LPC1825JBD144E - 180MHz Cortex-M3 MCU, 768KB Flash, LQFP-144 | NXP
MPN: LPC1825JBD144E ✓ Hoạt độngLPC1825JBD144E Tóm tắt
A microcontroller (MCU) is a single integrated circuit that contains a processor core, embedded memory and a set of peripheral blocks on one die. The NXP LPC18xx family sits in the hierarchy embedded processor -> 32-bit microcontroller -> Arm Cortex-M3 MCU -> NXP LPC18xx series. Arm Cortex-M3 cores combine a compact 32-bit instruction set with low power consumption, enhanced debug features and a high level of support-block integration, which makes them the standard choice for industrial, automotive-adjacent and consumer embedded control.
Key features of the LPC1825JBD144E include a 180 MHz maximum CPU frequency, a three-stage pipeline, 768 kB of flash for firmware and constants, and 136 kB of SRAM for working memory and data buffers. The generous SRAM figure is unusual for a Cortex-M3 part and supports USB host or device buffering, DMA transfers and display framebuffer work without external memory. The 144-pin LQFP footprint exposes the full complement of GPIO, communication and timer resources while remaining compatible with standard 0.5 mm-pitch LQFP144 assembly.
Technically, the part belongs to a family whose members run at CPU frequencies of up to 180 MHz using a three-stage pipeline, and the family documentation highlights low power consumption, enhanced debug capabilities and a high level of support-block integration. That combination shortens interrupt latency for protocol handling and keeps a single core sufficient for gateway-class products that combine USB, serial and control functions.
Typical applications include industrial control and factory automation nodes, USB host hubs and peripheral gateways, building and energy management controllers, test and measurement front-ends, human-machine interface panels, and motor or stepper motion control boards where the LQFP144 pin count is required for parallel I/O.
When designing around this MCU, budget the 20 x 20 mm LQFP144 land pattern carefully, place decoupling capacitors adjacent to every supply pin group, and confirm the ground-return path under the die because the exposed perimeter leads carry thermal current into the board rather than into a dedicated pad.
This page consolidates manufacturer and distributor part data, drop-in LQFP144 alternatives from the same NXP family, parameter-by-parameter comparison, and practical layout and thermal notes that a datasheet alone does not present in decision-ready form.
Bộ thay thế dễ dàng lắp đặt cho LPC1825JBD144E — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với LPC1825JBD144E (cùng hình factor và footprint) — khác nhau ở Package, Flash Memory, SRAM, Architecture, CPU Architecture.
LPC1825JBD144
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
LPC1857JBD144E
✅ Drop-In ⚠️ Thông số chưa được xác minh📋 Tham chiếu thay thế (không có trong danh mục)
LPC1837JBD144E
✅ Drop-In ⚠️ Thông số chưa được xác minhLiên hệ để biết giá
Xem tài liệu →LPC1833JBD144E
✅ Drop-In ⚠️ Thông số chưa được xác minhLiên hệ để biết giá
Xem tài liệu →LPC1813JBD144E
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →LPC1830FBD144K
✅ Drop-In ⚠️ Thông số chưa được xác minhLiên hệ để biết giá
Xem tài liệu →LPC1825JBD144E Tỷ lệ tối đa & tính chất điện
| Core Processor | Arm Cortex-M3 |
| CPU Frequency | 180 MHz maximum |
| Architecture | 32-bit ARM |
| Flash Memory | 768 kB (768K x 8) |
| SRAM | 136 kB |
| Pipeline | 3-stage |
| Hộp | LQFP-144 (20 x 20 mm) |
| Kiểu lắp đặt | Surface Mount |
| Device Category | 32-bit Microcontroller IC (MCU) |
| Series | LPC18xx (LPC185x/3x/2x/1x family) |
| Family Max Frequency | Up to 180 MHz |
| Core Highlights | Low power consumption, enhanced debug features, high level of support block integration |
| Number of I/O Pins | 144 |
Hướng dẫn cấu hình chân LPC1825JBD144E lqfp-144 (20 x 20 mm)
Cấu hình chân cho LPC1825JBD144E (lqfp-144 (20 x 20 mm) gói). IC số này bao gồm chân GPIO, giao diện truyền thông (UART, SPI, I2C) và chân nguồn. Tham khảo tài liệu thông số kỹ thuật của nhà sản xuất để biết các chức năng chân thay thế và tùy chọn cấu hình. Cực kỳ quan trọng cho thiết kế hệ thống tích hợp và lập trình PCB.
