RTAX2000S-1CGS624EV - 2M-Gate Rad-Tolerant FPGA | Microchip
MPN: RTAX2000S-1CGS624EV ✓ Hoạt độngRTAX2000S-1CGS624EV Tóm tắt
A radiation-tolerant FPGA is a field-programmable gate array engineered to survive the single-event effects and total ionizing dose found in space-flight radiation environments. Within the power hierarchy, it belongs to the programmable logic device (PLD) family: FPGA -> radiation-tolerant FPGA -> space-grade programmable logic. Unlike SRAM FPGAs that require external configuration, RTAX-S devices are one-time programmable anti-fuse based, providing true single-chip, live-at-power-up operation that eliminates the need for a configuration PROM and reduces boot-time vulnerability.
Key features include SEU-hardened registers that eliminate the need for Triple-Module Redundancy (TMR), immunity to single-event upsets to a specified LET threshold, and a quoted SEU rate of less than 10-10 errors per bit-day, plus embedded SRAM with built-in FIFO control logic, segmentable clock resources, and chip-wide highway routing inherited from the commercial Axcelerator family architecture.
Technically, the RTAX2000S derives from the Axcelerator fabric with radiation hardening by design. The anti-fuse interconnect is inherently immune to configuration upsets, so only user registers require SEU hardening. Embedded SRAM blocks support FIFO and dual-port operation for on-board data processing and payload buffering. Roughly 250,000 equivalent ASIC gates of embedded resources supplement the programmable fabric in the RTAX-DSP oriented members.
Typical applications include satellite payload data processing, spacecraft command and data handling (C&DH), telemetry encoder/decoder logic, and instrument control in low-Earth-orbit and deep-space missions where reprogrammability is not required and radiation robustness is paramount.
A key design consideration is that the CGA-624 ceramic package requires a compatible land pattern and column-grid socket strategy; verify thermal resistance per the JEDEC JESD51 simulation conditions cited in the manufacturer datasheet.
This page synthesizes distributor listings, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet.
Bộ thay thế dễ dàng lắp đặt cho RTAX2000S-1CGS624EV — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với RTAX2000S-1CGS624EV (cùng hình factor và footprint) — khác nhau ở Package, Configuration, Equivalent System Gates, Family, Radiation Tolerance.
RTAX2000SL-1CGS624B
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →RTAX2000SL-CGS624V
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →RTAX2000S-1CG624E
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
RTAX2000S-1CG624V
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
RTAX2000S-CGS624E
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
RTAX2000S-1CGS624EV Tỷ lệ tối đa & tính chất điện
| System Gates | 2,000,000 |
| Logic Cells (CLBs) | 21504 |
| Total Cells | 32256 |
| Additional ASIC Equivalent Gates | 250000 |
| Hộp | 624-pin Ceramic Column Grid Array (CGA-624 / CCGA624) |
| Core Supply Voltage | 1.5 V nominal (1.425 V to 1.575 V) |
| Nhiệt độ hoạt động | -55C to +125C |
| Process Technology | 0.15 um CMOS |
| Maximum Frequency | 649 MHz |
| Logic Family | CMOS |
| SEU Immunity | SEU-hardened registers, immune to single-event upsets to specified LET threshold |
| SEU Rate | < 10-10 errors/bit-day |
| Configuration | One-time programmable anti-fuse, live at power-up, single chip |
| Embedded Memory | Embedded SRAM with built-in FIFO control logic |
| Kiểu lắp đặt | Surface Mount |
| Product Family | RTAX-S/SL and RTAX-DSP Radiation-Tolerant FPGAs |
| Thermal Resistance Basis | JEDEC JESD51 simulation conditions (per datasheet) |
Hướng dẫn cấu hình chân RTAX2000S-1CGS624EV 624-pin ceramic column grid array (cga-624 / ccga624)
Cấu hình chân cho RTAX2000S-1CGS624EV (624-pin ceramic column grid array (cga-624 / ccga624) gói). IC số này bao gồm chân GPIO, giao diện truyền thông (UART, SPI, I2C) và chân nguồn. Tham khảo tài liệu thông số kỹ thuật của nhà sản xuất để biết các chức năng chân thay thế và tùy chọn cấu hình. Cực kỳ quan trọng cho thiết kế hệ thống tích hợp và lập trình PCB.
Không có dữ liệu chân cụ thể sẵn có cho RTAX2000S-1CGS624EV.
Tham khảo: tài liệu kỹ thuật cho cấu hình chân đầy đủ.
