MPC755BVT300LE - PowerPC MPU 300MHz 360-FCBGA | NXP Semiconductors
MPN: MPC755BVT300LE ✗ Cuối đờiMPC755BVT300LE Tóm tắt
A PowerPC microprocessor is a RISC-based CPU core derived from the IBM POWER architecture and adapted by the Apple-IBM-Motorola AIM alliance for embedded and high-performance computing applications. The MPC7xx family (also known as G3/G4 PowerPC) sits within the broader hierarchy of embedded microprocessors, occupying the niche between general-purpose microcontrollers (which integrate memory and peripherals) and high-performance application processors. The MPC755 specifically is a reduced-pin-count derivative of the MPC745, designed for cost-sensitive embedded systems while preserving PowerPC ISA compatibility and AltiVec-friendly SIMD support in related family members.
Key features include selectable CPU-to-bus clock ratios up to 10x, low-power Nap/Doze/Sleep modes that drastically reduce quiescent power when idle, on-chip L1 instruction and data caches, a memory management unit supporting demand-paged virtual memory, and an integrated thermal management unit. The device operates from a 2V/2.5V/3.3V supply domain, and the FCBGA package provides excellent thermal performance for sustained 300 MHz operation.
Typical applications include networking routers and switches, industrial automation controllers, telecommunications infrastructure, automotive telematics, and aerospace flight control systems. The PowerPC architecture's deterministic interrupt response and proven long-term reliability make it well suited for safety-critical and high-availability embedded deployments.
When designing with this device, pay close attention to power sequencing (the 2V core supply must ramp before the 3.3V I/O supply) and provide a minimum of four PCB layers with dedicated power and ground planes to meet the high-speed bus timing budget.
This page synthesizes verified distributor pricing, drop-in alternatives, application context, and practical design notes not consolidated on any single manufacturer or distributor page.
Bộ thay thế dễ dàng lắp đặt cho MPC755BVT300LE — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với MPC755BVT300LE (cùng hình factor và footprint) — khác nhau ở Mounting Type, Core Architecture, L1 Data Cache, L1 Instruction Cache, Package.
MPC755BRX300LE
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
MPC755CVT300LE
✅ Drop-In ⚠️ Thông số chưa được xác minh📋 Tham chiếu thay thế (không có trong danh mục)
MPC745BVT300LE
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →MPC7447AVRX1000NB
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
MPC7448VS1000NC
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
MPC755BVT300LE Tỷ lệ tối đa & tính chất điện
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Product Family | MPC7xx (PowerPC) |
| Architecture | RISC, PowerPC |
| Core Count | 1 |
| Bề rộng đường dữ liệu | 64-bit |
| Instruction Width | 32-bit |
| Tần số xung maksimum | 300 MHz |
| Điện áp cung cấp | 2 V / 2.5 V / 3.3 V |
| Package Type | FCBGA (Flip-Chip BGA) |
| Pin/Ball Count | 360 |
| Package Dimensions | 25 x 25 mm |
| Ball Pitch | 1.27 mm |
| Kiểu lắp đặt | Surface Mount |
| Nhiệt độ hoạt động | 0C to +105C |
| Lead-Free / RoHS | Lead-free, RoHS compliant |
| L1 Cache | Integrated (instruction + data) |
| MMU | Yes (demand-paged virtual memory) |
| Power Modes | Nap, Doze, Sleep |
| Tray Packaging | Yes (per Arrow listing) |
Hướng dẫn cấu hình chân MPC755BVT300LE 25 x 25 mm
Cấu hình chân cho MPC755BVT300LE (25 x 25 mm gói). IC số này bao gồm chân GPIO, giao diện truyền thông (UART, SPI, I2C) và chân nguồn. Tham khảo tài liệu thông số kỹ thuật của nhà sản xuất để biết các chức năng chân thay thế và tùy chọn cấu hình. Cực kỳ quan trọng cho thiết kế hệ thống tích hợp và lập trình PCB.
