MC9S12XDT512MAL - 16-bit HCS12X MCU 512KB Flash 80MHz LQFP-112 | NXP
Référence : MC9S12XDT512MAL ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $26.5 | $26,50 |
| 10 | $23.2 | $232,00 |
| 100 | $19.4 | $1 940,00 |
| 500 | $16.85 | $8 425,00 |
| 1 000 | $14.2 | $14 200,00 |
MC9S12XDT512MAL Présentation
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program and data memory, plus peripherals such as timers, ADC modules, and communication controllers. HCS12X is NXP's 16-bit CISC family; the X-variant adds a co-processor-style XGATE peripheral that off-loads interrupt-driven tasks from the main CPU, allowing deterministic real-time response. Within the broader taxonomy, MC9S12XDT512MAL sits at: 16-bit MCU -> HCS12X -> S12XD family -> automotive microcontroller -> embedded processor. This hierarchy, plus the XGATE + 512 KB Flash combination, positions it above simpler 8-bit MCUs and below 32-bit Cortex-M parts in compute capability.
Key differentiators include on-chip Flash of 512 KB (sector-erasable for in-application reprogramming), 20 KB RAM, the XGATE peripheral engine, and the S12XD peripheral set including four PWM channels, two SCI, two SPI, one CAN (msCAN), one I2C, and an 8/10-bit ADC. Boundary-scan (JTAG/Nexus) and on-chip debug are supported via BDM. Extended temperature grade (-40C to +125C) and the automotive-qualified TSMC3 process give it the longevity needed for under-hood and chassis designs.
Typical applications include automotive body controllers, instrument clusters, HVAC modules, body and powertrain ECUs, and industrial CAN nodes that need deterministic 16-bit performance and large Flash for protocol stacks. The CAN + LIN + SCI combo is the classic automotive gateway layering. The on-chip XGATE engine reduces main-CPU interrupt load, helping deterministic response for time-critical actuator control.
Alternatives de remplacement direct pour MC9S12XDT512MAL — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MC9S12XDT512MAL (même facteur de forme et même empreinte) — différant par Supply Voltage, Core Processor, ADC, Co-processor, Core Architecture.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MC9S12XDP512VAL
✅ Remplacement direct✓ En stock
$11.1 / unité
Voir la fiche technique →MC9S12XDT512CAL
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC9S12XD256MAL
✅ Remplacement direct✓ En stock
$17.85 / unité
Voir la fiche technique →MC9S12XDT512MALR
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC9S12XDT512MAL Valeurs maximales et caractéristiques électriques
| Core Processor | HCS12X |
| Core Size | 16-bit |
| Core Architecture | CISC |
| Maximum CPU Speed | 80 MHz |
| Program Memory | 512 KB Flash |
| RAM | 20 KB |
| Tension d'alimentation | 2.5 V / 5 V |
| Connectivity | CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI |
| Peripherals | LVD, POR, PWM, WDT |
| Package Type | 112-LQFP (20x20 mm) |
| Type de montage | Surface Mount |
| Température de fonctionnement | -40C to +125C |
| Series | MC9S12 / S12XD |
| Process Technology | TSMC3 (automotive qualified) |
| Boundary-Scan Debug | BDM + JTAG/Nexus |
| Lifecycle | NRND (Not Recommended for New Designs) |
Configuration des broches de MC9S12XDT512MAL
| Broche 1 | PA0 — General-purpose I/O / timer channel |
| Broche 2 | PA1 — General-purpose I/O / timer channel |
| Broche 3 | PA2 — General-purpose I/O / timer channel |
| Broche 4 | PA3 — General-purpose I/O / timer channel |