Ứng dụng tiêu biểu
RTAX2000S-1CGS624EV phù hợp cho 6 Áp dụngs: Satellite Payload Data Processing, Spacecraft Command and Data Handling (C&DH), Telemetry Encoder/Decoder and Downlink Formatting, Instrument Control for Space Science Missions, Launch Vehicle Avionics and Flight Logic, Radiation Test and Engineering Model Development.
Satellite Payload Data Processing
The RTAX2000S-1CGS624EV fits satellite payload processing because its 2,000,000 system gates and 21,504 CLBs provide enough fabric for on-board image compression, filtering, and protocol adaptation, while embedded SRAM with built-in FIFO control handles high-rate data streaming without external memory. Its SEU-hardened registers deliver an SEU rate below 10-10 errors/bit-day without Triple-Module Redundancy, preserving gate capacity for payload functions. In the signal chain, the FPGA typically sits between sensor front-ends and downlink formatters, clocked from segmentable on-chip clock resources up to 649 MHz capability. Because the anti-fuse fabric is live at power-up, payload start-up latency is minimal compared to SRAM FPGA solutions that must load configuration from external memories in orbit.
Được đề xuất
Spacecraft Command and Data Handling (C&DH)
For C&DH modules, the RTAX2000S-1CGS624EV provides glue logic, bus interfacing, telemetry formatting, and housekeeping functions on a single rad-tolerant chip. The single-chip, live-at-power-up anti-fuse architecture removes the external configuration PROM that is a common single point of failure in space avionics, improving overall reliability. The 624-pin CCGA package supplies abundant I/O for MIL-STD-style bus and discrete interfaces, and the -55C to +125C rating covers worst-case thermal environments in unheated equipment bays. Designers typically combine the FPGA with a rad-hardened microcontroller, using the FPGA for time-critical framing and memory-mapped register decoding while the processor handles higher-layer telemetry management, keeping critical paths within the deterministic FPGA fabric.
Được đề xuất
Telemetry Encoder/Decoder and Downlink Formatting
Downlink chains benefit from the RTAX2000S-1CGS624EV's deterministic anti-fuse timing and 649 MHz fabric capability, which support CCSDS-style channel coding and framing at high symbol rates. Embedded FIFO-organized SRAM buffers data between the payload source clock domain and the encoder clock domain, while SEU-hardened registers protect protocol state machines without TMR overhead. The 21,504 CLBs accommodate parallelizer, scrambler, and Reed-Solomon style blocks with margin for redundancy. Placement between the payload router and the modulator keeps switching activity localized; the 1.5V nominal core supply (1.425V-1.575V) limits dynamic power, an important consideration for power-constrained smallsat buses relying on limited solar array margin during eclipse operations.
Được đề xuất
Instrument Control for Space Science Missions
Science instruments on LEO and deep-space missions use the RTAX2000S-1CGS624EV for detector timing generation, ADC interface sequencing, and autonomous event handling. The -55C to +125C operating range and hermetic ceramic CCGA-624 package withstand launch vibration and cryogenically cold instrument bays, while the anti-fuse interconnect is immune to configuration upsets, so detector timing patterns cannot be corrupted in flight. SEU-hardened registers keep exposure-control counters valid at the datasheet LET threshold. Because the device is live at power-up, instruments begin acquiring data immediately after turn-on without a configuration load interval, which matters for time-critical observation windows such as planetary flybys and occultation measurements where every second of uptime is scientifically valuable.
Được đề xuất
Launch Vehicle Avionics and Flight Logic
Launch vehicles demand logic that is operational within milliseconds of power application and immune to vibration-induced configuration loss; the RTAX2000S-1CGS624EV meets both needs with its single-chip anti-fuse architecture rated to +125C and -55C. Typical roles include stage-separation sequencing, safe-and-arm interface monitoring, and telemetry multiplexing, where SEU-hardened registers protect state machines from single-event upsets during passes through the South Atlantic Anomaly or during solar particle events. The 2M-gate fabric implements multiple redundant channels of critical logic with voting, and the extensive 624-pin I/O count accommodates discrete pyrotechnic channel interfaces, analog monitor digitization support, and redundant MIL-STD-1553-style bus interfaces on one rad-tolerant device.
