AMD

XC6SLX16-2CSG324I - 375 MHz Spartan-6 LX FPGA | AMD

MPN: XC6SLX16-2CSG324I ✓ Hoạt động
1.14 V to 1.26 V Vdss CSBGA-324 Package 375 MHz Speed 589824 Memory
MOQ: 1 |

XC6SLX16-2CSG324I Tóm tắt

AMD XC6SLX16-2CSG324I is a Spartan-6 LX field-programmable gate array with 14,579 logic cells, 232 user I/Os, a 375 MHz internal frequency, and a 1.14 V to 1.26 V supply range, packaged in a 324-pin CSBGA. The -2 speed grade and industrial-temperature suffix support cost-sensitive designs requiring deterministic programmable logic, generous I/O connectivity, and integration of control, interface, and protocol functions on one device.

A field-programmable gate array is a semiconductor whose digital logic and interconnect are configured after fabrication. An FPGA belongs to the broader programmable-logic hierarchy, combining configurable logic blocks, block RAM, digital clock managers, programmable I/O, and dedicated fabric resources. This integration allows a single Spartan-6 device to replace combinations of discrete programmable and fixed-function logic while shortening development schedules for industrial, communications, consumer, and automotive-infotainment equipment.

The XC6SLX16-2CSG324I provides 14,579 logic cells and 232 I/Os in a CSBGA-324 package. Its advertised internal frequency is 375 MHz, while its core supply range is 1.14 V to 1.26 V. The part also incorporates DCM and PLL resources for clock generation and phase management. These resources make it suitable for protocol bridges, custom interface controllers, display and control logic, industrial automation modules, and communication equipment requiring programmable high-speed I/O.

The Spartan-6 architecture uses 45 nm FPGA technology and combines programmable logic with hardwired resources for common design functions. The -2 designation identifies the performance grade, while the I suffix identifies the industrial-temperature option. The CSG324 package exposes 232 user I/Os in a compact 19 mm by 19 mm, 0.80 mm-pitch lead-free CSBGA arrangement. Its extensive I/O count allows a board to connect external memory, control signals, communications transceivers, sensors, and display peripherals without requiring a separate large companion device.

Typical implementations include industrial automation and bridging, automotive-infotainment interfaces, protocol conversion, image and data acquisition, embedded control, and communications infrastructure. The large I/O count is especially useful when a design must connect several external buses or high-pin-count memory devices. The device should be selected only after confirming that the required clocks, RAM, I/O standards, pin assignments, and peripheral resources fit the selected CSG324 variant.

PCB implementation requires careful attention to power, ground, and signal integrity across the dense BGA. Follow the manufacturer's CSG324 pinout files when assigning PCB balls, and verify each I/O standard, voltage, and termination requirement against the design. Because no explicit XC6SLX16-2CSG324I pin table appears in the retrieved records, use the official AMD Spartan-6 package pinout file rather than inferring ball assignments from another package variant.

This page combines the exact device identity, operating figures, package information, drop-in options, comparison parameters, and engineering guidance needed for initial design review. It also highlights the distinction between device-level alternatives that preserve the CSG324 footprint and unrelated packages that are not true drop-in replacements.

Bộ thay thế dễ dàng lắp đặt cho XC6SLX16-2CSG324I — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.

Các biến thể trong loạt này

Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với XC6SLX16-2CSG324I (cùng hình factor và footprint) — khác nhau ở Package, Device Type, Speed Grade, Lead-Free Status, Operating Temperature.

