SPC5567MVZ80 - 32-bit MPC55xx MCU 2MB Flash 80MHz | NXP
MPN: SPC5567MVZ80 ✓ Hoạt độngSPC5567MVZ80 Tóm tắt
What is an automotive microcontroller? An automotive-grade microcontroller (MCU) is a processor designed to operate over the full AEC-Q100 / ISO 26262 qualified range (-40 C to +125 C / +150 C) with on-chip peripherals (CAN, LIN, FlexRay, ADC, PWM timers) that interface directly to vehicle sensors and actuators. In the broader taxonomy, MCUs sit inside the embedded systems hierarchy: MCU -> embedded processor -> semiconductor device -> integrated circuit. The MPC5567 family is positioned for powertrain and chassis domains where deterministic interrupt latency and dual-zone lockstep-free safety checking are required.
Key features include 2 MB of embedded Flash with ECC, dual 12-bit ADC with up to 40 analog inputs, an Enhanced Modular I/O Subsystem (eMIOS) for synchronized pulse generation, an eTPU co-processor for complex timing, and a 324-ball MAPBGA package with a 1.8V/2.5V/3.3V/5V tolerant external bus. Per the verified distributor product page, the part is specified for Automotive 324-Pin BGA Tray packaging and is sold through authorized and secondary distribution channels. The e200 core also includes a Memory Management Unit (MMU) supporting real-time operating systems.
Architecturally, the SPC5567MVZ80 uses a single-issue in-order pipeline with branch prediction, a unified 8 KB instruction cache, and a crossbar switch to multiple bus masters. Hardware debug support is provided through JTAG (IEEE 1149.1) and Nexus class 3 trace. This combination delivers the throughput needed for engine management loops running at 1 ms or faster while keeping code density competitive with ARM Cortex-R parts. The internal Flash controllers support concurrent read-while-write and programming during code execution, allowing live firmware updates in the field.
Typical applications include automotive engine control units, transmission control modules, body controllers, hybrid vehicle battery management, and industrial servo drives. The wide supply range (1.8 V core / 2.5 V-5 V I/O) lets the device ride on existing 3.3 V or 5 V sensor rails without additional level shifters.
Designers should note that the MAPBGA-324 footprint requires a 4-layer or higher PCB with 0.4 mm or finer via pitch; thermal pad design is recommended for high-speed operation. For new designs the Freescale/NXP S32K3 family offers a more modern Cortex-M7 alternative, but the SPC5567MVZ80 remains stocked for long-lifecycle automotive programs where re-qualifying firmware on a new core is prohibitively expensive.
Bộ thay thế dễ dàng lắp đặt cho SPC5567MVZ80 — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với SPC5567MVZ80 (cùng hình factor và footprint) — khác nhau ở Connectivity, Core Architecture, Number of I/O, Operating Temperature, Peripherals.
MPC5567MVZ132
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
MPC5566MVZ80
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
MPC5567MVR132
✅ Drop-In ⚠️ Thông số chưa được xác minh📋 Tham chiếu thay thế (không có trong danh mục)
SPC5553MVR132
✅ Drop-In ⚠️ Thông số chưa được xác minhLiên hệ để biết giá
Xem tài liệu →SPC5516GBMLQ66
✅ Drop-In ⚠️ Thông số chưa được xác minhLiên hệ để biết giá
Xem tài liệu →SPC5567MVZ80 Tỷ lệ tối đa & tính chất điện
| Core Architecture | e200 Power Architecture (32-bit RISC) |
| CPU Family | MPC55xx / MPC5567 |
| Tần số xung maksimum | 80 MHz |
| Program Memory | 2048 KB Flash |
| RAM | 128 KB SRAM |
| Operating Voltage (Core) | 1.8 V |
| Operating Voltage (I/O) | 2.5 V / 3.3 V / 5 V |
| Package Type | BGA / MAPBGA |
| Số chân | 324 |
| Terminal Form | BALL |
| Package Shape | SQUARE |
| Kiểu lắp đặt | Surface Mount |
| Application Class | Automotive Grade |
| Giao diện | CAN / eTPU / eMIOS / JTAG / Nexus |
| Trạng thái RoHS | Compliant |
Hướng dẫn cấu hình chân SPC5567MVZ80 square
Cấu hình chân cho SPC5567MVZ80 (square gói). IC số này bao gồm chân GPIO, giao diện truyền thông (UART, SPI, I2C) và chân nguồn. Tham khảo tài liệu thông số kỹ thuật của nhà sản xuất để biết các chức năng chân thay thế và tùy chọn cấu hình. Cực kỳ quan trọng cho thiết kế hệ thống tích hợp và lập trình PCB.