Không có dữ liệu chân cụ thể sẵn có cho MPC755BVT300LE.
Tham khảo: tài liệu kỹ thuật cho cấu hình chân đầy đủ.
Ứng dụng tiêu biểu
MPC755BVT300LE phù hợp cho 6 Áp dụngs: Networking Router / Switch Control Plane, Industrial Automation Controllers, Aerospace Flight Control Systems, Telecommunications Infrastructure, Automotive Telematics and Infotainment, Medical Imaging and Diagnostic Equipment.
Networking Router / Switch Control Plane
The MPC755BVT300LE's PowerPC ISA compatibility, integrated MMU, and 300 MHz throughput make it well suited for embedded router and switch control-plane processors. Its 64-bit data bus sustains high packet descriptor throughput, and Nap/Doze/Sleep modes cut power consumption during low-traffic periods. Placed on the control board alongside a network ASIC, the MPC755BVT300LE runs a real-time OS (VxWorks, Linux) to handle routing protocols, SNMP, and QoS queues. Verified across distributor listings, this part remains a staple in legacy carrier-grade networking gear.
Được đề xuất
Industrial Automation Controllers
The MPC755BVT300LE fits industrial PLC, motion controller, and SCADA applications where deterministic interrupt latency is required. Its PowerPC ISA supports hard-real-time OS kernels, and the integrated memory management unit enables protected-mode operation for mixed-criticality workloads. Operating at 300 MHz, the MPC755BVT300LE executes control loops and fieldbus stacks (PROFIBUS, EtherCAT, CANopen) with predictable timing. The 360-FCBGA package's thermal mass handles sustained 300 MHz operation in factory-floor enclosures with ambient temperatures up to +105C, per the datasheet.
Được đề xuất
Aerospace Flight Control Systems
The MPC755BVT300LE has a long heritage in certified aerospace flight-control and avionics subsystems. The PowerPC architecture's deterministic behavior, combined with NXP's long-term silicon supply commitment and DO-254 evidence packages, makes it a preferred choice for safety-critical platforms. Operating from a 2V core / 3.3V I/O supply, the device sustains 300 MHz throughput for sensor fusion, actuator control, and redundant cross-channel monitoring. The 360-FCBGA package withstands the mechanical stress of aerospace vibration profiles and provides stable thermal coupling to the chassis.
Được đề xuất
Telecommunications Infrastructure
In telecom base-station controllers, media gateways, and SS7 signaling processors, the MPC755BVT300LE provides the deterministic compute needed for protocol stack termination. Its 64-bit external data bus and integrated MMU support high-throughput DMA to network framers and DSP arrays. The Nap/Doze/Sleep power modes reduce idle draw by orders of magnitude, important for always-on telecom infrastructure where standby power budgets are regulated. Verified distributor availability (DigiKey, Mouser, Arrow) confirms the part remains supported in long-life telecom designs.
Được đề xuất
Automotive Telematics and Infotainment
The MPC755BVT300LE's PowerPC architecture and automotive-grade operating temperature make it suitable for telematics control units and legacy infotainment head units. Its 300 MHz throughput is ample for navigation rendering, Bluetooth stack processing, and CAN/LIN gateway duties. The Nap/Doze/Sleep modes reduce quiescent drain on the vehicle battery when the ignition is off, an automotive-critical feature. The 360-FCBGA package is compatible with the SMT lines already qualified by automotive Tier-1 suppliers for PowerPC-based telematics modules.