AMD
Package: 324-LFBGA/CSPBGA; retrieved sources also state CSBGA-484
Device Type: Field Programmable Gate Array (FPGA)
Lead-Free Status: Lead-free package description in retrieved data
So sánh với XC6SLX16-2CSG324I →
AMD
Package: 324-CSPBGA
Device Type: Spartan-6 LX field-programmable gate array
Lead-Free Status: Lead-free
So sánh với XC6SLX16-2CSG324I →
AMD
Package: 324-ball CSBGA, 19 mm × 19 mm
Speed Grade: -3
Lead-Free Status: Lead free
So sánh với XC6SLX16-2CSG324I →
AMD
Device Type: Spartan-6 LX field-programmable gate array
Speed Grade: Grade 2
So sánh với XC6SLX16-2CSG324I →

XC6SLX16-2CSG324C

✅ Drop-In
AMD
📦 CSBGA-324
Field Programmable Gate Array (FPGA) · Spartan-6 LX · 14,579 cells · 232 I/Os · 667 MHz · 1.2 V · 45 nm · -2

Liên hệ để biết giá

Xem tài liệu →

XC6SLX16-3CSG324I

✅ Drop-In
AMD
📦 CSBGA-324
FPGA · Spartan-6 LX · 45 nm · 14,579 cells · 1,139 LABs/CLBs · 589,824 bits · 232 I/Os · 667 MHz

Liên hệ để biết giá

Xem tài liệu →

XC6SLX25-2CSG324I

✅ Drop-In
AMD
📦 CSBGA-324
Spartan-6 LX field-programmable gate array · 24,051 cells · 226 I/Os · 375 MHz · 1.14 V to 1.26 V · 45 nm · CSBGA-324 · 324 pins

Liên hệ để biết giá

Xem tài liệu →

XC6SLX9-2CSG324I

✅ Drop-In
📦 CSBGA-324
Same -2 speed grade, industrial-temperature suffix, and CSG324 footprint; smaller XC6SLX9 resource tier replaces the XC6SLX16 tier

📋 Tham chiếu thay thế (không có trong danh mục)

XA6SLX16-2CSG324I

✅ Drop-In
📦 CSBGA-324
Same XC6SLX16 resource tier, -2 speed grade, and CSG324 footprint; automotive-range XA prefix replaces the standard XC prefix

📋 Tham chiếu thay thế (không có trong danh mục)

XC6SLX16-2CSG324I Tỷ lệ tối đa & tính chất điện

Device Type FPGA
FPGA Family Spartan-6 LX
Logic Cells 14,579 cells
User I/O Count 232 I/Os
Internal Frequency 375 MHz
Supply Voltage Range 1.14 V to 1.26 V
Speed Grade -2
Hộp CSBGA-324
Package Dimensions 19 mm x 19 mm
Package Pitch 0.80 mm
Package Type Lead-free CSPBGA
Nhiệt độ hoạt động -40 C to 85 C
Process Technology 45 nm
Clock Management Resources DCM and PLL
Memory Resource Value 589824
Kiểu lắp đặt Surface Mount
Trạng thái RoHS Compliant
REACH Status Compliant

Hướng dẫn cấu hình chân XC6SLX16-2CSG324I lead-free cspbga

Cấu hình chân cho XC6SLX16-2CSG324I (lead-free cspbga gói). IC số này bao gồm chân GPIO, giao diện truyền thông (UART, SPI, I2C) và chân nguồn. Tham khảo tài liệu thông số kỹ thuật của nhà sản xuất để biết các chức năng chân thay thế và tùy chọn cấu hình. Cực kỳ quan trọng cho thiết kế hệ thống tích hợp và lập trình PCB.

Bảng cấu hình chân lead-free cspbga cho XC6SLX16-2CSG324I

Không có dữ liệu chân cụ thể sẵn có cho XC6SLX16-2CSG324I.

Tham khảo: tài liệu kỹ thuật cho cấu hình chân đầy đủ.

Ứng dụng tiêu biểu

XC6SLX16-2CSG324I phù hợp cho 6 Áp dụngs: Industrial Automation Controller, Automotive Infotainment Bridge, Communication Protocol Converter, Data Acquisition and Signal Processing, Video and Display Interface, Embedded Control and Sensor Hub.

