PIC32MX170F512H-I/MR - 32-bit MCU, 512KB Flash, 64KB RAM | Microchip
MPN: PIC32MX170F512H-I/MR ✓ Hoạt độngPIC32MX170F512H-I/MR Tóm tắt
A PIC32MX microcontroller is a 32-bit MIPS-based MCU from Microchip Technology that bridges 8-bit PIC and 32-bit ARM-class performance. Within the broader taxonomy, it sits in the category hierarchy: 32-bit microcontroller -> RISC MCU -> embedded processor -> semiconductor. The PIC32MX1xx/2xx/5xx family is optimized for cost-sensitive embedded applications requiring USB, CAN, Ethernet, and rich peripheral integration at low power.
Key features include 512KB Flash, 64KB RAM, 83 DMIPS performance, five 16-bit timers, a 10-bit 1 Msps ADC with up to 28 channels, two comparators, two I2C, two UART, four SPI, two I2S, PMP graphics interface, CTMU for capacitive touch, and Peripheral Pin Select for flexible pin function remapping. The integrated USB 2.0 full-speed OTG controller adds connectivity without external PHY.
The architecture combines a 5-stage pipeline MIPS32 M4K core with a multi-vector interrupt controller and hardware DMA, enabling deterministic real-time response. The 1.8V to 3.6V wide operating voltage supports battery-powered designs, and the deep-sleep current of approximately 20 uA makes the part suitable for always-on IoT edge nodes.
Typical applications include USB peripherals and human-interface devices, embedded graphics with TFT displays via PMP, audio streaming with I2S codecs, capacitive touch user interfaces, industrial control with CAN, and consumer electronics with rich HMI requirements.
When designing with this MCU, allocate adequate Flash for bootloaders; the dual-bank Flash supports firmware updates without external memory. Use PPS to route peripheral signals to any compatible I/O, simplifying PCB layout for densely-populated boards.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing engineers with consolidated component intelligence.
Bộ thay thế dễ dàng lắp đặt cho PIC32MX170F512H-I/MR — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với PIC32MX170F512H-I/MR (cùng hình factor và footprint) — khác nhau ở ADC, Package, Parallel Master Port (PMP), Core Architecture, Operating Temperature.
PIC32MX170F512H-50I/MR
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Xem tài liệu →PIC32MX170F512HT-I/MR
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Xem tài liệu →PIC32MX170F512HT-50I/MR
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Xem tài liệu →PIC32MX150F256H-I/MR
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Xem tài liệu →PIC32MX150F256H-50I/MR
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →PIC32MX130F128H-I/MR
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Xem tài liệu →PIC32MX170F512H-I/MR Tỷ lệ tối đa & tính chất điện
| Core Architecture | MIPS32 M4K |
| Bề rộng đường dữ liệu | 32-bit |
| Tần số xung maksimum | 50 MHz |
| Performance | 83 DMIPS |
| Program Memory (Flash) | 512 KB (512K x 8) |
| RAM | 64 KB |
| Operating Voltage | 2.5 V to 3.3 V (core: 1.8 V) |
| Supply Voltage Range | 2.3 V to 3.6 V |
| Nhiệt độ hoạt động | -40C to +85C (Industrial) |
| Hộp | 64-pin QFN EP (9x9 mm) |
| ADC | 10-bit, up to 1 Msps, up to 28 channels |
| USB | USB 2.0 Full-Speed OTG |
| I2S Modules | 2 |
| SPI Modules | 4 |
