MPC859PZP133A - 133MHz PowerQUICC MPU 357-BGA | NXP Semiconductors
MPN: MPC859PZP133A ✗ Cuối đờiMPC859PZP133A Tóm tắt
A PowerQUICC MPC8xx processor combines a CPU core with a dedicated communications engine. The CPU handles the operating system, control plane, and exception processing; the CPM offloads serial protocols (Ethernet, HDLC, ATM, UART, TDM, etc.) into dedicated RISC microsequencers and DMA channels, leaving the host CPU free to run application stacks. Compared with a discrete CPU plus external MAC, the integrated CPM reduces system cost, board area, and interrupt latency.
Key features of the MPC859PZP133A include a 133 MHz core clock, 32-bit Power Architecture integer unit, a CPM supporting 10 Mbps Ethernet plus 10/100 Ethernet, integrated DRAM controller, and power management modes with low-power idle. The 357-PBGA package provides high I/O count for parallel memory and MII/RMII serial interfaces. According to the manufacturer datasheet, the device operates from a 1.8V/2.2V core and 3.3V I/O rail and is specified over the 0C to +95C ambient range.
Architecture-wise the MPC859 is a faster silicon revision of the MPC860 family with enhanced SAR (ESAR) ATM functionality, port-to-port ATM switching, and multiple APC priority levels. The 133 MHz speed grade supports deterministic PPP, frame relay, and bridging traffic at line rate.
Typical applications include branch-office routers, integrated access devices (IADs), industrial serial-to-IP gateways, and ISDN/DSL modem routers. Built-in Ethernet and serial channels allow a single chip to terminate WAN, LAN, and console links without an external PHY controller.
When designing with this part, ensure the 1.8V core and 3.3V I/O rails are sequenced per the datasheet, place decoupling capacitors inside 5 mm of every power pin, and keep the JTAG trace length under 75 mm for reliable boundary-scan operation. Lead-free and RoHS status should be confirmed at order entry because some date codes contain lead.
This page synthesizes distributor stock, drop-in alternatives within the PowerQUICC family, and practical hardware-design notes not collected in any single manufacturer datasheet.
Bộ thay thế dễ dàng lắp đặt cho MPC859PZP133A — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với MPC859PZP133A (cùng hình factor và footprint) — khác nhau ở Operating Temperature, Core Architecture, Mounting Type, Lead Free Status, Package.
MPC866PZP133A
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →MPC859PVR133A
✅ Drop-In ⚠️ Thông số chưa được xác minhLiên hệ để biết giá
Xem tài liệu →MPC859TZP133A
✅ Drop-In ⚠️ Thông số chưa được xác minhLiên hệ để biết giá
Xem tài liệu →MPC866PVR133A
✅ Drop-In ⚠️ Thông số chưa được xác minh📋 Tham chiếu thay thế (không có trong danh mục)
MPC860TZP133A
✅ Drop-In ⚠️ Thông số chưa được xác minh📋 Tham chiếu thay thế (không có trong danh mục)
MPC866ADSP100A
✅ Drop-In ⚠️ Thông số chưa được xác minh📋 Tham chiếu thay thế (không có trong danh mục)
MPC859PZP133A Tỷ lệ tối đa & tính chất điện
| Processor Series | MPC8xx (PowerQUICC) |
| Core | Power Architecture 32-bit |
| Number of Cores | 1 |
| Bus Width | 32-bit |
| Core Frequency | 133 MHz |
| Co-Processor | Communications Processor Module (CPM) |
| RAM Controllers | DRAM |
| Ethernet | 10 Mbps (1 port), 10/100 (1 port) |
| Graphics Acceleration | No |
| Display & Interface Controllers | None |
| Core Voltage | 1.8 V |
| I/O Voltage | 3.3 V |
| Nhiệt độ hoạt động | 0 C to +95 C |
| Hộp / Vỏ | 357-PBGA (25x25 mm) |
| Kiểu lắp đặt | Surface Mount |
| Packaging | Tray |
| Lead Free Status | Contains Lead (some date codes) |
| Trạng thái RoHS | Non-Compliant (contains lead) |
| Part Lifecycle | Obsolete |
Hướng dẫn cấu hình chân MPC859PZP133A 357-pbga (25x25 mm)
Cấu hình chân cho MPC859PZP133A (357-pbga (25x25 mm) gói). IC số này bao gồm chân GPIO, giao diện truyền thông (UART, SPI, I2C) và chân nguồn. Tham khảo tài liệu thông số kỹ thuật của nhà sản xuất để biết các chức năng chân thay thế và tùy chọn cấu hình. Cực kỳ quan trọng cho thiết kế hệ thống tích hợp và lập trình PCB.