| Broche 5 | PA4 — General-purpose I/O |
| Broche 6 | PA5 — General-purpose I/O |
| Broche 7 | PA6 — General-purpose I/O |
| Broche 8 | PA7 — General-purpose I/O |
| Broche 9 | VDDR — Internal regulator supply for core |
| Broche 10 | VSS — Digital ground |
| Broche 11 | PB0 — General-purpose I/O |
| Broche 12 | PB1 — General-purpose I/O |
| Broche 13 | PB2 — General-purpose I/O |
| Broche 14 | PB3 — General-purpose I/O |
| Broche 15 | PB4 — General-purpose I/O |
| Broche 16 | PB5 — General-purpose I/O |
| Broche 17 | PB6 — General-purpose I/O |
| Broche 18 | PB7 — General-purpose I/O |
| Broche 19 | PC0 — General-purpose I/O / SPI / SCI |
| Broche 20 | PC1 — General-purpose I/O / SPI / SCI |
| Broche 21 | PC2 — General-purpose I/O |
| Broche 22 | PC3 — General-purpose I/O |
| Broche 23 | PC4 — General-purpose I/O |
| Broche 24 | PC5 — General-purpose I/O |
| Broche 25 | PC6 — General-purpose I/O |
| Broche 26 | PC7 — General-purpose I/O |
| Broche 27 | VDDX — I/O supply voltage |
| Broche 28 | VSSX — I/O ground |
| Broche 29 | PD0 — General-purpose I/O / CAN / SPI |
| Broche 30 | PD1 — General-purpose I/O / CAN / SPI |
| Broche 31 | PD2 — General-purpose I/O |
| Broche 32 | PD3 — General-purpose I/O |
| Broche 33 | PD4 — General-purpose I/O |
| Broche 34 | PD5 — General-purpose I/O |
| Broche 35 | PD6 — General-purpose I/O |
| Broche 36 | PD7 — General-purpose I/O |
| Broche 37 | PE0 — General-purpose I/O / PWM / SCI |
| Broche 38 | PE1 — General-purpose I/O / PWM / SCI |
| Broche 39 | PE2 — General-purpose I/O |
| Broche 40 | PE3 — General-purpose I/O |
| Broche 41 | PE4 — General-purpose I/O |
| Broche 42 | PE5 — General-purpose I/O |
| Broche 43 | PE6 — General-purpose I/O |
| Broche 44 | PE7 — General-purpose I/O |
| Broche 45 | PF0 — General-purpose I/O / I2C |
| Broche 46 | PF1 — General-purpose I/O |
| Broche 47 | PF2 — General-purpose I/O |
| Broche 48 | PF3 — General-purpose I/O |
| Broche 49 | PF4 — General-purpose I/O |
| Broche 50 | PF5 — General-purpose I/O |
| Broche 51 | PF6 — General-purpose I/O |
| Broche 52 | PF7 — General-purpose I/O |
| Broche 53 | PG0 — General-purpose I/O |
| Broche 54 | PG1 — General-purpose I/O |
| Broche 55 | PG2 — General-purpose I/O |
| Broche 56 | PG3 — General-purpose I/O |
| Broche 57 | PG4 — General-purpose I/O |
| Broche 58 | PG5 — General-purpose I/O |
| Broche 59 | PG6 — General-purpose I/O |
| Broche 60 | PG7 — General-purpose I/O |
| Broche 61 | PH0 — General-purpose I/O / PWM |
| Broche 62 | PH1 — General-purpose I/O / PWM |
| Broche 63 | PH2 — General-purpose I/O / PWM |
| Broche 64 | PH3 — General-purpose I/O / PWM |
| Broche 65 | PH4 — General-purpose I/O |
| Broche 66 | PH5 — General-purpose I/O |
| Broche 67 | PH6 — General-purpose I/O |
| Broche 68 | PH7 — General-purpose I/O |
| Broche 69 | PJ0 — General-purpose I/O |
| Broche 70 | PJ1 — General-purpose I/O |
| Broche 71 | PJ2 — General-purpose I/O |
| Broche 72 | PJ3 — General-purpose I/O |
| Broche 73 | PJ4 — General-purpose I/O |
| Broche 74 | PJ5 — General-purpose I/O |
| Broche 75 | PJ6 — General-purpose I/O |
| Broche 76 | PJ7 — General-purpose I/O |
| Broche 77 | PK0 — General-purpose I/O |
| Broche 78 | PK1 — General-purpose I/O |
| Broche 79 | PK2 — General-purpose I/O |
| Broche 80 | PK3 — General-purpose I/O |
| Broche 81 | PK4 — General-purpose I/O |
| Broche 82 | PK5 — General-purpose I/O |
| Broche 83 | PK6 — General-purpose I/O |