Không có dữ liệu chân cụ thể sẵn có cho LPC1825JBD144E.
Tham khảo: tài liệu kỹ thuật cho cấu hình chân đầy đủ.
Ứng dụng tiêu biểu
LPC1825JBD144E phù hợp cho 6 Áp dụngs: Industrial Control and Automation Node, USB Host Hub and Peripheral Gateway, Building and Energy Management Controller, Human-Machine Interface and Display Panel Controller, Test and Measurement Front-End, Motor and Stepper Motion Control Board.
Industrial Control and Automation Node
The LPC1825JBD144E suits factory floor control nodes that need deterministic real-time handling plus generous memory in a single part. At 180 MHz with a three-stage pipeline, the Cortex-M3 core keeps interrupt latency low enough for closed-loop digital control, while 136 kB of SRAM allows multi-axis PID state, fieldbus frame buffers and logging to coexist without external memory. The 144-lead LQFP (20x20 mm) exposes the full GPIO set, timer and serial resources needed for encoder inputs, discrete I/O expansion and isolated serial links on the same board, and the 768 kB flash comfortably holds an RTOS plus protocol stacks.
Được đề xuất
USB Host Hub and Peripheral Gateway
Because the LPC1825JBD144E combines 768 kB of flash with 136 kB of SRAM at 180 MHz, it can act as a USB host controller, port expander or protocol bridge without offloading buffering to external memory. The large SRAM budget is the decisive factor here: USB bulk transfers and protocol translation need working buffers far larger than typical Cortex-M3 devices offer, and the 768 kB flash leaves room for a USB stack, composite device descriptors and a bootloader in one image. The 144-pin LQFP provides the parallel host signals, DMA-capable peripherals and multiple UART/SPI channels required for bridging USB to fieldbus or storage.
Được đề xuất
Building and Energy Management Controller
HVAC, lighting and metering controllers benefit from the LPC1825JBD144E because they must aggregate many slow but numerous inputs while still meeting a strict standby budget. The Cortex-M3 core handles protocol housekeeping and timestamped data logging from multiple UART, SPI and I2C sensors, while the 768 kB flash stores calibration tables, time schedules and firmware update images with headroom for dual-bank boot. The 144-pin LQFP (20x20 mm) footprint gives access to the wide GPIO and timer counts that relay banks, triac drivers and metering front-ends demand, and its low-power family characteristics help hold quiescent current down in meters and thermostats.
Được đề xuất
Human-Machine Interface and Display Panel Controller
A panel controller built around the LPC1825JBD144E must drive displays, read capacitive or resistive touch input and keep a UI responsive, which is exactly where 136 kB of SRAM and 180 MHz of Cortex-M3 performance pay off. Framebuffer segments, font caches and touch controller buffers can be held internally, so the design avoids an external SDRAM interface and its associated layout and cost. The 144-pin LQFP package supplies the parallel LCD data lines, multiple SPI/serial display channels and the timer channels needed for backlight dimming and keypad scanning, all while remaining on a standard 0.5 mm-pitch land pattern.
Được đề xuất
Test and Measurement Front-End
Instrument front-ends need fast, deterministic control of analog and digital peripherals while streaming data to a host, and the LPC1825JBD144E fits that role through 180 MHz Cortex-M3 performance with 136 kB of on-chip SRAM for capture buffers. Acquisition data can be staged in internal memory before DMA transfer, cutting the complexity and pin pressure of a parallel FIFO interface. The 144-lead LQFP also exposes the timer channels, comparators, ADC resources and general GPIO needed to orchestrate stimulus sequencing, relay matrices and trigger lines, all inside a single instrument-grade package family with wide availability.