🏭

Industrial Automation Controller

The XC6SLX16-2CSG324I fits programmable machine-control logic where a board must coordinate sensors, actuators, safety interlocks, and communications links. Its 14,579 logic cells provide room for control algorithms and protocol state machines, while 232 user I/Os support multiple sensors and discrete outputs without requiring extensive I/O expansion. The -2 grade and 375 MHz internal frequency suit timed control paths, and DCM and PLL resources assist deterministic clock distribution. For industrial deployments, the -40 C to 85 C rating is important; verify timing, I/O standards, and transient requirements in the final Vivado implementation.

🚗

Automotive Infotainment Bridge

The XC6SLX16-2CSG324I can implement interface bridging between automotive audio, display, navigation, and vehicle-network domains. Its 232 user I/Os are valuable when the FPGA must connect several bus transceivers, control lines, and data converters while executing protocol conversion in programmable logic. A 375 MHz internal frequency supports demanding datapaths, and the available DCM and PLL resources simplify clocking for multiple interface domains. Where automotive qualification is mandatory, evaluate XA6SLX16-2CSG324I and confirm the exact ordering, temperature, and production requirements rather than inferring automotive suitability solely from the Spartan-6 family.

🌐

Communication Protocol Converter

The XC6SLX16-2CSG324I is suitable for translating between serial, parallel, or packet-oriented interfaces in communications equipment. Parallel programmable logic can manage framing, checksums, buffering, and timing while the 232 I/Os connect multiple transceivers and control registers. The 375 MHz internal frequency supports high-rate datapaths, and dedicated clock-management resources help coordinate related interface domains. Designers should verify supported I/O standards, clock-input constraints, and achievable timing at the selected -2 speed grade. A larger design that exceeds the XC6SLX16 resource budget can evaluate XC6SLX25-2CSG324I while preserving the CSG324 footprint.

📡

Data Acquisition and Signal Processing

The XC6SLX16-2CSG324I can act as the central programmable element in acquisition systems that digitize, filter, time-stamp, or route sensor data. Its 14,579 logic cells support parallel processing stages, while 232 I/Os simplify connections to converters, sensors, memory, and host processors. The 375 MHz internal frequency enables multi-stage datapaths, and DCM and PLL blocks can derive or align clock domains for sampled data. Selection must account for the number and speed of supported I/O standards, RAM requirements, and expected clock-jitter tolerance. If resource utilization approaches the limit, move the design to the XC6SLX25-2CSG324I and repeat the timing analysis.

📺

Video and Display Interface

The XC6SLX16-2CSG324I can implement timing generation, pixel-format conversion, data alignment, and control for display or video interfaces. Its 232 user I/Os provide broad connectivity to memory and display-related circuitry, while the 375 MHz internal frequency supports clocked parallel datapaths. Programmable logic offers a practical way to combine several interface functions and adapt the board as display timing changes. Engineering review should include pixel-clock margin, supported I/O standards, external memory interface requirements, and synchronization between the fabric and peripherals. The XC6SLX25-2CSG324I is useful when parallel processing, additional buffering, or more complex control logic exceeds the XC6SLX16 capacity.

🧩

Embedded Control and Sensor Hub

The XC6SLX16-2CSG324I is well matched to sensor aggregation, condition-control, and protocol-hub designs in which many external devices must be coordinated. Its 232 I/Os allow sensors, memory, transceivers, and host interfaces to share one programmable platform, while 14,579 logic cells accommodate control state machines and data-routing functions. The -40 C to 85 C range supports industrial environments, and the 375 MHz internal frequency supports time-sensitive digital processing. Designers should reserve logic for diagnostics, verify clock-domain relationships, and confirm that the -2 timing grade closes at system temperature. XC6SLX16-3CSG324I offers another same-package timing choice when additional speed margin is required.