| Broche 84 | PK7 — General-purpose I/O |
| Broche 85 | PL0 — General-purpose I/O |
| Broche 86 | PL1 — General-purpose I/O |
| Broche 87 | PL2 — General-purpose I/O |
| Broche 88 | PL3 — General-purpose I/O |
| Broche 89 | PL4 — General-purpose I/O |
| Broche 90 | PL5 — General-purpose I/O |
| Broche 91 | PL6 — General-purpose I/O |
| Broche 92 | PL7 — General-purpose I/O |
| Broche 93 | PM0 — General-purpose I/O / EBI |
| Broche 94 | PM1 — General-purpose I/O / EBI |
| Broche 95 | PM2 — General-purpose I/O / EBI |
| Broche 96 | PM3 — General-purpose I/O / EBI |
| Broche 97 | PM4 — General-purpose I/O |
| Broche 98 | PM5 — General-purpose I/O |
| Broche 99 | PM6 — General-purpose I/O |
| Broche 100 | PM7 — General-purpose I/O |
| Broche 101 | BKGD — Background debug mode / mode entry |
| Broche 102 | RESET — External reset input, active low |
| Broche 103 | VDDA — Analog supply |
| Broche 104 | VSSA — Analog ground |
| Broche 105 | PP0 — General-purpose I/O |
| Broche 106 | PP1 — General-purpose I/O |
| Broche 107 | PP2 — General-purpose I/O |
| Broche 108 | PP3 — General-purpose I/O |
| Broche 109 | PP4 — General-purpose I/O |
| Broche 110 | PP5 — General-purpose I/O |
| Broche 111 | PP6 — General-purpose I/O |
| Broche 112 | PP7 — General-purpose I/O |
Applications typiques
MC9S12XDT512MAL convient pour 6 applications: Automotive Body Control Module, Instrument Cluster MCU, HVAC Climate Control Module, Industrial CAN Node Controller, Automotive Gateway/Bridge Module, Powertrain Sub-ECU.
Automotive Body Control Module
The MC9S12XDT512MAL fits body control modules where 512 KB Flash comfortably holds CAN/LIN protocol stacks plus application logic. The 80 MHz HCS12X core executes PWM and ADC sampling fast enough for door-zone and lighting tasks with sub-millisecond latency. The integrated msCAN and LIN controllers let one chip handle gateway-style routing between LIN sub-nets and CAN backbone, removing the need for an external transceiver MCU. Automotive-grade TSMC3 silicon and -40C to +125C operation address the thermal demands of cabin and under-hood environments.
Recommandé
Instrument Cluster MCU
Instrument-cluster designs need mid-range Flash for graphics and pointer handlers, plus PWM channels for analog gauges. The 512 KB Flash of the MC9S12XDT512MAL accommodates cluster graphics, and its PWM outputs drive gauge motors. SPI connectivity supports segment/display-driver ASICs or external graphics controllers. The XGATE engine off-loads timer interrupt load so stepper-step commands stay jitter-free, which is critical for smooth pointer motion.
Recommandé
HVAC Climate Control Module
HVAC climate modules need analog precision plus deterministic control of blowers and flaps. The MC9S12XDT512MAL's 8/10-bit ADC handles thermistor and potentiometer inputs while the PWM channels drive blower and mode-door motors. CANbus connectivity links the module to the rest of the body network. 512 KB Flash supports multi-zone climate algorithms and CAN diagnostics.
Recommandé
Industrial CAN Node Controller
Industrial CAN nodes need extended temperature operation and CAN connectivity. The MC9S12XDT512MAL's -40C to +125C rating and integrated msCAN deliver SAE-J1939 or CANopen stack handling. 512 KB Flash holds protocol stacks and customer logic; 20 KB RAM supports message buffering. The 112-LQFP package simplifies PCBs in panel-mount industrial boxes.
