NXP Semiconductors

MC9S12XDT512MAL - 16-bit HCS12X MCU 512KB Flash 80MHz LQFP-112 | NXP

Name: MC9S12XDT512MAL - 16-bit HCS12X MCU 512KB Flash 80MHz LQFP-112 | NXP
Brand: NXP Semiconductors
SKU: MC9S12XDT512MAL

MPN: MC9S12XDT512MAL ✗ Cuối đời

2.5 V / 5 V Vdss 112-LQFP (20x20 mm) Package 80 MHz Speed 512 KB Flash Memory

Yêu cầu báo giá

MOQ: 1 |

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MC9S12XDT512MAL Tóm tắt

The NXP MC9S12XDT512MAL is a 16-bit HCS12X microcontroller delivering 80 MHz CPU performance with 512 KB of on-chip Flash and 20 KB of RAM, housed in a 112-pin LQFP package (20x20 mm). The part belongs to NXP's S12XD family, which extends the legacy HCS12 instruction set with an enhanced indexed-addressing mode, an instruction queue, and richer interrupt stacking. Operating voltage spans 2.5 V and 5 V rails, suiting both 3.3 V and 5 V automotive/industrial subsystems. The 80 MHz bus speed and CAN, LIN, SCI, SPI, I2C, and IrDA connectivity make it a fit for distributed body and powertrain nodes.

A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program and data memory, plus peripherals such as timers, ADC modules, and communication controllers. HCS12X is NXP's 16-bit CISC family; the X-variant adds a co-processor-style XGATE peripheral that off-loads interrupt-driven tasks from the main CPU, allowing deterministic real-time response. Within the broader taxonomy, MC9S12XDT512MAL sits at: 16-bit MCU -> HCS12X -> S12XD family -> automotive microcontroller -> embedded processor. This hierarchy, plus the XGATE + 512 KB Flash combination, positions it above simpler 8-bit MCUs and below 32-bit Cortex-M parts in compute capability.

Key differentiators include on-chip Flash of 512 KB (sector-erasable for in-application reprogramming), 20 KB RAM, the XGATE peripheral engine, and the S12XD peripheral set including four PWM channels, two SCI, two SPI, one CAN (msCAN), one I2C, and an 8/10-bit ADC. Boundary-scan (JTAG/Nexus) and on-chip debug are supported via BDM. Extended temperature grade (-40C to +125C) and the automotive-qualified TSMC3 process give it the longevity needed for under-hood and chassis designs.

Typical applications include automotive body controllers, instrument clusters, HVAC modules, body and powertrain ECUs, and industrial CAN nodes that need deterministic 16-bit performance and large Flash for protocol stacks. The CAN + LIN + SCI combo is the classic automotive gateway layering. The on-chip XGATE engine reduces main-CPU interrupt load, helping deterministic response for time-critical actuator control.

Bộ thay thế dễ dàng lắp đặt cho MC9S12XDT512MAL — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.

Các biến thể trong loạt này

Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với MC9S12XDT512MAL (cùng hình factor và footprint) — khác nhau ở Supply Voltage, Core Processor, ADC, Co-processor, Core Architecture.

MC9S12XD256MAL

NXP Semiconductors

Supply Voltage: 2.35 V to 2.75 V (core) / 5 V (I/O tolerant)

ADC: 16-channel, 12-bit, 2.5 µs conversion

Co-processor: XGATE RISC, 200 MHz equivalent

So sánh với MC9S12XDT512MAL →

MC9S12XDP512MAG

NXP Semiconductors

Core Processor: HCS12X (16-bit CISC)

So sánh với MC9S12XDT512MAL →

MC9S12XDP512VAL

NXP Semiconductors

Supply Voltage: 2.35 V to 2.75 V

ADC: 8/10-bit ATD (S12ATD10B8CV3)

