10AX090R3F40I2LG - Arria 10 GX FPGA, 900K LE, 1517-BGA | Intel
MPN： 10AX090R3F40I2LG ✓ 啟用中10AX090R3F40I2LG 概覽
As a member of the Arria 10 family, the 10AX090 sits within Intel's mid-range FPGA portfolio, between the lower-density Arria 10 066/048 devices and the higher-density Stratix 10 parts. The Arria 10 family combines a programmable logic fabric, embedded transceivers, and ARM Cortex-A9 hard processor system options, making it a single-chip solution for data-path-heavy applications. This category of FPGA is classified as programmable logic, a sub-category of integrated circuits (ICs) that enables post-fabrication hardware reconfiguration through HDL-defined bitstreams.
Key features include up to 17.4 Gbps transceivers, integrated PCI Express Gen3 hard IP blocks, hardened memory controllers supporting DDR4/DDR3/QDRIV, and dedicated variable-precision DSP blocks with hardened IEEE 754 single-precision floating point. The F40 package provides high signal and power integrity for transceiver-rich designs through optimized flip-chip BGA routing. Industrial temperature grading (-40C to +100C) allows deployment in ruggedized environments such as outdoor wireless infrastructure and industrial imaging.
The architecture integrates heterogeneous subsystems: the Adaptive Logic Module (ALM) fabric, M20K block RAM, MLAB distributed memory, DSP blocks, transceiver tiles, PCIe hard IP, and high-speed serial I/O. This integration reduces external component count, BOM cost, and PCB complexity compared with discrete ASSP plus FPGA solutions.
Typical applications include high-end wireless baseband processing, radar signal processing, medical imaging accelerators, high-performance test and measurement, broadcast video processing, and ASIC prototyping. Engineers typically select the Arria 10 GX family when they need transceiver throughput above 10 Gbps but do not require Stratix 10-level logic density or 28 Gbps transceivers.
When designing with this device, allocate thermal budget carefully: the 1517-ball FCBGA consumes up to tens of watts under full transceiver and DSP load, requiring a multilayer PCB with a thermal management plan that may include a heat spreader, heat sink, or forced airflow.
This page synthesizes distributor pricing, drop-in package-equivalent alternatives from the same Arria 10 family, and practical design notes not found in the manufacturer datasheet, giving engineers a single consolidated reference for the 10AX090R3F40I2LG.
直接替換替代品，適用於 10AX090R3F40I2LG — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： 10AX090R3F40I2LG （相同外形與佔位） — 差異在於 Package, Temperature Grade, Mounting Type, Process Technology, DSP Blocks.
10AX090R3F40E2LG
✅ 直接替換聯絡詢價
查看資料表 →10AX090R2F40I2LG
✅ 直接替換聯絡詢價
查看資料表 →10AX090R3F40E2SG
✅ 直接替換聯絡詢價
查看資料表 →10AX090R2F40I2SG
✅ 直接替換聯絡詢價
查看資料表 →10AX090R2F40I1SG
✅ 直接替換聯絡詢價
查看資料表 →10AX090R3F40I2LG 最大額定值與電氣特性
| Family | Arria 10 GX |
| Logic Elements (LE) | 900,000 |
| Embedded Block RAM (M20K) | 24.33 Mbit |
| Transceivers | 24 channels |
| Max Transceiver Data Rate | 17.4 Gbps |
| Hard Processor System | Not integrated (FPGA only) |
| PCI Express Hard IP | Gen3 hard IP |
| External Memory Interface | DDR4 / DDR3 / QDRIV / RLDRAM3 |
| Process Technology | 20 nm |
| 封裝 | 1517-BBGA, FCBGA (F40) |
| 工作溫度 | -40C to +100C (Industrial) |
| 安裝類型 | Surface Mount (BGA) |
| RoHS 狀態 | Compliant |
10AX090R3F40I2LG 1517-bbga, fcbga (f40) 腳位配置指南
10AX090R3F40I2LG（1517-bbga, fcbga (f40) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： 10AX090R3F40I2LG.
請參閱 資料表 以查看完整腳位配置。
典型應用
10AX090R3F40I2LG 適用於 6 應用s: Wireless Baseband Processing, Radar Signal Processing, Medical Imaging Accelerator, High-Speed Test and Measurement, Broadcast Video Processing, ASIC Prototyping and Emulation.
Wireless Baseband Processing
The 10AX090R3F40I2LG suits wireless baseband processing where 24 transceiver channels at 17.4 Gbps enable CPRI/OBSAI fronthaul, JESD204B/C links to RF ADCs and DACs, and 10G Ethernet backhaul. With 900K logic elements and hardened floating-point IEEE 754 single-precision DSP, the device performs FFT/iFFT, channel estimation, and beamforming weights on antenna arrays in 4G/5G base stations. The Arria 10 GX family's hard PCIe Gen3 IP blocks accelerate coprocessor links to host processors.
推薦
Radar Signal Processing
In phased-array and synthetic-aperture radar systems, the 10AX090R3F40I2LG processes multi-channel ADC data through 900K logic elements and hardened single-precision floating-point DSP. The 24 embedded transceivers at 17.4 Gbps aggregate digitized antenna streams from high-speed JESD204B ADCs, while the industrial -40C to +100C temperature grade supports outdoor airborne and naval radar enclosures. Hardened memory controllers interface directly to DDR4 sample buffers.
