S9S12B96F0CFUER - 16-bit 96MHz S12 MCU, 96KB, Automotive LQFP-80 | NXP
MPN: S9S12B96F0CFUER ✓ Hoạt độngS9S12B96F0CFUER Tóm tắt
A microcontroller (MCU) is a single-chip computer containing a processor, program and data memory, peripherals, and input/output interfaces on one integrated circuit. The 16-bit MCU category sits between 8-bit microcontrollers (typical of small appliances and simple logic) and 32-bit microcontrollers (typical of complex applications requiring RTOS, high-speed connectivity, or large memory footprints). Within NXP's portfolio, the S12/S12X family occupies the same mid-range 16-bit niche as dsPIC (DSPIC), MSP430, and Renesas RL78/RX, balancing deterministic interrupt latency with modest power consumption.
Key features of the S9S12B96F0CFUER include 96KB flash, automotive-grade qualification, the LQFP-80 surface-mount footprint, S12 core architecture, and 25MHz operation. The flash memory provides in-application reprogrammability via the standard NXP BDM interface, and the family architecture ensures software portability across memory-size variants in the B-series.
The S12 core is an enhanced 16-bit CISC architecture with a 20-bit ALU and 16-bit index registers, optimized for automotive body electronics. The peripheral set in the B family typically includes multiple CAN modules (msCAN), SCI/SPI, PWM channels, and timers suitable for body control modules.
Typical applications include automotive body control modules (BCM), instrument cluster controllers, HVAC actuators, lighting controllers, and industrial CAN nodes. The pin-compatible family structure also makes the part useful as a drop-in upgrade for B-family designs requiring different memory densities.
When designing with this device, ensure the BDM debug port is broken out to a header for firmware development, and follow NXP's AN for power-supply decoupling on VDDR/VSS pairs. Confirm reflow profile compliance with the MSL-3 floor-life spec.
This page synthesizes distributor pricing from FPGACenter (5.538 units in stock from $16.60 as of 2026-10-20), drop-in alternatives within the MC9S12B family, and practical design notes not found in the standalone datasheet.
Bộ thay thế dễ dàng lắp đặt cho S9S12B96F0CFUER — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với S9S12B96F0CFUER (cùng hình factor và footprint) — khác nhau ở Package, Core, Program Memory Size, ADC, Operating Temperature Range.
MC9S12B64CFUE
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →MC9S12B128CFUE
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →MC9S12C96CFAE557
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →MC9S12C32VFAE16
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →MC9S12H256VFVE
✅ Drop-In ⚠️ Thông số chưa được xác minhLiên hệ để biết giá
Xem tài liệu →MC9S12GC64CFAE
✅ Drop-In ⚠️ Thông số chưa được xác minhLiên hệ để biết giá
Xem tài liệu →S9S12B96F0CFUER Tỷ lệ tối đa & tính chất điện
| Core | S12 (16-bit CISC) |
| CPU Maximum Frequency | 25 MHz |
| Hộp | LQFP-80 (FUE) |
| Số chân | 80 |
| Khoảng nhiệt độ hoạt động | -40C to +85C |
| Automotive Qualified | Yes |
| Cấp MSL | 3 |
| Peak Reflow Temperature | 260 C |
| Maximum Time At Peak Reflow Temperature | 40 s |
| Terminal Finish | TIN |
| JESD-609 Code | e3 |
| Kiểu lắp đặt | Surface Mount |
| Trạng thái RoHS | Compliant |
Hướng dẫn cấu hình chân S9S12B96F0CFUER lqfp-80 (fue)
Cấu hình chân cho S9S12B96F0CFUER (lqfp-80 (fue) gói). IC số này bao gồm chân GPIO, giao diện truyền thông (UART, SPI, I2C) và chân nguồn. Tham khảo tài liệu thông số kỹ thuật của nhà sản xuất để biết các chức năng chân thay thế và tùy chọn cấu hình. Cực kỳ quan trọng cho thiết kế hệ thống tích hợp và lập trình PCB.
Không có dữ liệu chân cụ thể sẵn có cho S9S12B96F0CFUER.
Tham khảo: tài liệu kỹ thuật cho cấu hình chân đầy đủ.
Ứng dụng tiêu biểu
S9S12B96F0CFUER phù hợp cho 7 Áp dụngs: Automotive Body Control Module (BCM), Automotive Instrument Cluster, HVAC Control Module, Automotive Lighting Controller, Industrial CAN Node, Automotive Door Module, Automotive Seat Control Module.
Automotive Body Control Module (BCM)
The S9S12B96F0CFUER fits BCM applications because the 25 MHz S12 core and 96 KB flash provide ample headroom for typical BCM firmware stacks including CAN diagnostics (UDS/KWP2000), central locking, lighting control, and LIN master/slave stacks. Its -40C to +85C automotive qualification and LQFP-80 footprint are matched to the harsh EMC and thermal conditions under the dash. The B-family pin compatibility allows memory-density scaling across vehicle platforms without PCB rework.
Được đề xuất
Automotive Instrument Cluster
The S9S12B96F0CFUER suits instrument cluster designs where driving speed (cluster), step (dimming), and stepper-motor gauge control benefit from the S12 core's deterministic interrupt latency and on-chip PWM. The 96 KB flash holds gauge graphics tables and CAN stacks; the LQFP-80 footprint provides enough I/O for backlight drivers and warning-lamp outputs. The pin-compatible B-family allows memory-size scaling across vehicle trim levels.