Không có dữ liệu chân cụ thể sẵn có cho MPC859PZP133A.
Tham khảo: tài liệu kỹ thuật cho cấu hình chân đầy đủ.
Ứng dụng tiêu biểu
MPC859PZP133A phù hợp cho 6 Áp dụngs: Branch-Office Router, Integrated Access Device (IAD), Industrial Serial-to-IP Gateway, ATM DSLAM Line Card, Embedded Industrial Control Board, Multi-Service TDM/VoIP Gateway.
Branch-Office Router
The MPC859PZP133A is well suited to branch-office routers where the integrated CPM offloads WAN protocols from the host CPU and the 133 MHz PowerQUICC core handles the control plane. With one 10/100 Ethernet MAC and serial-channel aggregation (HDLC/TDM), the part terminates WAN-side PPP/frame-relay pipes and LAN-side TCP/IP traffic on a single chip. Compared with a discrete CPU plus external MAC, the integrated CPM reduces BOM and PCB area. Designers can pair the part with a 32-bit DRAM and a 16-bit boot flash, and rely on the NXP-supplied Linux BSP for routing stacks.
Được đề xuất
Integrated Access Device (IAD)
In IADs that bundle DSL, Ethernet, and voice onto one customer-premises box, the MPC859PZP133A's ESAR engine and 133 MHz core aggregate multiple ATM virtual channels to a single 10/100 Ethernet uplink. The on-chip SAR and multi-level APC prioritise voice and video traffic over best-effort data, which is critical when an IAD feeds both IPTV and VoIP. Using a single chip for ATM termination and routing cuts the IAD bill of materials by roughly 30 percent relative to a discrete-CPU design. Compact PCB area also eases compliance with FCC Class B emissions limits.
Được đề xuất
Industrial Serial-to-IP Gateway
Serial-to-IP gateways sit on factory floors converting RS-232/RS-485 Modbus traffic to TCP/IP Ethernet. The MPC859PZP133A's multi-channel UART/Hdlc combined with Ethernet MACs lets a single chip run both the legacy serial stack and the IP stack in parallel. At 133 MHz the host CPU reserves enough headroom for a real-time embedded Linux control-plane, while the CPM hard-real-time handles Modbus polling latency. Industrial sites frequently require extended -40 C to +85 C variants; verify the suffix when ordering or choose the industrial grade MPXS version where available.
Được đề xuất
ATM DSLAM Line Card
ATM DSLAM line cards aggregate DSL traffic from many subscribers back to an upstream router. The MPC859PZP133A's ESAR engine, port-to-port ATM switching, and 133 MHz core enable it to terminate dozens of ATM virtual channels per device, with deterministic cell-level QoS. Compared with general-purpose CPUs, the integrated SAR enforces AAL5 and AAL2 segmentation without burdening the host, freeing the core for buffering and traffic shaping. This integration also reduces the dollar-per-port cost of a line-card slot.
Được đề xuất
Embedded Industrial Control Board
Industrial control boards require a deterministic processor with serial-channel aggregation, and the MPC859PZP133A's CPM provides multi-channel UART, SPI, and HDLC for motor-control and sensor-bus interfaces. The 133 MHz Power Architecture core runs the embedded RTOS, while the CPM executes time-critical bit-banging and motor-PWM generation. Industrial control is also sensitive to EMC; the integrated design replaces several peripheral ICs to reduce radiated emissions and EMI margin headroom. Designers usually pair the part with 64 MB SDRAM and a 4 MB flash for booting VxWorks.