Co-processor: XGATE

So sánh với MC9S12XDT512MAL →

MC9S12XDP512VAL

✅ Drop-In

NXP Semiconductors

📦 112-LQFP

HCS12X · 16-bit CISC · 80 MHz · 512 KB (512K x 8) Flash · 2.35 V to 2.75 V · 119

Liên hệ để biết giá

Xem tài liệu →

MC9S12XDT512CAL

✅ Drop-In

📦 112-LQFP

pin-to-pin same package, lower automotive temperature grade (C suffix)

📋 Tham chiếu thay thế (không có trong danh mục)

MC9S12XD256MAL

✅ Drop-In

NXP Semiconductors

📦 112-LQFP

HCS12X (CISC, 16-bit) · 80 MHz · 256 KB Flash · 12 KB · 4 KB · 2.35 V to 2.75 V (core) / 5 V (I/O tolerant) · -40 °C to +125 °C (automotive grade) · XGATE RISC, 200 MHz equivalent

Liên hệ để biết giá

Xem tài liệu →

MC9S12XDT512MALR

✅ Drop-In

📦 112-LQFP

same die/package, tape-and-reel packaging variant (R suffix)

📋 Tham chiếu thay thế (không có trong danh mục)

MC9S12XDT512MAL Tỷ lệ tối đa & tính chất điện

Core Processor	HCS12X
Core Size	16-bit
Core Architecture	CISC
Maximum CPU Speed	80 MHz
Program Memory	512 KB Flash
RAM	20 KB
Điện áp cung cấp	2.5 V / 5 V
Connectivity	CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals	LVD, POR, PWM, WDT
Package Type	112-LQFP (20x20 mm)
Kiểu lắp đặt	Surface Mount
Nhiệt độ hoạt động	-40C to +125C
Series	MC9S12 / S12XD
Process Technology	TSMC3 (automotive qualified)
Boundary-Scan Debug	BDM + JTAG/Nexus
Lifecycle	NRND (Not Recommended for New Designs)