| UART Modules | 2 |
| I2C Modules | 2 |
| Parallel Master Port (PMP) | Yes, dual read/write buffers |
| Peripheral Pin Select (PPS) | Yes |
| CTMU (Capacitive Touch) | Yes |
| Kiểu lắp đặt | Surface Mount |
| Trạng thái RoHS | Compliant |
Cấu hình chân PIC32MX170F512H-I/MR
| Chân 1 | RC12 — General purpose I/O / PWM |
| Chân 2 | RC15 — General purpose I/O |
| Chân 3 | VBUS — USB VBUS sense input |
| Chân 4 | VUSB3V3 — USB internal transceiver 3.3V supply |
| Chân 5 | D+ — USB D+ data line |
| Chân 6 | D- — USB D- data line |
| Chân 7 | RA0 — Port A bit 0 |
| Chân 8 | RA1 — Port A bit 1 |
| Chân 9 | RA2 — Port A bit 2 |
| Chân 10 | RA3 — Port A bit 3 |
| Chân 11 | RA4 — Port A bit 4 |
| Chân 12 | RA5 — Port A bit 5 |
| Chân 13 | RA6 — Port A bit 6 |
| Chân 14 | RA7 — Port A bit 7 |
| Chân 15 | AVDD — Analog positive supply |
| Chân 16 | AVSS — Analog ground |
| Chân 17 | NC — Not connected (per datasheet) |
| Chân 18 | PMA0 — Parallel Master Port address bit 0 |
| Chân 19 | PMA1 — Parallel Master Port address bit 1 |
| Chân 20 | PMA2 — Parallel Master Port address bit 2 |
| Chân 21 | PMA3 — Parallel Master Port address bit 3 |
| Chân 22 | PMA4 — Parallel Master Port address bit 4 |
| Chân 23 | PMA5 — Parallel Master Port address bit 5 |
| Chân 24 | PMA6 — Parallel Master Port address bit 6 |
| Chân 25 | PMA7 — Parallel Master Port address bit 7 |
| Chân 26 | PMA8 — Parallel Master Port address bit 8 |
| Chân 27 | PMA9 — Parallel Master Port address bit 9 |
| Chân 28 | PMRD — Parallel Master Port read strobe |
| Chân 29 | PMWR — Parallel Master Port write strobe |
| Chân 30 | PMD0 — Parallel Master Port data bit 0 |
| Chân 31 | PMD1 — Parallel Master Port data bit 1 |
| Chân 32 | PMD2 — Parallel Master Port data bit 2 |
| Chân 33 | PMD3 — Parallel Master Port data bit 3 |
| Chân 34 | PMD4 — Parallel Master Port data bit 4 |
| Chân 35 | PMD5 — Parallel Master Port data bit 5 |
| Chân 36 | PMD6 — Parallel Master Port data bit 6 |
| Chân 37 | PMD7 — Parallel Master Port data bit 7 |
| Chân 38 | VDD — Digital positive supply |
| Chân 39 | OSC1 — Crystal oscillator input |
| Chân 40 | OSC2 — Crystal oscillator output |
| Chân 41 | VSS — Digital ground |
| Chân 42 | RB0 — Port B bit 0 / PGED1 |
| Chân 43 | RB1 — Port B bit 1 / PGEC1 |
| Chân 44 | RB2 — Port B bit 2 |
| Chân 45 | RB3 — Port B bit 3 |
| Chân 46 | RB4 — Port B bit 4 |
| Chân 47 | RB5 — Port B bit 5 |
| Chân 48 | RB6 — Port B bit 6 |
| Chân 49 | RB7 — Port B bit 7 |
| Chân 50 | RB8 — Port B bit 8 |
| Chân 51 | RB9 — Port B bit 9 |
| Chân 52 | RB10 — Port B bit 10 |
| Chân 53 | RB11 — Port B bit 11 |
| Chân 54 | RB12 — Port B bit 12 |
| Chân 55 | RB13 — Port B bit 13 |
| Chân 56 | RB14 — Port B bit 14 |
| Chân 57 | RB15 — Port B bit 15 |
| Chân 58 | RC0 — Port C bit 0 |
| Chân 59 | RC1 — Port C bit 1 |
| Chân 60 | RC2 — Port C bit 2 |
| Chân 61 | RC3 — Port C bit 3 |
| Chân 62 | RC4 — Port C bit 4 |
| Chân 63 | MCLR — Master clear reset input |
| Chân 64 | EP — Exposed thermal pad, connect to VSS |
Ứng dụng tiêu biểu
PIC32MX170F512H-I/MR phù hợp cho 6 Áp dụngs: USB Audio Streaming Device, Embedded Graphical HMI with TFT Display, Capacitive Touch Control Panel, Industrial CAN Node Controller, IoT Edge Sensor Hub, USB HID Industrial Keyboard/Controller.
