10M04SAU324I7G vs 10M08SAU324I7G 比較

詳細並排比較 10M04SAU324I7G 由 Intel 與 10M08SAU324I7G 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Intel
10M04SAU324I7G 10M04SAU324I7G - MAX 10 FPGA, 4K LE, 246 I/O | Intel

10M04SAU324I7G - MAX 10 FPGA, 4K LE, 246 I/O | Intel

10M04SAU324I7G ✓ 啟用中
Intel
10M08SAU324I7G 10M08SAU324I7G - MAX 10 FPGA 8K LE, 324-LFBGA | Intel

10M08SAU324I7G - MAX 10 FPGA 8K LE, 324-LFBGA | Intel

10M08SAU324I7G ✓ 啟用中

規格比較

參數 10M04SAU324I7G 10M08SAU324I7G
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 啟用中 啟用中
Family MAX 10 MAX 10 FPGA
Logic Elements (LE) 4,000 8000
Maximum User I/Os 246 —
Embedded Memory (bits) 193,536 —
Embedded Memory Blocks M9K, 16 Kbits each —
Number of Memory Blocks [DATA_NEEDED: M9K block count] —
Number of PLLs [DATA_NEEDED: PLL count for 10M04] —
Number of Global Clocks [DATA_NEEDED: global clock network count] —
Number of Analog Inputs (ADC) 4 (single-ended) / up to 8 (differential via soft IP) —
ADC Resolution 12-bit SAR —
ADC Sampling Rate [DATA_NEEDED: MSPS for 10M04 ADC] —
Configuration Memory On-chip dual-configuration flash (non-volatile) On-die flash (non-volatile)
Process Technology TSMC 55nm embedded flash —
Core Voltage 1.0 V (10M04S variant) —
工作溫度範圍 -40C to +100C (Industrial, 'I' grade) —
Speed Grade 7 (I7G speed bin) —
封裝 324-LFBGA (UBGA-324), 15 mm x 15 mm 324-LFBGA (UBGA-324), 15x15 mm
安裝類型 Surface Mount (BGA) Surface Mount
RoHS 狀態 Compliant Compliant
MSL 等級 3 —
Design Tool Intel Quartus Prime (Lite / Standard / Pro) —
Embedded User Flash — 387,072 bits
General Purpose SRAM — 246 Kbits
Embedded Multipliers (18x18) — [DATA_NEEDED: multiplier count]
PLLs — 2 (with up to 4 output taps)
Maximum User I/O Pins — 250
On-chip ADC — Dual 12-bit, 1 MSPS
Core Voltage (VCC) — 1.2 V
工作電源電壓 — 3 V / 3.3 V
Configuration Interface — JTAG (IEEE 1149.1), Active Serial
工作溫度 — -40C to +100C (Industrial)

資料表與資源

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