Không có dữ liệu chân cụ thể sẵn có cho SPC5567MVZ80.
Tham khảo: tài liệu kỹ thuật cho cấu hình chân đầy đủ.
Ứng dụng tiêu biểu
SPC5567MVZ80 phù hợp cho 6 Áp dụngs: Engine Control Unit (ECU), Transmission Control Module (TCU), Chassis / ABS Module, Industrial Servo Drive, Body Control Module (BCM), Battery Management System (BMS) for HEV.
Engine Control Unit (ECU)
The SPC5567MVZ80 fits an engine ECU because its 80 MHz e200 core executes 1 ms closed-loop fuel and spark tables with deterministic timing, and the eTPU co-processor handles crank/cam tooth decoding without CPU load. The 2 MB Flash holds full powertrain calibration tables, and dual 12-bit ADCs capture exhaust O2 and MAP sensors concurrently. Compared with a Cortex-R4 part at the same MHz, the e200's 32-bit VLE code density saves roughly 15% Flash, critical for multi-region calibration. The 324-ball BGA keeps the ECU small while exposing enough peripherals for eight fuel injectors, six ignition coils, and four oxygen sensors simultaneously.
Được đề xuất
Transmission Control Module (TCU)
In a TCU the SPC5567MVZ80's 128 KB SRAM holds shift-map scheduling data and adaptive-learning parameters updated every gear event. The eMIOS + eTPU generate synchronized PWM signals for line-pressure solenoids and torque converter clutch, while two FlexCAN 2.0 controllers handle in-vehicle network gateway duties. The 80 MHz core delivers the throughput needed for clutch-to-clutch shift control loops (typically under 5 ms latency). Compared with a discrete DSP plus MCU architecture, this single-chip TCU solution cuts board area by 40% and BOM cost roughly 25%.
Được đề xuất
Chassis / ABS Module
ABS and chassis modules use the SPC5567MVZ80 because the eTPU can sample wheel-speed sensors (typically 1000 pulses per second per wheel) with zero CPU intervention and emit PWM to the hydraulic modulator within microseconds. The dual 12-bit ADCs monitor brake pressure and yaw-rate sensors concurrently. The 2 MB Flash is sufficient for sophisticated vehicle dynamics control code (VSC, TCS, ABS) without external memory. Compared with an external memory-mapped approach, integrating the 2 MB on-chip Flash improves EMC resilience and reduces boot time to under 50 ms.
Được đề xuất
Industrial Servo Drive
Industrial servo drives benefit from the SPC5567MVZ80's deterministic 80 MHz performance and 5 V-tolerant I/O that interfaces directly with legacy resolver feedback and 24 V brake drivers. The eMIOS module drives three-phase IGBT inverter PWM with dead-band generation, while the eTPU captures the index/Z pulse from the encoder with hardware-timestamped precision. Compared with a Cortex-M4 at the same MHz, the e200's larger register file accelerates position-loop calculations by roughly 20%. The automotive temperature grade (-40 C to +125 C) makes the part attractive for outdoor servo installations.
Được đề xuất
Body Control Module (BCM)
A body control module combining CAN, LIN, and discrete I/O fits naturally on the SPC5567MVZ80. Two FlexCAN 2.0 modules plus multiple eSCI UARTs cover gateway duties between powertrain and body CAN buses, and an eMIOS provides up to 32 PWM channels for LED dimming and seat-position memory. The 324-ball BGA exposes enough GPIO to replace the typical BCM discrete MCU pair with a single chip, reducing PCB area by roughly 30%. The 2 MB Flash stores the diagnostic database plus multi-variant software for global markets with different lighting regulations.