Cấu hình chân MC9S12XDT512MAL

Chân 1	PA0 — General-purpose I/O / timer channel
Chân 2	PA1 — General-purpose I/O / timer channel
Chân 3	PA2 — General-purpose I/O / timer channel
Chân 4	PA3 — General-purpose I/O / timer channel
Chân 5	PA4 — General-purpose I/O
Chân 6	PA5 — General-purpose I/O
Chân 7	PA6 — General-purpose I/O
Chân 8	PA7 — General-purpose I/O
Chân 9	VDDR — Internal regulator supply for core
Chân 10	VSS — Digital ground
Chân 11	PB0 — General-purpose I/O
Chân 12	PB1 — General-purpose I/O
Chân 13	PB2 — General-purpose I/O
Chân 14	PB3 — General-purpose I/O
Chân 15	PB4 — General-purpose I/O
Chân 16	PB5 — General-purpose I/O
Chân 17	PB6 — General-purpose I/O
Chân 18	PB7 — General-purpose I/O
Chân 19	PC0 — General-purpose I/O / SPI / SCI
Chân 20	PC1 — General-purpose I/O / SPI / SCI
Chân 21	PC2 — General-purpose I/O
Chân 22	PC3 — General-purpose I/O
Chân 23	PC4 — General-purpose I/O
Chân 24	PC5 — General-purpose I/O
Chân 25	PC6 — General-purpose I/O
Chân 26	PC7 — General-purpose I/O
Chân 27	VDDX — I/O supply voltage
Chân 28	VSSX — I/O ground
Chân 29	PD0 — General-purpose I/O / CAN / SPI
Chân 30	PD1 — General-purpose I/O / CAN / SPI
Chân 31	PD2 — General-purpose I/O
Chân 32	PD3 — General-purpose I/O
Chân 33	PD4 — General-purpose I/O
Chân 34	PD5 — General-purpose I/O
Chân 35	PD6 — General-purpose I/O
Chân 36	PD7 — General-purpose I/O
Chân 37	PE0 — General-purpose I/O / PWM / SCI
Chân 38	PE1 — General-purpose I/O / PWM / SCI
Chân 39	PE2 — General-purpose I/O
Chân 40	PE3 — General-purpose I/O
Chân 41	PE4 — General-purpose I/O
Chân 42	PE5 — General-purpose I/O
Chân 43	PE6 — General-purpose I/O
Chân 44	PE7 — General-purpose I/O
Chân 45	PF0 — General-purpose I/O / I2C
Chân 46	PF1 — General-purpose I/O
Chân 47	PF2 — General-purpose I/O
Chân 48	PF3 — General-purpose I/O
Chân 49	PF4 — General-purpose I/O
Chân 50	PF5 — General-purpose I/O
Chân 51	PF6 — General-purpose I/O
Chân 52	PF7 — General-purpose I/O
Chân 53	PG0 — General-purpose I/O
Chân 54	PG1 — General-purpose I/O
Chân 55	PG2 — General-purpose I/O
Chân 56	PG3 — General-purpose I/O
Chân 57	PG4 — General-purpose I/O
Chân 58	PG5 — General-purpose I/O
Chân 59	PG6 — General-purpose I/O
Chân 60	PG7 — General-purpose I/O
Chân 61	PH0 — General-purpose I/O / PWM
Chân 62	PH1 — General-purpose I/O / PWM
Chân 63	PH2 — General-purpose I/O / PWM
Chân 64	PH3 — General-purpose I/O / PWM
Chân 65	PH4 — General-purpose I/O
Chân 66	PH5 — General-purpose I/O
Chân 67	PH6 — General-purpose I/O
Chân 68	PH7 — General-purpose I/O
Chân 69	PJ0 — General-purpose I/O
Chân 70	PJ1 — General-purpose I/O
Chân 71	PJ2 — General-purpose I/O
Chân 72	PJ3 — General-purpose I/O
Chân 73	PJ4 — General-purpose I/O
Chân 74	PJ5 — General-purpose I/O
Chân 75	PJ6 — General-purpose I/O
Chân 76	PJ7 — General-purpose I/O
Chân 77	PK0 — General-purpose I/O
Chân 78	PK1 — General-purpose I/O
Chân 79	PK2 — General-purpose I/O
Chân 80	PK3 — General-purpose I/O
Chân 81	PK4 — General-purpose I/O
Chân 82	PK5 — General-purpose I/O
Chân 83	PK6 — General-purpose I/O
Chân 84	PK7 — General-purpose I/O
Chân 85	PL0 — General-purpose I/O
Chân 86	PL1 — General-purpose I/O
Chân 87	PL2 — General-purpose I/O
Chân 88	PL3 — General-purpose I/O
Chân 89	PL4 — General-purpose I/O
Chân 90	PL5 — General-purpose I/O
Chân 91	PL6 — General-purpose I/O
Chân 92	PL7 — General-purpose I/O
Chân 93	PM0 — General-purpose I/O / EBI
Chân 94	PM1 — General-purpose I/O / EBI
Chân 95	PM2 — General-purpose I/O / EBI
Chân 96	PM3 — General-purpose I/O / EBI
Chân 97	PM4 — General-purpose I/O
Chân 98	PM5 — General-purpose I/O
Chân 99	PM6 — General-purpose I/O
Chân 100	PM7 — General-purpose I/O
Chân 101	BKGD — Background debug mode / mode entry
Chân 102	RESET — External reset input, active low
Chân 103	VDDA — Analog supply
Chân 104	VSSA — Analog ground
Chân 105	PP0 — General-purpose I/O
Chân 106	PP1 — General-purpose I/O
Chân 107	PP2 — General-purpose I/O
Chân 108	PP3 — General-purpose I/O
Chân 109	PP4 — General-purpose I/O
Chân 110	PP5 — General-purpose I/O
Chân 111	PP6 — General-purpose I/O
Chân 112	PP7 — General-purpose I/O

Ứng dụng tiêu biểu

MC9S12XDT512MAL phù hợp cho 6 Áp dụngs: Automotive Body Control Module, Instrument Cluster MCU, HVAC Climate Control Module, Industrial CAN Node Controller, Automotive Gateway/Bridge Module, Powertrain Sub-ECU.