Được đề xuất
Multi-Service TDM/VoIP Gateway
In multi-service TDM/VoIP gateways the MPC859PZP133A's TDM channel and ATM SAR terminate T1/E1 trunks while running VoIP/RTP stacks on the host CPU. At 133 MHz the Power Architecture core handles hundreds of G.711 voice channels with acceptable jitter, and the CPM off-loads time-slot management. Compared with a dedicated DSP plus CPU solution, the integrated design lowers BOM and power, which matters in customer-premises equipment that PoE-powers from the LAN.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho MPC859PZP133A — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | MPC866PZP133A | MPC859PVR133A | MPC859TZP133A | MPC866PVR133A | MPC860TZP133A | MPC866ADSP100A |
|---|---|---|---|---|---|---|---|
| Package | 357-PBGA (25x25) | 357-PBGA (25x25) | 357-PBGA (29x29) | 357-PBGA (25x25) | 357-PBGA (29x29) | 357-PBGA (25x25) | 357-PBGA (25x25) |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Frequency | 133 MHz | 133 MHz | 133 MHz | 133 MHz | 133 MHz | 133 MHz | 100 MHz |
| Core Architecture | PowerQUICC MPC8xx (32-bit) | MPC866 (USB add) | MPC859 | MPC859 industrial | MPC866 (USB add) | MPC860 (no ESAR) | MPC866 (USB add) |
| Ethernet MACs | 10 Mbps + 10/100 | 10 Mbps + 10/100 | 10 Mbps + 10/100 | 10 Mbps + 10/100 | 10 Mbps + 10/100 | 10 Mbps + 10/100 | 10 Mbps + 10/100 |
| USB Peripheral | No | Yes (USB 1.1 Full-Speed) | No | No | Yes (USB 1.1 Full-Speed) | No | Yes (USB 1.1 Full-Speed) |
| Atm SAR / ESAR | Yes (Enhanced SAR) | Yes | Yes | Yes | Yes | No (MPC860 has no ESAR) | Yes |
| Operating Temperature | 0 C to +95 C | 0 C to +95 C | 0 C to +95 C | -40 C to +85 C (industrial T) | 0 C to +95 C | -40 C to +85 C (industrial T) | 0 C to +95 C |
| RoHS Status | Non-Compliant (contains lead) | Non-Compliant | Non-Compliant | Non-Compliant | Non-Compliant | Non-Compliant | Non-Compliant |
| Lifecycle Status | Obsolete | Near EOL | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Bảo phân biệt quan trọng
- Enhanced SAR (ESAR) with multi-level APC priority (vsMPC860TZP133A)
- Higher 133 MHz core frequency (vsMPC866ADSP100A)
- Integrated communications processor module (CPM) (vsMPC866PZP133A)
Ghi chú thiết kế
Apply the 1.8 V core and 3.3 V I/O rails from separate regulators, sequencing core first then I/O (per datasheet). Measured inrush on the 1.8 V rail may exceed 1 A during CPM initialisation; use a soft-start ramp of at least 1 ms and bulk-decoupling within 5 mm of every power pin. Estimated: this is an empirical design rule, not a datasheet guarantee; verify with the IBIS model on a per-board basis before finalising BOM.
357-PBGA at 25x25 mm has a theta_JA of approximately 18 C/W with proper thermal-via array under the package. Estimated using standard JEDEC EIA/JESD51-7 4-layer board; verify with the actual PCB copper weight. In enclosures without airflow, derate junction temperature to 100 C to keep reliability margin above the 125 C junction max.
Route memory bus lines (32-bit) length-matched within 250 mil and kept on the top layer over an unbroken ground plane. Place 0.1 uF X7R decoupling within 3 mm of every power pin and a 10 uF bulk cap within 25 mm. The JTAG chain should be no longer than 75 mm to keep TCK rise-time under 5 ns at 25 MHz scan frequency.
Although the 357-PBGA is widely shared among MPC8xx family members (MPC860, MPC866, MPC859), the suffix Z (25x25) versus R (29x29) indicates different ball pitches - MPC859PVR133A is NOT pin-compatible with MPC859PZP133A and must not be subbed without board rework. ATM signalling requires correct impedance-matched traces, typically 50 ohm controlled, between the SAR and PHY.
Thông tin tuân thủ
RoHS status per DigiKey product page (Contains Lead). Reach compliance inherited from Motorola-era qualification. AEC-Q100 not applicable for processor ICs. Lead-free date codes exist with LF suffix - verify at order entry.