Được đề xuất
Radiation Test and Engineering Model Development
Programs building engineering models (EM) and radiation test vehicles use the RTAX2000S-1CGS624EV alongside commercial-temperature family prototypes to de-risk flight designs. Logic is developed in the Microchip/Libero tool flow on commercial ProASIC or Axcelerator-based platforms, then targeted to the RTAX-S fabric; using the same die (21504 CLBs, 2M gates) for EM and flight units minimizes re-verification. Test teams populate CCGA-624 evaluation boards for heavy-ion and proton testing, using the datasheet LET threshold and the sub-10-10 errors/bit-day SEU rate as acceptance criteria. Traceable ordering suffixes (E vs V flow) let programs separate engineering screening from flight lot certification while keeping a common footprint across all build phases.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho RTAX2000S-1CGS624EV — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | RTAX2000SL-1CGS624B | RTAX2000S-1CG624E | RTAX2000S-1CG624V | RTAX2000S-CGS624E |
|---|---|---|---|---|---|
| Package | CGS624 (CCGA-624, ceramic) | CGS624 (CCGA-624) - same footprint | CBGA624/CGA624 - same 624-pin ceramic family | CBGA624/CGA624 - same 624-pin ceramic family | CGS624 (CCGA-624) - same footprint |
| Brand | Microchip Technology (Actel/Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 2,000,000 | 2,000,000 | 2,000,000 | 2,000,000 | 2,000,000 |
| Logic Cells (CLBs) | 21504 | 21504 | 21504 | 21504 | 21504 |
| Core Supply Voltage | 1.5 V nominal (1.425-1.575 V) | 1.5 V nominal | 1.5 V nominal (1.425-1.575 V) | 1.5 V nominal (1.425-1.575 V) | 1.5 V nominal |
| Operating Temperature | -55C to +125C | -55C to +125C | -55C to +125C | -55C to +125C | -55C to +125C |
| Speed Grade / Flow Suffix | Speed -1, V flow | Speed -1, B flow (SL variant) | Speed -1, E flow | Speed -1, V flow | Standard speed, E flow |
| SEU Hardening | SEU-hardened registers, SEU rate < 10-10 errors/bit-day | Same SEU-hardened registers (SL enhanced) | Same SEU-hardened registers | Same SEU-hardened registers | Same SEU-hardened registers |
| Configuration Architecture | Anti-fuse OTP, single-chip, live at power-up | Anti-fuse OTP, single-chip | Anti-fuse OTP, single-chip | Anti-fuse OTP, single-chip | Anti-fuse OTP, single-chip |
Bảo phân biệt quan trọng
- V screening flow option (vsRTAX2000S-1CG624E)
- Enhanced SL fabric features available in same footprint (vsRTAX2000SL-CGS624V)
- Single-chip live-at-power-up operation (vsSRAM-based space FPGAs (e.g., Xilinx space-grade Virtex, not pin compatible))
- Trade-off: fixed 2M-gate density (vsRTAX4000SL-CQ352E)
Ghi chú thiết kế
The 624-pin ceramic column grid array uses column terminations rather than solder balls; verify your PCB land pattern and reflow profile against the manufacturer CCGA assembly application guidance. Distributor data lists a 1.270 mm terminal pitch for the CGA624 package, requiring controlled warp ceramic handling and X-ray inspection post-assembly. Estimate: allow expansion joints or under-stiffener strategies when mounting on FR-4 to relieve CTE mismatch between the ceramic package and organic board over thermal cycling from -55C to +125C.
Supply the core at 1.5 V nominal within the 1.425 V to 1.575 V window per Microchip USA listing; use a rad-tolerant or board-level tolerant point-of-load regulator with sequencing appropriate to the RTAX-S power-up requirements described in the manufacturer datasheet. Because anti-fuse FPGAs draw no configuration current at power-up, inrush is governed mainly by decoupling capacitor charging; size bulk capacitance for the bus voltage droop budget. Verify I/O bank supply voltage values in the official datasheet before finalizing the power tree.
Ordering-code suffixes matter in space programs: CG624 vs CGS624 package codings and E vs V flow options indicate different screening, and some family members are explicitly NOT pin compatible in certain packages (the datasheet states RTAX2000S/SL and RTAX2000D/DL are not pin compatible in the CQ352 package; RTAX4000 overhang differs slightly). Confirm pin compatibility for your exact package code before reusing a layout. Also do not assume speed-grade interchangeability - the -1 grade timing files differ from standard grade in timing-driven place-and-route.
Thông tin tuân thủ
Space-grade ceramic CCGA package; hermetic ceramic packaging typically precludes standard RoHS lead-free solder column finishing - verify flow-level compliance documentation with Microchip for the exact V-flow lot. No compliance data found in provided web results.