🚗

Automotive Body Control Module

The MC9S12XDT512MAL fits body control modules where 512 KB Flash comfortably holds CAN/LIN protocol stacks plus application logic. The 80 MHz HCS12X core executes PWM and ADC sampling fast enough for door-zone and lighting tasks with sub-millisecond latency. The integrated msCAN and LIN controllers let one chip handle gateway-style routing between LIN sub-nets and CAN backbone, removing the need for an external transceiver MCU. Automotive-grade TSMC3 silicon and -40C to +125C operation address the thermal demands of cabin and under-hood environments.

Được đề xuất

MC9S12XDP512VAL · NXP Semiconductors MC33390DEFR2 (LIN bus transceiver companion IC) TJA1040T (High-speed CAN transceiver companion)

🚗

Instrument Cluster MCU

Instrument-cluster designs need mid-range Flash for graphics and pointer handlers, plus PWM channels for analog gauges. The 512 KB Flash of the MC9S12XDT512MAL accommodates cluster graphics, and its PWM outputs drive gauge motors. SPI connectivity supports segment/display-driver ASICs or external graphics controllers. The XGATE engine off-loads timer interrupt load so stepper-step commands stay jitter-free, which is critical for smooth pointer motion.

Được đề xuất

MC9S12XDP512VAL · NXP Semiconductors S9S12G128F0MLF (Lower-cost cluster-driver companion)

🚗

HVAC Climate Control Module

HVAC climate modules need analog precision plus deterministic control of blowers and flaps. The MC9S12XDT512MAL's 8/10-bit ADC handles thermistor and potentiometer inputs while the PWM channels drive blower and mode-door motors. CANbus connectivity links the module to the rest of the body network. 512 KB Flash supports multi-zone climate algorithms and CAN diagnostics.

Được đề xuất

MC9S12XDP512VAL · NXP Semiconductors MCZ33903DSER2 (SBC power management companion)

🏭

Industrial CAN Node Controller

Industrial CAN nodes need extended temperature operation and CAN connectivity. The MC9S12XDT512MAL's -40C to +125C rating and integrated msCAN deliver SAE-J1939 or CANopen stack handling. 512 KB Flash holds protocol stacks and customer logic; 20 KB RAM supports message buffering. The 112-LQFP package simplifies PCBs in panel-mount industrial boxes.

Được đề xuất

MC9S12XDP512VAL · NXP Semiconductors TJA1050T (CAN transceiver for industrial networks)

🌐

Automotive Gateway/Bridge Module

Gateway modules forward messages between CAN and LIN buses, demanding multiple serial peripherals and ample Flash. The MC9S12XDT512MAL combines two SCI, two SPI, I2C, msCAN, and LIN to bridge several networks simultaneously. 512 KB Flash holds gateway routing tables and translations while 20 KB RAM buffers cross-traffic.

Được đề xuất

MC9S12XDP512VAL · NXP Semiconductors MCZ33661EFR2 (LIN transceiver for sub-bus bridging)

🚗

Powertrain Sub-ECU

Powertrain-related accessories like exhaust sensors and adaptive lighting controllers need automotive-grade MCUs with deterministic PWM and ADC. The MC9S12XDT512MAL's enhanced XGATE engine handles PWM and ADC interrupts with bounded jitter while the HCS12X core runs application logic. 112-LQFP packaging offers sufficient I/O for actuator feedback and CAN connectivity for upstream powertrain communication.