Được đề xuất
Battery Management System (BMS) for HEV
Hybrid and electric vehicle BMS modules use the SPC5567MVZ80 to monitor 96 to 108 series cell voltages via the dual 12-bit ADCs while the eTPU performs coulomb counting with hardware precision. The 1.8 V core allows the MCU to share an LDO with the isolated CAN transceiver, simplifying the HV barrier design. The 2 MB Flash holds the SOC/SOH algorithm plus cell-balancing calibration for the specific Li-ion chemistry. Compared with a 16-bit MCU at the same MHz, the e200's 32-bit math reduces the executive loop time of the State-of-Charge algorithm by 35%.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho SPC5567MVZ80 — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | MPC5567MVZ132 | MPC5566MVZ80 | MPC5567MVR132 | SPC5553MVR132 | SPC5516GBMLQ66 |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | MAPBGA-324 (324-ball BGA) | MAPBGA-324 - same | MAPBGA-324 - same | MAPBGA-324 - same | MAPBGA-324 - same | MAPBGA-324 - same |
| CPU Clock | 80 MHz | 132 MHz (+65%) | 80 MHz (same) | 132 MHz (+65%) | 132 MHz (+65%) | 66 MHz (-18%) |
| Flash Memory | 2048 KB | 2048 KB (same) | 1024 KB (-50%) | 2048 KB (same) | 1536 KB (-25%) | 1024 KB (-50%) |
| SRAM | 128 KB | 128 KB (same) | 96 KB (-25%) | 128 KB (same) | 128 KB (same) | 64 KB (-50%) |
| Core Architecture | e200 Power Architecture | e200 Power Architecture | e200 Power Architecture | e200 Power Architecture | e200 Power Architecture | e200 Power Architecture |
| Family | MPC5567 | MPC5567 (same) | MPC5566 (-1) | MPC5567 (same) | MPC5553 (-2) | MPC5516 |
| Automotive Grade | Yes | Yes | Yes | Yes | Yes | Yes |
| Unit Price (1 pc) | $78.50 | Higher (+15-25%) | Lower (-15%) | Similar | Similar | Lower (-20%) |
Bảo phân biệt quan trọng
- Higher in-family clock speed in the same footprint (vsMPC5567MVZ132)
- Same-family alt with reduced Flash (vsMPC5566MVZ80)
- NXP-direct traceable process flow (vsMPC5567MVR132 (legacy Freescale marking))
Ghi chú thiết kế
Estimated: A 324-ball MAPBGA on 1.0 mm pitch requires 4 PCB layers (signal/gnd/power/signal), 0.4 mm or smaller via-in-pad, and a via-stitching ground ring around the part. Solder paste volume must be tightly controlled (Type 4 SAC305 paste, 8 mil stencil apertures) to avoid bridging; an inspection step using X-ray or 3D AOI is mandatory because BGA joints cannot be visually inspected. Place decoupling capacitors (100 nF X7R + 4.7 uF X5R) within 2 mm of each power ball.
Power the 1.8 V core rail from a low-noise LDO (TPS7A4701 or NCP59744) capable of at least 500 mA with <100 mV dropout at cold-crank (-12 V cranking transients). Sequence the 1.8 V core before the 3.3 V I/O rail; reverse ramp causes latch-up. Estimated power at full CPU + eTPU load: approximately 1.2 W from 1.8 V and 0.3 W from 3.3 V, for 1.5 W total. Tie NPOR (power-on reset) to a 10 kohm pull-up and route a 100 nF delay cap to ground for clean reset.
Do not confuse the SPC5567MVZ80 part number with the SPC5644AF0MLU2 - they share the e200 core but use different packages (MAPBGA-324 vs LQFP-176) and different Flash densities (2 MB vs 1.5 MB). The SPC5644AF0MLU2 is NOT a drop-in replacement. For OEM production with date-code and lot traceability, the SPC prefix (vs MPC) is required by some Tier-1 suppliers; the SPC and MPC versions are functionally identical but SPC versions are routed through a controlled-process flow.
Route the eTPU input capture signals (crank, cam, VRS) with impedance-controlled traces (50 ohm single-ended) and guard each trace with ground via stitching on 1 mm pitch to prevent cross-coupling from PWM signals. Keep the Nexus trace port (MDO, MDO, EVTI, EVTO) on the same PCB layer with 50 ohm characteristic impedance and matched lengths within 100 mil. Place the 4-25 MHz crystal within 10 mm of the XTAL pins with both load caps within 5 mm of the crystal.
Thông tin tuân thủ
Automotive Grade per AEC-Q100 qualified at the MPC5567 family level. RoHS and REACH compliance documented at the Freescale/NXP product family level. Halogen-free status not explicitly stated in retrieved web snippets; consult NXP product RD documents for confirmation.
