10AX090R3F40I2LG vs 10AX090R3F40E2LG 比較
詳細並排比較 10AX090R3F40I2LG 由 Intel 與 10AX090R3F40E2LG 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | 10AX090R3F40I2LG | 10AX090R3F40E2LG |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 啟用中 | 啟用中 |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements (LE) | 900,000 | — |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Embedded Block RAM (M20K) | 24.33 Mbit | — |
| MLAB Memory | [DATA_NEEDED: MLAB Kbit] | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | Hardened fixed/floating-point DSP blocks (on-die) |
| Transceivers | 24 channels | Multi-gigabit serial transceivers (on-die) |
| Max Transceiver Data Rate | 17.4 Gbps | — |
| Hard Processor System | Not integrated (FPGA only) | — |
| PCI Express Hard IP | Gen3 hard IP | — |
| External Memory Interface | DDR4 / DDR3 / QDRIV / RLDRAM3 | — |
| Process Technology | 20 nm | 20 nm |
| 封裝 | 1517-BBGA, FCBGA (F40) | 1517-Ball FCBGA |
| 工作溫度 | -40C to +100C (Industrial) | — |
| 安裝類型 | Surface Mount (BGA) | Surface Mount |
| RoHS 狀態 | Compliant | Compliant |
| Logic Elements | — | 900,000 |
| Embedded Memory | — | 59,234,304 bits |
| User I/O Count | — | 342 |
| Core Supply Voltage | — | 0.9 V |
| Package Type | — | Flip-Chip Ball Grid Array |
| Number of Terminals | — | 1517 |
| Memory Interfaces | — | Hardened DDR3/DDR4 memory controller IP |
| Hard IP | — | PCI Express Gen3, 10/40/100 GbE Ethernet |
| Configuration | — | Partial reconfiguration supported |