What are the key specifications of XC6SLX16-2CSG324I that engineers should know?
The XC6SLX16-2CSG324I is a Spartan-6 LX FPGA with 14,579 logic cells, 232 user I/Os, a 375 MHz internal frequency, and a 1.14 V to 1.26 V supply range in a CSBGA-324 package. According to the manufacturer family information, the device is built on 45 nm technology and includes DCM and PLL resources. Its -2 speed grade and industrial-temperature construction make it relevant to industrial automation, bridging, protocol conversion, embedded control, and automotive-infotainment designs.
Where can I download the XC6SLX16-2CSG324I datasheet PDF?
The XC6SLX16-2CSG324I datasheet can be accessed through the Xilinx datasheet listing at Datasheets.com or through AMD's official Spartan-6 package-pinout resources. The product listing identifies the device as a Spartan-6 LX FPGA with 14,579 logic cells and 232 I/Os. For board construction, use the official AMD CSG324 package files because they provide the authoritative ball assignments needed for PCB layout and pin verification.
Where can I find the XC6SLX16-2CSG324I pinout and package information?
The XC6SLX16-2CSG324I pinout should be obtained from AMD's official Spartan-6 Package Device Pinout Files page and the CSG324 package file. The device uses a 19 mm by 19 mm CSBGA-324 package with a 0.80 mm pitch and 232 user I/Os. Use the manufacturer package file when assigning PCB balls because a complete, pin-by-pin table is not reproduced on this page and alternate FPGA packages cannot be used to infer ball locations.
What is the XC6SLX16-2CSG324I used for?
The XC6SLX16-2CSG324I is used for programmable control, bridging, protocol conversion, data acquisition, and mixed external-interface designs. Its 232 user I/Os provide substantial connectivity, while the 375 MHz internal frequency supports demanding digital control paths. AMD describes the Spartan-6 LX family as appropriate for cost-sensitive, high-volume applications, including automotive infotainment, consumer equipment, and industrial automation.
Is XC6SLX16-2CSG324I suitable for industrial automation?
Yes, the XC6SLX16-2CSG324I is suitable for industrial automation when its I/O, timing, temperature, and resource requirements satisfy the target machine. The industrial-temperature option covers -40 C to 85 C, and the device provides 14,579 logic cells and 232 I/Os in CSBGA-324. The 375 MHz internal frequency and DCM and PLL resources support control, data-routing, and communications-interface functions, subject to final timing analysis in the selected Vivado design.
Where to buy XC6SLX16-2CSG324I online?
Use the Request a Quote form on this page to inquire about the XC6SLX16-2CSG324I, current availability, order quantity, and delivery terms. The exact part number identifies a Spartan-6 LX FPGA in the CSG324 package with a -2 speed grade and industrial-temperature suffix. XAIPART can confirm the matching suffix, package, and assembly requirements before an order is placed.
What is the price of XC6SLX16-2CSG324I?
Current commercial terms for the XC6SLX16-2CSG324I should be requested through the Request a Quote form on this page. The form allows the exact MPN, required quantity, and shipment destination to be reviewed without relying on a static price that may change. Confirm that the quotation names XC6SLX16-2CSG324I and the CSG324 package so that it is not confused with another Spartan-6 suffix or package option.
What is the lead time for XC6SLX16-2CSG324I?
