RTAX2000S-1CGS624EV - 2M-Gate Rad-Tolerant FPGA | Microchip
MPN: RTAX2000S-1CGS624EV β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4500 | $4,500.00 |
| 10 | $4275 | $42,750.00 |
| 100 | $4050 | $405,000.00 |
| 500 | $3825 | $1,912,500.00 |
| 1,000 | $3600 | $3,600,000.00 |
Drop-in alternatives for RTAX2000S-1CGS624EV β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
RTAX2000SL-1CGS624B
β Drop-Inβ In Stock
Contact for price
View Datasheet βRTAX2000SL-CGS624V
β Drop-Inβ In Stock
$6500 / Unit
View Datasheet βRTAX2000S-1CG624E
β Drop-Inπ Reference alternative (not in catalog)
RTAX2000S-1CG624V
β Drop-Inπ Reference alternative (not in catalog)
RTAX2000S-CGS624E
β Drop-Inπ Reference alternative (not in catalog)
RTAX2000S-1CGS624EV Maximum Ratings & Electrical Characteristics
| System Gates | 2,000,000 |
| Logic Cells (CLBs) | 21504 |
| Total Cells | 32256 |
| Additional ASIC Equivalent Gates | 250000 |
| Package | 624-pin Ceramic Column Grid Array (CGA-624 / CCGA624) |
| Core Supply Voltage | 1.5 V nominal (1.425 V to 1.575 V) |
| Operating Temperature | -55C to +125C |
| Process Technology | 0.15 um CMOS |
| Maximum Frequency | 649 MHz |
| Logic Family | CMOS |
| SEU Immunity | SEU-hardened registers, immune to single-event upsets to specified LET threshold |
| SEU Rate | < 10-10 errors/bit-day |
| Configuration | One-time programmable anti-fuse, live at power-up, single chip |
| Embedded Memory | Embedded SRAM with built-in FIFO control logic |
| Mounting Type | Surface Mount |
| Product Family | RTAX-S/SL and RTAX-DSP Radiation-Tolerant FPGAs |
| Thermal Resistance Basis | JEDEC JESD51 simulation conditions (per datasheet) |
RTAX2000S-1CGS624EV 624-pin ceramic column grid array (cga-624 / ccga624) Pin Configuration Guide
Complete pinout information for RTAX2000S-1CGS624EV (624-pin ceramic column grid array (cga-624 / ccga624) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for RTAX2000S-1CGS624EV.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
RTAX2000S-1CGS624EV is suitable for 6 applications: Satellite Payload Data Processing, Spacecraft Command and Data Handling (C&DH), Telemetry Encoder/Decoder and Downlink Formatting, Instrument Control for Space Science Missions, Launch Vehicle Avionics and Flight Logic, Radiation Test and Engineering Model Development.
Satellite Payload Data Processing
The RTAX2000S-1CGS624EV fits satellite payload processing because its 2,000,000 system gates and 21,504 CLBs provide enough fabric for on-board image compression, filtering, and protocol adaptation, while embedded SRAM with built-in FIFO control handles high-rate data streaming without external memory. Its SEU-hardened registers deliver an SEU rate below 10-10 errors/bit-day without Triple-Module Redundancy, preserving gate capacity for payload functions. In the signal chain, the FPGA typically sits between sensor front-ends and downlink formatters, clocked from segmentable on-chip clock resources up to 649 MHz capability. Because the anti-fuse fabric is live at power-up, payload start-up latency is minimal compared to SRAM FPGA solutions that must load configuration from external memories in orbit.
Recommended
Spacecraft Command and Data Handling (C&DH)
For C&DH modules, the RTAX2000S-1CGS624EV provides glue logic, bus interfacing, telemetry formatting, and housekeeping functions on a single rad-tolerant chip. The single-chip, live-at-power-up anti-fuse architecture removes the external configuration PROM that is a common single point of failure in space avionics, improving overall reliability. The 624-pin CCGA package supplies abundant I/O for MIL-STD-style bus and discrete interfaces, and the -55C to +125C rating covers worst-case thermal environments in unheated equipment bays. Designers typically combine the FPGA with a rad-hardened microcontroller, using the FPGA for time-critical framing and memory-mapped register decoding while the processor handles higher-layer telemetry management, keeping critical paths within the deterministic FPGA fabric.
Recommended
Telemetry Encoder/Decoder and Downlink Formatting
Downlink chains benefit from the RTAX2000S-1CGS624EV's deterministic anti-fuse timing and 649 MHz fabric capability, which support CCSDS-style channel coding and framing at high symbol rates. Embedded FIFO-organized SRAM buffers data between the payload source clock domain and the encoder clock domain, while SEU-hardened registers protect protocol state machines without TMR overhead. The 21,504 CLBs accommodate parallelizer, scrambler, and Reed-Solomon style blocks with margin for redundancy. Placement between the payload router and the modulator keeps switching activity localized; the 1.5V nominal core supply (1.425V-1.575V) limits dynamic power, an important consideration for power-constrained smallsat buses relying on limited solar array margin during eclipse operations.
Recommended
Instrument Control for Space Science Missions
Science instruments on LEO and deep-space missions use the RTAX2000S-1CGS624EV for detector timing generation, ADC interface sequencing, and autonomous event handling. The -55C to +125C operating range and hermetic ceramic CCGA-624 package withstand launch vibration and cryogenically cold instrument bays, while the anti-fuse interconnect is immune to configuration upsets, so detector timing patterns cannot be corrupted in flight. SEU-hardened registers keep exposure-control counters valid at the datasheet LET threshold. Because the device is live at power-up, instruments begin acquiring data immediately after turn-on without a configuration load interval, which matters for time-critical observation windows such as planetary flybys and occultation measurements where every second of uptime is scientifically valuable.
