industrial grade) makes it suitable for automotive, industrial, and aerospace designs.
When designing with this device, place four 0.1 µF + 1 µF decoupling capacitors near each VCCIO/VCCINT ball cluster, and respect the 1 mm BGA pitch during PCB layout. Use the Quartus II or Intel Quartus Prime programmer to load the program via JTAG; the device supports ISP without external boot memory.
This page synthesizes distributor pricing, drop-in MAX II alternatives in the same 256-FBGA footprint, and practical design notes not consolidated in any single manufacturer document.
Bộ thay thế dễ dàng lắp đặt cho EPM570GF256C5N — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EPM570GF256C5N (cùng hình factor và footprint) — khác nhau ở Package, Process Technology, Operating Temperature, Programming Interface, RoHS Status.
EPM570GF256C5
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EPM570GF256C4N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EPM570GF256C3N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EPM1270GF256C5N
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
EPM2210GF256C5N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EPM570F256C5N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EPM570GF256C5N Tỷ lệ tối đa & tính chất điện
| Device Family | MAX II |
| Logic Elements | 570 |
| Macrocells | 440 |
| Maximum User I/Os | 212 |
| Pin-to-Pin Delay (tPD) | 5.4 ns |
| Maximum Frequency (fMAX) | 304 MHz |
| User Flash Memory (UFM) | 8 Kbits |
| Operating Voltage (VCCINT) | 3.3 V |
| I/O Voltage Support (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Hộp | 256-ball FineLine BGA (17 x 17 mm, 1.0 mm pitch) |
| Process Technology | 0.18 µm Flash-based CMOS |
| Configuration Method | Non-volatile, instant-on (Flash) |
| Programming Interface | JTAG (IEEE 1149.1) / ISP |
| Nhiệt độ hoạt động | -40 °C to +125 °C (Industrial) |
| Lead-Free / RoHS | Yes (Lead-free finish) |
Hướng dẫn cấu hình chân EPM570GF256C5N 256-ball fineline bga (17 x 17 mm, 1.0 mm pitch)
Cấu hình chân cho EPM570GF256C5N (256-ball fineline bga (17 x 17 mm, 1.0 mm pitch) gói). IC số này bao gồm chân GPIO, giao diện truyền thông (UART, SPI, I2C) và chân nguồn. Tham khảo tài liệu thông số kỹ thuật của nhà sản xuất để biết các chức năng chân thay thế và tùy chọn cấu hình. Cực kỳ quan trọng cho thiết kế hệ thống tích hợp và lập trình PCB.
Không có dữ liệu chân cụ thể sẵn có cho EPM570GF256C5N.
Tham khảo: tài liệu kỹ thuật cho cấu hình chân đầy đủ.
Ứng dụng tiêu biểu
EPM570GF256C5N phù hợp cho 6 Áp dụngs: Bus-Bridging Logic (I²C/SPI/UART to Parallel), Power-Sequencing Controller for Multi-Rail Systems, Microcontroller I/O Expansion, Industrial Glue-Logic Replacement, LED Display and Signage Driver, Automotive Body and Chassis Control.
Bus-Bridging Logic (I²C/SPI/UART to Parallel)
The EPM570GF256C5N's deterministic 5.4 ns tPD and instant-on Flash make it ideal for bridging asynchronous serial buses to parallel processor interfaces. With 570 logic elements and 212 user I/Os, the device can multiplex multiple SPI slaves, convert I²C to SPI, or fan-out a UART to several MCUs without external glue logic. Its 3.3 V core with multi-voltage VCCIO (1.5/1.8/2.5/3.3 V) eliminates level shifters when bridging a 1.8 V application processor to legacy 3.3 V peripherals. Programmable via JTAG, the design can be revised in-system without replacing the CPLD.
Được đề xuất
Power-Sequencing Controller for Multi-Rail Systems
The EPM570GF256C5N delivers deterministic timing and instant-on configuration critical for power-sequencing controllers in multi-rail SoC, FPGA, and ASIC power systems. Using the 5.4 ns tPD to drive enable pins of buck regulators, the CPLD can stagger 0.8 V core, 1.8 V analog, and 3.3 V I/O rails with microsecond-level resolution. Its non-volatile Flash eliminates boot-FPGA configuration dependency, and the 8 Kbit UFM can store trim values for rail voltages or fault thresholds. Industrial temperature range (-40 °C to +125 °C) supports server, telecom, and automotive power designs.
Được đề xuất
Microcontroller I/O Expansion
When a microcontroller runs out of GPIO, the EPM570GF256C5N provides 212 additional user I/Os in a single 17 x 17 mm BGA, accessible via SPI or parallel bus. Each macrocell can be configured as input, output, or bidirectional with programmable pull-ups, slew-rate control, and bus-hold - matching or exceeding MCU GPIO features. The 5.4 ns tPD enables high-speed expansion for displays, keypads, or motor-control PWMs. Multi-voltage VCCIO banks (1.5/1.8/2.5/3.3 V) let one CPLD expand into mixed-voltage subsystems without external translation.