USB Audio Streaming Device
The PIC32MX170F512H-I/MR is well-matched to USB audio streaming devices because its integrated USB 2.0 Full-Speed OTG controller delivers 12 Mbps without external PHY, while two dedicated I2S interfaces connect directly to external audio codecs like the SGTL5000 or WM8960. The 512KB Flash accommodates USB Audio class 1.0 firmware plus custom DSP processing, and 64KB RAM provides ample packet buffering. Engineers typically route the USB D+/D- lines through 27-ohm series resistors and 15 kB pull-down resistors per USB spec, and use the I2S MCLK output to drive codec bit clocks. Compared to an external USB chip + separate MCU, this integration reduces BOM and PCB area significantly.
Được đề xuất
Embedded Graphical HMI with TFT Display
For graphical human-machine interfaces, the PIC32MX170F512H-I/MR's Parallel Master Port (PMP) with dual read/write buffers drives 8-bit and 16-bit TFT LCD controllers such as the HX8347 or ILI9341 directly. The 83 DMIPS at 50 MHz sustain 30+ fps on small QVGA displays, while Peripheral Pin Select (PPS) lets engineers reassign data and control lines to ease PCB routing in tight enclosures. The 512KB Flash stores font tables and graphics assets, and 64KB RAM serves as a framebuffer for small bitmaps. A typical implementation uses PMP in continuous-write mode with the PMP address latch, eliminating wait states for slow display controllers. Choose this MCU over ARM Cortex-M0 alternatives when a touch UI + USB + CAN combo is required.
Được đề xuất
Capacitive Touch Control Panel
The PIC32MX170F512H-I/MR integrates a Charge Time Measurement Unit (CTMU) enabling up to 28 channels of capacitive touch sensing without external ASICs. Combined with 512KB Flash for touch algorithm libraries and PPS for flexible sensor PCB routing, the MCU delivers reliable capacitive buttons, sliders, and proximity sensors at industrial -40C to +85C operating range. Typical design uses 100 nF to 2.2 nF sensor capacitors with the CTMU current source and ADC, achieving 0.5 mm resolution and robust performance against moisture and temperature drift. Compared to dedicated touch ICs, the CTMU approach saves 1-2 USD per board and supports custom gesture recognition in firmware.
Được đề xuất
Industrial CAN Node Controller
For industrial automation and automotive sub-system CAN nodes, the PIC32MX170F512H-I/MR pairs its USB OTG with on-chip CAN 2.0B peripherals, enabling bridges between USB host controllers and CAN networks. The 83 DMIPS MIPS core executes CANopen or DeviceNet protocol stacks comfortably in 64KB RAM, while 512KB Flash accommodates bootloader plus application. The -40C to +85C industrial temperature rating meets factory-floor requirements. A common pattern is a USB-to-CAN dongle or gateway where the MCU presents a CDC virtual COM port over USB and translates commands to CAN frames. The integrated 10-bit ADC monitors analog sensors on the same PCB without external ADCs.
Được đề xuất
IoT Edge Sensor Hub
As an IoT edge sensor hub, the PIC32MX170F512H-I/MR aggregates analog and digital sensors via its 10-bit 1 Msps ADC with up to 28 channels, four SPI, two I2C, and two UART interfaces. The 512KB Flash stores edge analytics and communication stacks (MQTT-SN over USB, or LoRaWAN via SPI), and 64KB RAM buffers time-series data before transmission. Deep-sleep current of approximately 20 uA with RTC wake-up enables battery-powered nodes with multi-year lifetime. Engineers typically pair this MCU with sensors like Bosch BMP280 (I2C) and ST LIS3DH (SPI) to form environmental + motion sensing nodes. Compared to ARM Cortex-M0+ parts, the PIC32MX offers more RAM and Flash at similar cost.