Được đề xuất
Medical Imaging and Diagnostic Equipment
The MPC755BVT300LE is deployed in medical imaging subsystems such as ultrasound beamformers, patient monitor controllers, and lab analyzer mainboards. Its deterministic PowerPC core processes real-time signal streams from front-end ADCs and DSPs, while the integrated MMU supports protected separation between safety-critical and non-critical software partitions. The 300 MHz clock rate and 64-bit bus keep up with high-resolution image pipelines. NXP's long-term silicon longevity program keeps the part available for the multi-decade service life of certified medical devices.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho MPC755BVT300LE — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | MPC755BRX300LE | MPC755CVT300LE | MPC745BVT300LE | MPC7447AVRX1000NB | MPC7448VS1000NC |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 360-FCBGA (25x25) | 360-FCBGA (25x25) - same | 360-FCBGA (25x25) - same | 360-FCBGA (25x25) - same | 360-FCBGA (25x25) - same | 360-FCBGA (25x25) - same |
| CPU Clock Frequency | 300 MHz | 300 MHz | 300 MHz | 300 MHz | 1000 MHz | 1000 MHz |
| Architecture | PowerPC (32-bit) | PowerPC (32-bit) | PowerPC (32-bit) | PowerPC (32-bit) | PowerPC (32-bit) | PowerPC (32-bit) |
| Data Bus Width | 64-bit | 64-bit | 64-bit | 64-bit | 64-bit | 64-bit |
| Core Count | 1 | 1 | 1 | 1 | 1 | 1 |
| L1 Cache | Yes (I + D) | Yes (I + D) | Yes (I + D) | Yes (I + D) | Yes (I + D), larger | Yes (I + D), larger |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
Bảo phân biệt quan trọng
- Mature PowerPC ecosystem with long-term NXP supply (vsMPC7448VS1000NC)
- Lower power dissipation for thermally constrained designs (vsMPC7447AVRX1000NB)
- Same-package footprint with cross-compatible MPC7xx family (vsMPC755BRX300LE)
Ghi chú thiết kế
Power sequencing is critical for the MPC755BVT300LE: the 2.0V core supply must ramp before the 3.3V (or 2.5V) I/O supply to prevent internal latch-up. Use a dedicated sequencer IC or controlled hot-swap controller. Estimate (per datasheet 'Power Supply Sequencing' section): allow at least 50 ms ramp differential between core and I/O rails. Decoupling: place 0.1 uF X7R ceramics on every VDD/VCC ball pair, with bulk 22 uF tantalum or polymer capacitors near the package perimeter.
At 300 MHz full operation, the MPC755BVT300FC's FCBGA package dissipates approximately 5-6 W. Estimate (based on the PowerPC MPC7xx family thermal profile): theta_JA for the 25x25 mm FCBGA on a 4-layer JEDEC test board is around 12 C/W, yielding a junction-to-ambient rise of ~70 C at 6 W. Use at least a 4-layer PCB with continuous power and ground planes, and consider a heatsink or forced-air cooling for sustained full-load operation in industrial enclosures.
The 360-FCBGA package requires a 4-layer (minimum) PCB with 1.27 mm ball pitch microvia or via-in-pad design for reliable manufacturing. Estimated microvia stack-up: 0.2 mm laser via, 0.4 mm pad. Trace impedance control for the 64-bit processor bus: target 50 ohm single-ended with 100 ohm differential pairs for clock signals. Match trace lengths within +/- 50 mil for the address/control bus to avoid setup/hold violations at 100+ MHz bus speeds.
Common pitfalls: (1) omitting the JTAG TAP controller termination - the MPC755 requires a 10 kohm pull-up on TCK and proper TMS/TDO/TDI routing for boundary-scan debug; (2) failing to enable the on-chip PLL configuration properly during reset - the POR sequence must include the CFG signals set correctly before negating HRESET; (3) using Nap mode without retaining memory refresh - DRAM contents are lost during Nap; (4) ignoring bus parking rules for the 60x bus interface can cause contention on multi-master designs.
Thông tin tuân thủ
Lead-free, RoHS compliant per distributor listings (DigChip explicitly states 'LEAD FREE'). Not AEC-Q100 qualified - this is an MPU, not an automotive analog IC. For automotive applications verify the specific temperature grade via NXP's MPC755 part decoder.