Được đề xuất
HVAC Control Module
The S9S12B96F0CFUER fits HVAC control modules because the S12 core, 25 MHz CPU, and on-chip ADC channels easily handle thermistor reading, blower-motor PWM, and mode-door stepper control. The 96 KB flash holds calibration tables for climate profiles, and the LQFP-80 footprint exposes enough GPIO for HVAC switch scanning. Automotive qualification and the B-family pin compatibility enable rapid cross-platform development.
Được đề xuất
Automotive Lighting Controller
The S9S12B96F0CFUER serves lighting controller nodes because the B-family PWM channels and CAN peripherals support adaptive headlamp, DRL, and turn-indicator functions. The 96 KB flash accommodates lighting-state machine firmware and CAN diagnostic stacks. Pin-compatible B-family variants let designers tune memory to specific lighting subsystems without PCB rework, optimizing BOM cost across vehicle trim lines.
Được đề xuất
Industrial CAN Node
The S9S12B96F0CFUER fits industrial CAN node applications because the msCAN module supports CAN 2.0B at 1 Mbit/s, the 25 MHz S12 core handles industrial protocol stacks, and 96 KB flash is generous for CANopen or DeviceNet dictionaries. The -40C to +85C operating range matches industrial enclosure thermal requirements, and the LQFP-80 footprint simplifies hand-rework for low-volume industrial nodes.
Được đề xuất
Automotive Door Module
The S9S12B96F0CFUER is well suited to door module designs because the S12 core and B-family peripherals cover window lift, mirror adjust, and central locking control, with 96 KB flash holding CAN/LIN stacks and motor-control state machines. The LQFP-80 footprint exposes enough I/O for H-bridge enable signals and current-sense ADC channels. The B-family pin compatibility allows memory scaling for feature-rich vs base door trims.
Được đề xuất
Automotive Seat Control Module
The S9S12B96F0CFUER fits seat control module applications where 96 KB flash and B-family peripherals support memory-position storage, multi-axis motor control via PWM, and CAN/LIN body-network integration. The 25 MHz S12 core handles real-time motor PID loops, and the LQFP-80 footprint provides enough I/O for seat-position switches and motor enable signals. Pin-compatible B-family variants allow scaling from base to premium seat modules.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho S9S12B96F0CFUER — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | MC9S12B64CFUE | MC9S12B128CFUE | MC9S12C96CFAE557 | MC9S12C32VFAE16 | MC9S12H256VFVE | MC9S12GC64CFAE |
|---|---|---|---|---|---|---|---|
| Package | LQFP-80 (FUE) | LQFP-80 - same | LQFP-80 - same | LQFP-80 - same | LQFP-80 - same | LQFP-80 - same | LQFP-80 - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | S12 (16-bit) | S12 (16-bit) | S12 (16-bit) | S12 (16-bit) | S12 (16-bit) | S12 (16-bit) | S12 (16-bit) |
| CPU Max Frequency | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz |
| Flash Memory | 96 KB | 64 KB (-33%) | 128 KB (+33%) | 96 KB (same) | 32 KB (-67%) | 256 KB (+167%) | 64 KB (-33%) |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
| Automotive Qualified | Yes | Yes | Yes | Yes | Yes | Yes | Yes |
| Family | MC9S12B | MC9S12B | MC9S12B | MC9S12C | MC9S12C | MC9S12H | MC9SGC |
| MSL Level | 3 | 3 | 3 | 3 | 3 | 3 | 3 |
Bảo phân biệt quan trọng
- Mid-range 96 KB flash with B-family pin compatibility (vsMC9S12B64CFUE)
- Lower memory cost than B128 with same footprint (vsMC9S12B128CFUE)
- Production NXP mask-set identifier (vsMC9S12B96)
Ghi chú thiết kế
Place a 100 nF decoupling cap on each VDD/VSS pair as close to the LQFP-80 pins as practical, plus a 10 uF bulk cap on the regulator output. The B-family reference manual recommends VDDR/VSS pairs isolated from VDDX (I/O supply) with separate ferrite beads for noise-sensitive ADC channels. Keep the BKGD and RESET traces short and away from switching signals.
Estimated: At 25 MHz CPU and typical automotive BCM duty cycle (50% CPU load), core power dissipation is roughly 0.4-0.6 W. The LQFP-80 has a theta_JA of approximately 50 C/W on a 4-layer JEDEC test board, yielding a junction rise of 20-30 C above ambient. At +85C ambient, junction stays under 115C, well inside the 150C automotive max. No heatsink required.
Do not exceed the MSL-3 floor life of 168 hours once the dry-pack is opened. Bake at 125C for 24 hours if exceeded. The BDM pin (BKGD) must be pulled up with a 10 kohm resistor to VDDX; floating BDM will cause spurious debug mode entries on power-up. Avoid routing the ECLK output near ADC input traces to prevent digital switching noise coupling.
Thông tin tuân thủ
RoHS compliant (JESD-609 e3, TIN terminal finish), automotive qualified per MC9S12B-family product page, AEC-Q100 implied by automotive qualification. Reach and conflict-minerals status per NXP product environmental disclosures.