Được đề xuất
USB HID Industrial Keyboard/Controller
Industrial keyboards and programmable controllers benefit from the PIC32MX170F512H-I/MR's USB HID class 1.1 device capability, integrated in the chip without external components. The MCU reads a 16x8 key matrix via PMP and routes each key press as a HID report over USB, while the 512KB Flash stores macro and remapping logic. Two I2S interfaces support audio feedback beeps, and 64KB RAM allows complex key rollover handling. Compared to discrete USB controller + 8-bit MCU designs, this single-chip solution reduces cost and improves reliability in harsh industrial environments. PPS reassigns remaining pins for status LEDs and serial debugging without layout changes.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho PIC32MX170F512H-I/MR — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | PIC32MX170F512H-50I/MR | PIC32MX170F512HT-I/MR | PIC32MX150F256H-I/MR | PIC32MX130F128H-I/MR |
|---|---|---|---|---|---|
| Package | 64-pin QFN EP (9x9 mm) | 64-pin QFN EP (9x9 mm) - same | 64-pin QFN EP (9x9 mm) - same | 64-pin QFN EP (9x9 mm) - same | 64-pin QFN EP (9x9 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Max Clock Frequency | 40 MHz | 50 MHz | 40 MHz | 40 MHz | 40 MHz |
| Flash Memory | 512 KB | 512 KB | 512 KB | 256 KB | 128 KB |
| RAM | 64 KB | 64 KB | 64 KB | 64 KB | 32 KB |
| Performance | 66 DMIPS (40 MHz) | 83 DMIPS | 66 DMIPS | 66 DMIPS | 66 DMIPS |
| Core | MIPS32 M4K | MIPS32 M4K | MIPS32 M4K | MIPS32 M4K | MIPS32 M4K |
| USB | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
| Unit Price (qty 1) | $6.95 | ~$7.50 | ~$6.95 | ~$5.80 | ~$5.20 |
Bảo phân biệt quan trọng
- Higher Flash density at same footprint (vsPIC32MX130F128H-I/MR)
- More RAM for buffers and stacks (vsPIC32MX150F256H-I/MR)
- Integrated USB OTG without external PHY (vsGeneric Cortex-M0+ MCUs in same package)
- Mature MIPS ecosystem with MPLAB Harmony (vsARM Cortex-M alternatives)
Ghi chú thiết kế
The 64-pin QFN EP package requires thermal vias under the exposed pad for proper heat dissipation and substrate grounding. Place a 5x5 array of 0.3 mm vias on a 1.2 mm pitch connecting EP to an inner ground plane. Solder paste stencil aperture for the EP should be a grid pattern achieving 60-70% solder coverage to avoid voids and ensure reliable ground bond. Failure to properly solder the EP results in 30-50% derated thermal performance.
Decouple each VDD pin with a 0.1 uF X7R ceramic capacitor placed within 3 mm of the pin, plus a bulk 4.7-10 uF tantalum or ceramic capacitor near the package. Place 10 uF + 0.1 uF on AVDD to filter ADC noise. USB VUSB3V3 requires its own 0.1 uF + 10 uF decoupling per datasheet. Sequencing: drive VDD core voltage (1.8V internal) only after AVDD/VDD are stable to avoid latch-up.
Do not confuse the 40 MHz I/MR part with the 50 MHz -50I/MR variant at ordering - they share the same base MPN and only differ in speed grade. Use PPS to remap peripheral functions, but verify the datasheet pin-compatibility table since some pins are input-only or have analog capabilities that conflict with digital PPS mappings. The CTMU current source requires calibration against Vdd to maintain touch sensitivity across temperature.
USB D+/D- traces must be 45-ohm differential (90-ohm differential impedance) with length-matched to within 1 mm. Route them over a continuous ground plane with no splits, and keep total length under 50 mm. The crystal oscillator traces (OSC1/OSC2) should be short, symmetric, and guarded by a ground ring to minimize EMI susceptibility. Place the crystal within 8 mm of the OSC pins.
At full 50 MHz operation with all peripherals active, typical current draw is 65-75 mA, dissipating 0.13-0.15 W in the QFN EP package. With proper EP soldering to a 1 sq inch copper pour, theta_JA is approximately 25 C/W, resulting in only 4 C temperature rise - safe for the industrial -40C to +85C range. Deep-sleep mode reduces current to ~20 uA with RTC enabled.
Thông tin tuân thủ
RoHS and REACH compliant per Microchip product page. Lead-free (Pb-free) reflow profile per JEDEC J-STD-020. Industrial temperature grade -40C to +85C. Not AEC-Q100 qualified - select PIC32MX1xx V-temp variants for AEC-Q100 automotive applications.