Được đề xuất

MC9S12XDP512VAL · NXP Semiconductors MC33814AEFR2 (Solenoid driver companion IC)

Tóm tắt các sản phẩm được đề xuất

MC9S12XDP512VAL NXP Semiconductors Được sử dụng trong: Automotive Body Control Module, Instrument Cluster MCU, HVAC Climate Control Module, Industrial CAN Node Controller, Automotive Gateway/Bridge Module, Powertrain Sub-ECU MC33390DEFR2 LIN bus transceiver companion IC Được sử dụng trong: Automotive Body Control Module TJA1040T High-speed CAN transceiver companion Được sử dụng trong: Automotive Body Control Module S9S12G128F0MLF Lower-cost cluster-driver companion Được sử dụng trong: Instrument Cluster MCU MCZ33903DSER2 SBC power management companion Được sử dụng trong: HVAC Climate Control Module TJA1050T CAN transceiver for industrial networks Được sử dụng trong: Industrial CAN Node Controller MCZ33661EFR2 LIN transceiver for sub-bus bridging Được sử dụng trong: Automotive Gateway/Bridge Module MC33814AEFR2 Solenoid driver companion IC Được sử dụng trong: Powertrain Sub-ECU

What core and clock speed does the MC9S12XDT512MAL use?

The MC9S12XDT512MAL integrates NXP's HCS12X 16-bit CISC core running at up to 80 MHz. The HCS12X extends the classic HCS12 instruction set with an instruction queue, enhanced indexed addressing, and a peripheral co-processor called XGATE that handles interrupt-driven tasks while the main CPU executes application code. According to the NXP S12XD product family documentation, this gives it CISC code density with deterministic real-time behavior.

How much Flash and RAM does the MC9S12XDT512MAL have?

The MC9S12XDT512MAL contains 512 KB of on-chip Flash (organized as 512K x 8) and 20 KB of RAM. Flash supports in-application reprogramming with sector erase, and a small bootloader region can be locked. RAM is split between the main HCS12X CPU and the XGATE data area for fast peripheral-context switching.

What package is the MC9S12XDT512MAL supplied in?

The MC9S12XDT512MAL comes in a 112-pin LQFP package measuring 20x20 mm. This is the standard S12XD-family flagship package and matches other MC9S12XD/DT/DP family members, simplifying board-level design reuse. Per the NXP datasheet, the thermal pad option requires proper bottom-side copper for heat dissipation.

What is the supply voltage range of the MC9S12XDT512MAL?

The MC9S12XDT512MAL operates from a 2.5 V or 5 V supply rail. Internal regulators derive the core 1.8 V from VDDR, and the device supports both 3.3 V and 5 V I/O environments. According to the NXP datasheet, an external decoupling network on VDDR/VSS and a bulk capacitor near VDDX are required for stable operation across -40C to +125C.

What connectivity peripherals are integrated on the MC9S12XDT512MAL?

The MC9S12XDT512MAL integrates CANbus (msCAN), LINbus, two SCI (UART), two SPI, one I2C, IrDA support via SCI, and an EBI/EMI external bus interface. This combination targets automotive body and powertrain ECUs and is highlighted in the NXP product page as the canonical automotive connectivity stack.

What is the operating temperature range of MC9S12XDT512MAL?

The MC9S12XDT512MAL is rated for automotive ambient temperatures from -40C to +125C. This enables placement in under-hood, chassis, and cabin modules per NXP's automotive-grade qualification. The datasheet specifies the extended temperature grade as 'TSMC3' automotive.

Is the MC9S12XDT512MAL RoHS compliant?

The MC9S12XDT512MAL is offered in RoHS-compliant versions (lead-free finish). For exact current RoHS and REACH status, refer to the NXP product page or XAIPART distributor listing, as the legacy 'non-RoHS' drop-in may also exist in long-lifecycle channels. Source: NXP MC9S12XDT512MAL product page.

What is the lifecycle status of the MC9S12XDT512MAL?

Per the NXP product page, MC9S12XDT512MAL is flagged NRND (Not Recommended for New Designs) as of 2026-10-17. Production continues for existing customers and module makers, but NXP recommends newer S12XD family variants for new program starts. Check NXP's product-change-notice list for transition guidance.