Được đề xuất
Industrial Glue-Logic Replacement
The EPM570GF256C5N replaces dozens of 74-series TTL/CMOS glue-logic gates (ANDs, ORs, flip-flops, muxes, counters) with a single programmable device. Designers can revise logic via JTAG during development and lock the design by setting the Flash security bit. With 440 macrocells and 5.4 ns tPD, the CPLD delivers TTL-equivalent or faster performance while reducing board area, BOM count, and inventory. Industrial-grade operation to +125 °C suits factory automation, motor drives, and process control.
Được đề xuất
LED Display and Signage Driver
The EPM570GF256C5N drives multiplexed LED matrix displays, scrolling signs, and DMX-controlled lighting fixtures. Its 212 user I/Os and 5.4 ns tPD enable high-refresh-rate multiplexing (1:8 to 1:16 scan) of large LED matrices without flicker. The 304 MHz fMAX supports fast PWM generation for color-mixing dimming. JTAG in-system programming allows designers to update animation patterns in deployed signage without removing the CPLD. Wide VCCIO tolerance lets the same CPLD drive 3.3 V and 5 V LED driver chains.
Được đề xuất
Automotive Body and Chassis Control
The EPM570GF256C5N's -40 °C to +125 °C industrial temperature range and instant-on Flash make it suitable for automotive body controllers, HVAC modules, and chassis subsystems requiring deterministic glue logic. With 570 logic elements it can debounce switches, drive relays and H-bridges, multiplex CAN/LIN transceivers, and supervise watchdog timers. The non-volatile Flash eliminates the boot delay of SRAM-based FPGAs and ensures the controller is operational within microseconds of power-up, which is critical for airbag, ABS, and sensor-fusion applications.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho EPM570GF256C5N — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | EPM570GF256C5 | EPM570GF256C4N | EPM1270GF256C5N | EPM2210GF256C5N |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 256-FBGA (17 x 17 mm) | 256-FBGA (17 x 17 mm) - same | 256-FBGA (17 x 17 mm) - same | 256-FBGA (17 x 17 mm) - same | 256-FBGA (17 x 17 mm) - same |
| Logic Elements | 570 | 570 | 570 | 1270 | 2210 |
| Macrocells | 440 | 440 | 440 | 980 | 1700 |
| User I/Os | 212 | 212 | 212 | 212 | 212 |
| tPD (Speed Grade) | 5.4 ns (C5) | 5.4 ns (C5) | 7.5 ns (C4) | 6.2 ns (C5) | 7.0 ns (C5) |
| UFM Size | 8 Kbit | 8 Kbit | 8 Kbit | 8 Kbit | 8 Kbit |
| Operating Temperature | -40 °C to +125 °C | -40 °C to +85 °C | -40 °C to +125 °C | -40 °C to +125 °C | -40 °C to +125 °C |
Bảo phân biệt quan trọng
- Highest speed grade in 256-FBGA footprint (vsEPM570GF256C4N)
- Vertical migration headroom in same package (vsEPM1270GF256C5N)
- Non-volatile instant-on Flash configuration (vsSRAM-based small FPGAs)
Ghi chú thiết kế
Place a 0.1 µF X7R decoupling capacitor within 5 mm of every VCCINT ball cluster and a 1 µF bulk capacitor within 25 mm. For the four VCCIO banks (each bank has its own balls), add one 0.1 µF + 1 µF pair per bank. The 1.0 mm BGA pitch demands 4-layer or 6-layer PCB with microvia-in-pad or dog-bone fan-out; route signals on inner layers to escape the BGA field. Estimate (assumes standard JEDEC four-plane stackup): controlled-impedance traces must match 50 Ω single-ended / 90 Ω differential per MAX II Device Handbook recommendations.
Estimated: the EPM570GF256C5N dissipates approximately 0.3-0.5 W typical quiescent plus dynamic power at 304 MHz. With θJA ≈ 25-30 °C/W on a JEDEC 4-layer test board (per Altera packaging thermal data), junction temperature rise above ambient stays well below 15 °C - no heatsink required. Forced-air cooling is unnecessary for normal operation; however, in sealed enclosures above 70 °C ambient, monitor VCCINT current via the JTAG IDCODE readback to detect thermal runaway.
Do not leave JTAG pins (TCK, TMS, TDI, TDO) floating; add 10 kΩ pull-ups to VCCIO_BANK1 or downstream-driver buffer to prevent spurious configuration. When migrating from a 100-TQFP EPM570 to the 256-FBGA EPM570GF256C5N, remember that VCCIO bank counts and assignments differ between packages - re-validate pin assignments in the Quartus pin-planner before board layout. Finally, the Flash security bit, once set, cannot be erased; keep an unprogrammed copy for future revisions.
Thông tin tuân thủ
RoHS-compliant lead-free finish per Altera/Intel product page (N suffix). AEC-Q100 not qualified - the MAX II family is not AEC-Q100 certified; contact Intel for AEC-Q100 equivalents if required. REACH compliance per EU distributor listings.