Request the current lead time for XC6SLX16-2CSG324I through the Request a Quote form on this page. Lead time can depend on exact suffix, package, order quantity, and available factory inventory. The target MPN ends in I, indicating the industrial-temperature version, and uses the CSG324 package, so those details should remain unchanged when seeking a production schedule for an existing design.
Is XC6SLX16-2CSG324I in stock?
Current stock status for XC6SLX16-2CSG324I is handled through the Request a Quote form on this page. A production decision should account for the exact MPN, quantity, and required delivery date rather than assuming availability from a general family listing. AMD notes that Spartan-6 LX devices supported in the same package are pinout compatible, which provides a useful basis for evaluating qualified alternatives if the original suffix is unavailable.
What can replace XC6SLX16-2CSG324I?
XC6SLX16-2CSG324C, XC6SLX16-3CSG324I, XC6SLX25-2CSG324I, XC6SLX9-2CSG324I, and XA6SLX16-2CSG324I are same-family candidates found in the cross-reference records. AMD states that Spartan-6 LX devices supported in a particular package are pinout compatible. The replacement should still be checked for speed grade, temperature range, logic resources, timing closure, automotive qualification, and tool configuration before use in production.
Can XC6SLX25-2CSG324I replace XC6SLX16-2CSG324I?
XC6SLX25-2CSG324I is a same-package Spartan-6 LX alternative with a -2 speed grade, industrial-temperature suffix, and CSG324 footprint. AMD states that Spartan-6 LX devices supported in the same package are pinout compatible. The main engineering difference is device density: XC6SLX25 belongs to a larger LX resource tier, so designers must confirm utilization, timing, power, and any migrated configuration before treating it as a replacement.
When should I choose XC6SLX16-2CSG324I over XC6SLX9-2CSG324I?
Choose XC6SLX16-2CSG324I when a design needs more logic resources than the XC6SLX9-2CSG324I tier can provide while retaining the same -2 speed grade and CSG324 footprint. The target offers 14,579 logic cells and 232 I/Os, whereas XC6SLX9 is the smaller family member. The choice should follow a completed resource estimate, including logic, RAM, clocks, hard IP, and routing, rather than package compatibility alone.
Is XA6SLX16-2CSG324I the same as XC6SLX16-2CSG324I?
XA6SLX16-2CSG324I and XC6SLX16-2CSG324I share the Spartan-6 LX family, -2 speed designation, CSG324 package, and industrial suffix, but the XA prefix identifies the automotive range. AMD discussion indicates that automotive and commercial Spartan-6 variants can differ in temperature and qualification. Treat XA6SLX16-2CSG324I as a drop-in candidate only after checking the detailed ordering information and production-quality requirements.
What is the best AMD equivalent for XC6SLX16-2CSG324I?
The closest same-speed, same-package alternatives in the AMD family records are XC6SLX16-2CSG324C and XA6SLX16-2CSG324I. XC6SLX16-2CSG324C preserves the -2 grade and CSG324 footprint but represents the commercial-temperature ordering option, while XA6SLX16-2CSG324I represents the automotive range. Verify junction-temperature limits, qualification, and production documentation before selecting either for an industrial or automotive product.
XC6SLX16-2CSG324I vs XC6SLX16-2CSG324C: which is better?
XC6SLX16-2CSG324I is the better choice for an industrial-temperature design because its I suffix specifies the industrial-temperature option, while XC6SLX16-2CSG324C is the commercial-temperature ordering variant. Both retain the XC6SLX16 resource tier, -2 speed grade, and CSG324 package, and AMD identifies same-package Spartan-6 LX devices as pinout compatible. Confirm the minimum and maximum operating temperatures against the enclosure environment before finalizing the substitution.