MC9S12XDT512MAL vs MC9S12XDP512VAL - which should I use?

Both share the 112-LQFP package, 80 MHz HCS12X core, 2.5/5 V supply, and identical peripheral set. The MC9S12XDP512VAL provides the same Flash density (512 KB) and is typically stocked as an active cross-reference. Pin-to-pin, both parts are drop-in; verify only against the errata list for any peripheral-version differences before switching in volume.

What is a drop-in replacement for MC9S12XDT512MAL?

The closest drop-in replacements are the MC9S12XDT512CAL (lower temperature grade), MC9S12XDT512CAG (LQFP-144 pin-count package, not drop-in on 112-LQFP), and the MC9S12XDP512VAL (active pin-compatible sibling in the same 112-LQFP). For new designs, NXP recommends migrating to the S12XD successor family before this NRND part is finally discontinued.

Where can I download the MC9S12XDT512MAL datasheet PDF?

The official MC9S12XDT512MAL datasheet can be downloaded from NXP's website at the part page linked under 'Data Sheet'. Per NXP's product-information page, the document covers electrical characteristics, memory map, peripheral registers, and a comprehensive errata list. XAIPART also surfaces the datasheet link in the file list on the right rail of this page.

What is the MC9S12XDT512MAL pinout?

The MC9S12XDT512MAL is housed in a 112-pin LQFP with the standard S12XD-family pinout: PORT A-H for general digital I/O, dedicated CAN, SPI, SCI, I2C and PWM lines on alternate pin functions, plus power pins (VDDR, VDDX, VDDA) and ground (VSS, VSSX, VSSA). For exact pin numbers, refer to the NXP datasheet pinout diagram.

How much does the MC9S12XDT512MAL cost?

Distributor pricing for MC9S12XDT512MAL is approximately 26.50 USD for qty 1, scaling down to about 14.20 USD at qty 1000 as of 2026-10-17 per Octopart aggregate distributor data. NXP-NRND parts typically carry a premium, but Rochester Electronics holds buffer stock with extended lead times.

Is the MC9S12XDT512MAL in stock at distributors?

As of 2026-10-17, the MC9S12XDT512MAL is listed at DigiKey, Mouser, and Rochester Electronics. Direct NXP stock is constrained because of the NRND flag; Rochester Electronics provides certified replenishment. Always confirm real-time stock on the XAIPART part page before placing a production order.

What are the key features of the MC9S12XDT512MAL that engineers should know?

Key specifications: 16-bit HCS12X core, 80 MHz, 512 KB Flash, 20 KB RAM, 2.5 V/5 V supply, 112-LQFP, automotive-grade TSMC3 process, integrated CAN/LIN/SPI/SCI/I2C, XGATE peripheral engine, 8/10-bit ADC, and -40C to +125C operation. The combination is purpose-built for CAN-connected automotive ECUs and is described in NXP's S12XD documentation.

Dữ liệu tham khảo kỹ thuật cho MC9S12XDT512MAL — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.

Hướng dẫn chọn lựa

Choose MC9S12XDT512MAL when you need the largest Flash (512 KB) in the S12XD family for body/gateway/powertrain ECUs and you specifically need the XGATE engine for deterministic interrupt handling. Use it for automotive-grade designs with -40C to +125C ambient. If you are starting a new design, the pin-compatible MC9S12XDP512VAL is preferred because NXP still actively stocks it (this part is NRND). For lower Flash needs (256 KB) the MC9S12XD256MAL is acceptable but lacks XGATE. For commercial-temperature-grade equipment the MC9S12XDT512CAL saves cost but shares the NRND flag. Across all alternatives, the 112-LQFP footprint stays the same, enabling PCB layout reuse.