Recommended
Launch Vehicle Avionics and Flight Logic
Launch vehicles demand logic that is operational within milliseconds of power application and immune to vibration-induced configuration loss; the RTAX2000S-1CGS624EV meets both needs with its single-chip anti-fuse architecture rated to +125C and -55C. Typical roles include stage-separation sequencing, safe-and-arm interface monitoring, and telemetry multiplexing, where SEU-hardened registers protect state machines from single-event upsets during passes through the South Atlantic Anomaly or during solar particle events. The 2M-gate fabric implements multiple redundant channels of critical logic with voting, and the extensive 624-pin I/O count accommodates discrete pyrotechnic channel interfaces, analog monitor digitization support, and redundant MIL-STD-1553-style bus interfaces on one rad-tolerant device.
Recommended
Radiation Test and Engineering Model Development
Programs building engineering models (EM) and radiation test vehicles use the RTAX2000S-1CGS624EV alongside commercial-temperature family prototypes to de-risk flight designs. Logic is developed in the Microchip/Libero tool flow on commercial ProASIC or Axcelerator-based platforms, then targeted to the RTAX-S fabric; using the same die (21504 CLBs, 2M gates) for EM and flight units minimizes re-verification. Test teams populate CCGA-624 evaluation boards for heavy-ion and proton testing, using the datasheet LET threshold and the sub-10-10 errors/bit-day SEU rate as acceptance criteria. Traceable ordering suffixes (E vs V flow) let programs separate engineering screening from flight lot certification while keeping a common footprint across all build phases.
Recommended
Recommended Products Summary
Engineering reference data for RTAX2000S-1CGS624EV β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | RTAX2000SL-1CGS624B | RTAX2000S-1CG624E | RTAX2000S-1CG624V | RTAX2000S-CGS624E |
|---|---|---|---|---|---|
| Package | CGS624 (CCGA-624, ceramic) | CGS624 (CCGA-624) - same footprint | CBGA624/CGA624 - same 624-pin ceramic family | CBGA624/CGA624 - same 624-pin ceramic family | CGS624 (CCGA-624) - same footprint |
| Brand | Microchip Technology (Actel/Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 2,000,000 | 2,000,000 | 2,000,000 | 2,000,000 | 2,000,000 |
| Logic Cells (CLBs) | 21504 | 21504 | 21504 | 21504 | 21504 |
| Core Supply Voltage | 1.5 V nominal (1.425-1.575 V) | 1.5 V nominal | 1.5 V nominal (1.425-1.575 V) | 1.5 V nominal (1.425-1.575 V) | 1.5 V nominal |
| Operating Temperature | -55C to +125C | -55C to +125C | -55C to +125C | -55C to +125C | -55C to +125C |
| Speed Grade / Flow Suffix | Speed -1, V flow | Speed -1, B flow (SL variant) | Speed -1, E flow | Speed -1, V flow | Standard speed, E flow |
| SEU Hardening | SEU-hardened registers, SEU rate < 10-10 errors/bit-day | Same SEU-hardened registers (SL enhanced) | Same SEU-hardened registers | Same SEU-hardened registers | Same SEU-hardened registers |
| Configuration Architecture | Anti-fuse OTP, single-chip, live at power-up | Anti-fuse OTP, single-chip | Anti-fuse OTP, single-chip | Anti-fuse OTP, single-chip | Anti-fuse OTP, single-chip |
Key Differentiators
- V screening flow option (vs RTAX2000S-1CG624E)
- Enhanced SL fabric features available in same footprint (vs RTAX2000SL-CGS624V)
- Single-chip live-at-power-up operation (vs SRAM-based space FPGAs (e.g., Xilinx space-grade Virtex, not pin compatible))
- Trade-off: fixed 2M-gate density (vs RTAX4000SL-CQ352E)
Design Notes
The 624-pin ceramic column grid array uses column terminations rather than solder balls; verify your PCB land pattern and reflow profile against the manufacturer CCGA assembly application guidance. Distributor data lists a 1.270 mm terminal pitch for the CGA624 package, requiring controlled warp ceramic handling and X-ray inspection post-assembly. Estimate: allow expansion joints or under-stiffener strategies when mounting on FR-4 to relieve CTE mismatch between the ceramic package and organic board over thermal cycling from -55C to +125C.
Supply the core at 1.5 V nominal within the 1.425 V to 1.575 V window per Microchip USA listing; use a rad-tolerant or board-level tolerant point-of-load regulator with sequencing appropriate to the RTAX-S power-up requirements described in the manufacturer datasheet. Because anti-fuse FPGAs draw no configuration current at power-up, inrush is governed mainly by decoupling capacitor charging; size bulk capacitance for the bus voltage droop budget. Verify I/O bank supply voltage values in the official datasheet before finalizing the power tree.
Ordering-code suffixes matter in space programs: CG624 vs CGS624 package codings and E vs V flow options indicate different screening, and some family members are explicitly NOT pin compatible in certain packages (the datasheet states RTAX2000S/SL and RTAX2000D/DL are not pin compatible in the CQ352 package; RTAX4000 overhang differs slightly). Confirm pin compatibility for your exact package code before reusing a layout. Also do not assume speed-grade interchangeability - the -1 grade timing files differ from standard grade in timing-driven place-and-route.
Compliance Information
Space-grade ceramic CCGA package; hermetic ceramic packaging typically precludes standard RoHS lead-free solder column finishing - verify flow-level compliance documentation with Microchip for the exact V-flow lot. No compliance data found in provided web results.