Dữ liệu tham khảo kỹ thuật cho XC6SLX16-2CSG324I — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.

Hướng dẫn chọn lựa

Choose the XC6SLX16-2CSG324I when an industrial design needs the XC6SLX16 resource tier, 232 user I/Os, a -2 speed grade, and the CSG324 footprint. Select XC6SLX16-2CSG324C when the same electrical tier and speed grade are needed only in a commercial-temperature environment. Consider XC6SLX16-3CSG324I when extra timing margin is valuable without changing the package. Use XC6SLX25-2CSG324I when projected logic or memory utilization exceeds the XC6SLX16 capacity, and XC6SLX9-2CSG324I only when a smaller resource tier is sufficient. XA6SLX16-2CSG324I is appropriate when the automotive product range is required. In every case, recompile the design, verify pin constraints and timing, and confirm the environmental and qualification requirements.

So sánh với các sản phẩm thay thế

Tham số Sản phẩm này XC6SLX16-2CSG324C XC6SLX16-3CSG324I XC6SLX25-2CSG324I XC6SLX9-2CSG324I XA6SLX16-2CSG324I
Package CSBGA-324 CSBGA-324 CSBGA-324 CSBGA-324 CSBGA-324 CSBGA-324
Brand AMD AMD AMD AMD AMD AMD
FPGA Family Spartan-6 LX Spartan-6 LX Spartan-6 LX Spartan-6 LX Spartan-6 LX Spartan-6 LX
Speed Grade -2 -2 -3 -2 -2 -2
Temperature Suffix I C I I I I
Resource Tier XC6SLX16 XC6SLX16 XC6SLX16 XC6SLX25 XC6SLX9 XA6SLX16
Process Technology 45 nm 45 nm 45 nm 45 nm 45 nm 45 nm

Bảo phân biệt quan trọng

  • Balanced logic density and I/O availability (vsXC6SLX9-2CSG324I)
  • Exact speed grade with industrial-temperature ordering (vsXC6SLX16-2CSG324C)
  • Additional speed-grade margin without changing package (vsXC6SLX16-3CSG324I)
  • Expandable same-package resource option (vsXC6SLX25-2CSG324I)

Ghi chú thiết kế

Use AMD's official CSG324 package files to assign every PCB ball and verify the completed schematic before release. The package is a 19 mm by 19 mm, 0.80 mm-pitch CSBGA-324 with 232 user I/Os, so a single wrong BGA assignment can prevent programming or damage adjacent circuitry. Confirm the selected alternative uses the same CSG324 package and review any changes to power, configuration, clock, and dedicated pins before committing the layout.

Plan the core and I/O supplies separately according to the manufacturer power guidelines. The device operates over a 1.14 V to 1.26 V core supply range, but external interfaces and configuration pins may impose additional rail requirements. Place stable decoupling at the appropriate supply and ground balls, keep return paths continuous under the dense BGA, and verify sequencing and voltage tolerances in the complete power tree. Do not infer full power-pin connectivity from the package name alone.

Define the intended I/O standard and data rate before assigning a bank, then use the manufacturer pin constraints to prevent incompatible standards from being combined. For high-speed links, inspect reference-plane continuity, matched-length constraints, stub length, and return-path discontinuities with the actual PCB stack-up. The 375 MHz internal device frequency does not guarantee that every external interface can operate at that rate, so timing and signal-integrity analysis must use the final constraints.

Do not treat every same-family Spartan-6 LX device as an unconditional substitute. AMD states that devices supported in the same package are pinout compatible, but speed grade, temperature range, automotive qualification, resource tier, and timing closure still affect suitability. Migrate the design, recompile it, compare utilization, check constraints and timing, and complete the required qualification review before approving a replacement for production.

Thông tin tuân thủ

RoHS
Compliant
REACH
Compliant
AEC-Q100
Unknown
Không chì
Yes
Không halogen
Unknown
Khoáng vật xung đột
Unknown

The package description identifies a lead-free CSPBGA, and the comparison material identifies RoHS and REACH compliance. AEC-Q100 status for the standard XC6SLX16-2CSG324I and halogen-free status were not established.

Dữ liệu được xác minh vào: 2026-11-06 — dữ liệu được xác minh và quản lý bởi đội ngũ kỹ thuật phần cứng của XAIPART

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Các bộ phận và thuật ngữ liên quan

AMD AMD Xilinx XC6SLX16-2CSG324I XC6SLX16-2CSG324C XC6SLX16-3CSG324I XC6SLX25-2CSG324I XC6SLX9-2CSG324I XA6SLX16-2CSG324I Spartan-6 LX FPGA field-programmable gate array programmable logic CSBGA-324 BGA surface-mount package logic cells user I/O DCM PLL 45 nm FPGA technology industrial automation automotive infotainment protocol conversion RoHS REACH
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