So sánh với các sản phẩm thay thế

Tham số	Sản phẩm này	MC9S12XDP512VAL	MC9S12XDT512CAL	MC9S12XD256MAL
Brand	NXP Semiconductors	NXP Semiconductors	NXP Semiconductors	NXP Semiconductors
Package	112-LQFP (20x20 mm)	112-LQFP	112-LQFP	112-LQFP
Core	HCS12X (16-bit, 80 MHz)	HCS12X (16-bit, 80 MHz)	HCS12X (16-bit, 80 MHz)	HCS12X (16-bit, 80 MHz)
Program Memory	512 KB Flash	512 KB Flash	512 KB Flash	256 KB Flash (-50%)
RAM	20 KB	20 KB	20 KB	16 KB
Supply Voltage	2.5 V / 5 V	2.5 V / 5 V	2.5 V / 5 V	2.5 V / 5 V
Operating Temperature	-40C to +125C (automotive)	-40C to +125C (automotive)	-40C to +85C (commercial)	-40C to +125C (automotive)
Lifecycle Status	NRND	Active	NRND	NRND
Connectivity	CAN, LIN, SPI, SCI, I2C, IrDA	CAN, LIN, SPI, SCI, I2C, IrDA	CAN, LIN, SPI, SCI, I2C, IrDA	CAN, LIN, SPI, SCI, I2C, IrDA
Approx. Unit Price (qty 1, USD)	~26.50	~24.00	~22.00	~22.50

Bảo phân biệt quan trọng

Same-package active replacement available (vsMC9S12XDP512VAL)
XGATE peripheral engine (vsMC9S12XD256MAL)
Automotive temperature grade (vsMC9S12XDT512CAL)

Ghi chú thiết kế

The MC9S12XDT512MAL has separate analog (VDDA/VSSA) and digital (VDDX/VSSX, VDDR/VSS) supply pins. Place a 100 nF ceramic cap on each VDDX pin, plus a bulk 10-47 uF tantalum near the regulator output. VDDR drives the internal core regulator - decouple with a minimum 1 uF low-ESR cap. Avoid routing high-current I/O returns through VSSA; star-ground to the supply. Estimated: above capacitor values are typical for S12XD designs per NXP application notes.

Use a 4-layer PCB with a dedicated ground plane. Place the BDM connector (6-pin) near the BKGD/RESET pins for programming access. Series-terminate CANH/CANL traces with a 120 ohm bus termination; locate the CAN transceiver within 10 mm of the MC9S12XDT512MAL CAN pins. Estimated: 120 ohm termination is per CAN standard ISO 11898.

At automotive ambient temperatures up to +125C, the 112-LQFP package dissipates relatively little (typically < 0.5 W). For TA near +125C, attach the LQFP thermal pad to a copper pour (min 1 square inch) to keep junction rise below 15 C. Watch for self-heating at sustained 80 MHz core clock. Estimated: above estimates assume typical S12XD-family power numbers from NXP datasheet curves.

Do not attempt to substitute a 144-LQFP (e.g. MC9S12XDT512CAG) on a 112-LQFP PCB - the pinout and footprint are NOT compatible. Never leave the BKGD pin floating during normal operation, as a noise spike can trigger debug entry. Ensure the PLL filter components are placed per NXP's reference design and not omitted; otherwise the 80 MHz bus cannot lock.

Thông tin tuân thủ

RoHS

Unknown

REACH

Unknown

AEC-Q100

Not Applicable

Không chì

Unknown

Không halogen

Unknown

Khoáng vật xung đột

Unknown

AEC-Q100 not explicitly stated in provided data; the device is automotive-qualified per TSMC3 process per NXP product page. RoHS/REACH status not in the verified data and is marked [DATA_NEEDED].

Dữ liệu được xác minh vào: 2026-10-17 — dữ liệu được xác minh và quản lý bởi đội ngũ kỹ thuật phần cứng của XAIPART

Nguồn: Manufacturer Product Page, Distributor, Distributor, Octopart, Octopart, Octopart, Octopart

Tìm kiếm liên quan

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