推薦
Medical Imaging Accelerator
CT, MRI, and ultrasound imaging systems benefit from the 10AX090R3F40I2LG's 24.33 Mbit embedded block RAM and variable-precision DSP blocks performing real-time image reconstruction, beamforming, and FIR convolution. The PCI Express Gen3 hard IP links to host CPUs for system-level data flow, while the 17.4 Gbps transceivers interface to high-resolution analog front ends. Industrial temperature grading allows deployment in clinical imaging carts and ruggedized field equipment.
推薦
High-Speed Test and Measurement
Automated test equipment and protocol analyzers use the 10AX090R3F40I2LG to capture, generate, and analyze multi-gigabit serial traffic via its 24 transceivers at 17.4 Gbps. The 900K logic elements implement custom protocol decode, BERT pattern generation, and real-time analytics, while the PCI Express Gen3 hard IP provides the host interface for high-volume data upload. Hardened DDR4 controllers buffer captured traces before offload.
推薦
Broadcast Video Processing
Broadcast studios deploy the 10AX090R3F40I2LG for 4K/UHD video format conversion, frame-rate conversion, and IP-based SDI/2022-6/2110 transport over 10G/25G Ethernet using the 17.4 Gbps transceivers. The 900K logic elements and abundant DSP support real-time HDR/Dolby Vision LUT transforms, while the embedded block RAM stores multiple reference frames for temporal noise reduction. PCI Express Gen3 hard IP links to host video processing servers.
推薦
ASIC Prototyping and Emulation
Semiconductor design teams use multi-board 10AX090R3F40I2LG systems to prototype and validate large ASIC/SoC designs before tape-out. The 900K logic elements provide high gate-count capacity per device, while 24 transceivers at 17.4 Gbps enable chip-to-chip and board-to-board high-speed links at near-SoC clock rates. Industrial temperature grading supports accelerated life-test benches in production validation flows.
推薦
推薦產品摘要
工程參考資料，適用於 10AX090R3F40I2LG — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | 10AX090R3F40E2LG | 10AX090R2F40I2LG | 10AX090R3F40E2SG | 10AX090R2F40I2SG | 10AX090R2F40I1SG |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1517-BBGA, FCBGA (F40) | 1517-BBGA, FCBGA (F40) - same | 1517-BBGA, FCBGA (F40) - same | 1517-BBGA, FCBGA (F40) - same | 1517-BBGA, FCBGA (F40) - same | 1517-BBGA, FCBGA (F40) - same |
| Logic Elements | 900,000 | 900,000 | 900,000 | 900,000 | 900,000 | 900,000 |
| Speed Grade | -3 | -3 | -2 | -3 | -2 | -2 |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| Transceivers | 24 channels | 24 channels | 24 channels | 24 channels | 24 channels | 24 channels |
| Max Transceiver Rate | 17.4 Gbps | 17.4 Gbps | 17.4 Gbps | 17.4 Gbps | 17.4 Gbps | lower (transceiver rate class -1) |
| Embedded Block RAM | 24.33 Mbit | 24.33 Mbit | 24.33 Mbit | 24.33 Mbit | 24.33 Mbit | 24.33 Mbit |
| PCIe Hard IP | Gen3 | Gen3 | Gen3 | Gen3 | Gen3 | Gen3 |
主要差異化特點
- Highest-speed transceiver bin available for 10AX090 family (對比10AX090R2F40I2LG)
- Industrial temperature grading for ruggedized deployments (對比10AX090R3F40E2LG)
- Full 17.4 Gbps transceiver capability (rate class -3) (對比10AX090R2F40I1SG)
設計說明
Estimated: the 10AX090R3F40I2LG in the F40 FCBGA package can dissipate tens of watts under full transceiver plus DSP load. The 1517-ball flip-chip BGA exposes the die directly through the substrate thermal interface, requiring a heatsink with thermal interface material and forced airflow for sustained high-power operation. Theta-JA values for the F40 package require a specific PCB land pattern with adequate copper; refer to the Arria 10 packaging handbook for thermal management guidelines.
The 1517-ball FCBGA requires a high-density multilayer PCB (typically 12+ layers) with microvia or stacked-via construction to fan out the BGA pitch. Use Intel Altera's reference design PCB stackup for the F40 package as a starting point, and follow the Quartus Prime pin planner ball assignments exactly to avoid post-layout routing congestion on transceiver and memory interfaces.
Transceiver channels at 17.4 Gbps demand controlled-impedance routing (typically 100 ohm differential), length matching within tight tolerances (often 5 mil), and continuous reference planes. Series AC-coupling capacitors are required on the transmit side per the Arria 10 GX handbook. Perform IBIS-AMI or HSPICE channel simulation on critical links, especially PCI Express Gen3 and 10G/40G KR Ethernet.
Do not mix voltage rails: the 10AX090R3F40I2LG requires separate rails for core, I/O banks, transceiver PLLs, and auxiliary circuits with strict power-up sequencing per the Arria 10 GX handbook. Hot-socketing configuration pins, JTAG TAP placement, and MSEL configuration mode settings must match the intended bitstream loading scheme; mismatches cause boot failures that are difficult to debug without an Altera USB-Blaster II.
合規資訊
RoHS compliant per Intel Altera product page. The 'G' suffix in the OPN denotes Pb-free / RoHS-compliant lead finish. Not AEC-Q100 qualified - FPGAs of this class typically target commercial/industrial/military markets rather than automotive. Halogen-free status not explicitly listed in verified data.