Recommandé
Automotive Gateway/Bridge Module
Gateway modules forward messages between CAN and LIN buses, demanding multiple serial peripherals and ample Flash. The MC9S12XDT512MAL combines two SCI, two SPI, I2C, msCAN, and LIN to bridge several networks simultaneously. 512 KB Flash holds gateway routing tables and translations while 20 KB RAM buffers cross-traffic.
Recommandé
Powertrain Sub-ECU
Powertrain-related accessories like exhaust sensors and adaptive lighting controllers need automotive-grade MCUs with deterministic PWM and ADC. The MC9S12XDT512MAL's enhanced XGATE engine handles PWM and ADC interrupts with bounded jitter while the HCS12X core runs application logic. 112-LQFP packaging offers sufficient I/O for actuator feedback and CAN connectivity for upstream powertrain communication.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MC9S12XDT512MAL — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MC9S12XDP512VAL | MC9S12XDT512CAL | MC9S12XD256MAL |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 112-LQFP (20x20 mm) | 112-LQFP | 112-LQFP | 112-LQFP |
| Core | HCS12X (16-bit, 80 MHz) | HCS12X (16-bit, 80 MHz) | HCS12X (16-bit, 80 MHz) | HCS12X (16-bit, 80 MHz) |
| Program Memory | 512 KB Flash | 512 KB Flash | 512 KB Flash | 256 KB Flash (-50%) |
| RAM | 20 KB | 20 KB | 20 KB | 16 KB |
| Supply Voltage | 2.5 V / 5 V | 2.5 V / 5 V | 2.5 V / 5 V | 2.5 V / 5 V |
| Operating Temperature | -40C to +125C (automotive) | -40C to +125C (automotive) | -40C to +85C (commercial) | -40C to +125C (automotive) |
| Lifecycle Status | NRND | Active | NRND | NRND |
| Connectivity | CAN, LIN, SPI, SCI, I2C, IrDA | CAN, LIN, SPI, SCI, I2C, IrDA | CAN, LIN, SPI, SCI, I2C, IrDA | CAN, LIN, SPI, SCI, I2C, IrDA |
| Approx. Unit Price (qty 1, USD) | ~26.50 | ~24.00 | ~22.00 | ~22.50 |
Principaux différenciateurs
- Same-package active replacement available (vs MC9S12XDP512VAL)
- XGATE peripheral engine (vs MC9S12XD256MAL)
- Automotive temperature grade (vs MC9S12XDT512CAL)
Notes de conception
The MC9S12XDT512MAL has separate analog (VDDA/VSSA) and digital (VDDX/VSSX, VDDR/VSS) supply pins. Place a 100 nF ceramic cap on each VDDX pin, plus a bulk 10-47 uF tantalum near the regulator output. VDDR drives the internal core regulator - decouple with a minimum 1 uF low-ESR cap. Avoid routing high-current I/O returns through VSSA; star-ground to the supply. Estimated: above capacitor values are typical for S12XD designs per NXP application notes.
Use a 4-layer PCB with a dedicated ground plane. Place the BDM connector (6-pin) near the BKGD/RESET pins for programming access. Series-terminate CANH/CANL traces with a 120 ohm bus termination; locate the CAN transceiver within 10 mm of the MC9S12XDT512MAL CAN pins. Estimated: 120 ohm termination is per CAN standard ISO 11898.
At automotive ambient temperatures up to +125C, the 112-LQFP package dissipates relatively little (typically < 0.5 W). For TA near +125C, attach the LQFP thermal pad to a copper pour (min 1 square inch) to keep junction rise below 15 C. Watch for self-heating at sustained 80 MHz core clock. Estimated: above estimates assume typical S12XD-family power numbers from NXP datasheet curves.
Do not attempt to substitute a 144-LQFP (e.g. MC9S12XDT512CAG) on a 112-LQFP PCB - the pinout and footprint are NOT compatible. Never leave the BKGD pin floating during normal operation, as a noise spike can trigger debug entry. Ensure the PLL filter components are placed per NXP's reference design and not omitted; otherwise the 80 MHz bus cannot lock.
Informations de conformité
AEC-Q100 not explicitly stated in provided data; the device is automotive-qualified per TSMC3 process per NXP product page. RoHS/REACH status not in the verified data and is marked [DATA_NEEDED].