Được đề xuất
Motor and Stepper Motion Control Board
The LPC1825JBD144E addresses motion control boards that must run current control loops, position tracking and host communication simultaneously. A 180 MHz Cortex-M3 core with a three-stage pipeline gives fast loop iteration, and 136 kB of SRAM is sufficient for multi-axis trajectory buffers and encoder capture without external RAM. The 144-pin LQFP (20x20 mm) provides the PWM outputs, encoder interfaces, capture timers and communication ports that a multi-axis stepper or brushless driver board needs, while the 768 kB flash holds motion algorithms, field-upgradeable firmware and diagnostic logging in a single image.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho LPC1825JBD144E — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | LPC1825JBD144 | LPC1857JBD144E | LPC1837JBD144E | LPC1833JBD144E | LPC1813JBD144E | LPC1830FBD144K |
|---|---|---|---|---|---|---|---|
| Package | LQFP-144 (20x20 mm) | LQFP-144 (20x20 mm) - same | LQFP-144 (20x20 mm) - same | LQFP-144 (20x20 mm) - same | LQFP-144 (20x20 mm) - same | LQFP-144 (20x20 mm) - same | LQFP-144 (20x20 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Processor | Arm Cortex-M3 | Arm Cortex-M3 | Arm Cortex-M3 | Arm Cortex-M3 | Arm Cortex-M3 | Arm Cortex-M3 | Arm Cortex-M3 |
| Maximum CPU Frequency | 180 MHz | 180 MHz | 180 MHz | 180 MHz | 100 MHz class | 100 MHz class | 100 MHz |
| Flash Memory | 768 kB (768K x 8) | 768 kB | 1 MB class | 512 kB class | 512 kB class | 512 kB | 128 kB |
| SRAM | 136 kB | 136 kB | 128 kB class | 128 kB class | 128 kB class | 64 kB | 16 kB |
| Pipeline | 3-stage | 3-stage | 3-stage | 3-stage | 3-stage | 3-stage | 3-stage |
Bảo phân biệt quan trọng
- Largest SRAM in the 144-pin LQFP Cortex-M3 family grouping used here (vsLPC1813JBD144E)
- Highest clock class combined with full 768 kB flash in one 144-pin part (vsLPC1833JBD144E)
- Exact orderable sibling with no firmware or layout impact (vsLPC1825JBD144)
- Lower memory ceiling avoided versus the entry-level 144-pin member (vsLPC1830FBD144K)
Ghi chú thiết kế
Treat the LQFP-144 (20 x 20 mm, 0.5 mm pitch) land pattern as a routing constraint from day one. With 144 leads at 0.5 mm pitch, escape routing from inner pins to a breakout area needs either a via fan-out or two-layer escape before the second signal layer, and the 0.5 mm pitch leaves only about 0.25 mm of copper between adjacent pads for the solder mask dam. Verify the exact pad geometry against the manufacturer package drawing in your CAD library, and confirm that the assembly house supports 0.5 mm-pitch LQFP144 before committing to the layout.
Place the bulk and high-frequency decoupling capacitors directly between each supply pin or supply group and its nearest ground reference, with the smallest ceramic capacitor first. A 100 nF X7R device should sit within about 2 mm of each supply pin to form a short, low-inductance loop, and a bulk bulk capacitor of a few microfarads should be placed near the regulator entry point. Estimated: with an assumed 5 V rail and a 3.5 V total drop at 200 mA average, dissipation is about 0.7 W, which is spread across the perimeter leads rather than a thermal pad, so keep the ground plane continuous under the device.
The LQFP-144 package has no exposed thermal pad, so heat leaves through the 144 perimeter leads into the board copper. Estimated: at 180 MHz with 768 kB flash executing from flash cache misses, roughly 0.5 W to 1.0 W of internal dissipation can occur; with about 1 W and a 144-lead package, this is generally manageable on a 2-layer board only if a solid ground and power plane sit directly beneath the die, but a 4-layer board with a dedicated ground plane markedly improves the temperature rise. Route thermal copper into the ground plane region under the package and keep thermal vias outside the fine-pitch escape area.
Keep high-speed and high-current paths short and separated from sensitive analog inputs, and provide a solid, uninterrupted ground reference for every analog pin. Separate the 180 MHz clock routing from USB data pairs and serial lines, and avoid routing clock and data over split plane boundaries; if the board has more than two layers, reference high-speed pairs to a continuous plane rather than to a plane split that changes reference impedance underneath the trace. Where the design mixes USB or Ethernet traffic with an ADC front-end, group the analog section, provide its own ground pour and use a single controlled connection point back to the digital ground.
Two substitution mistakes are common on this family. First, moving from LPC1825JBD144E to a lower-flash member such as LPC1830FBD144K can break the build if the linker script or bootloader assumes 768 kB of flash and 136 kB of SRAM, even though the footprint matches exactly. Second, assuming a suffix-only difference between LPC1825JBD144 and LPC1825JBD144E means identical temperature behaviour is unsafe; confirm the grade limits in the ordering information before using either part in an extended-temperature design, and re-validate the USB, Ethernet and clock-tree configuration after any family swap.
Thông tin tuân thủ
No explicit compliance declarations were identified for this exact orderable variant; the manufacturer part page for LPC1825JBD144 should be checked for the current declarations and terminal information before release to production.
