A3P600-1FGG144 vs A3P600-FGG144I 比較
詳細並排比較 A3P600-1FGG144 由 Microchip Technology 與 A3P600-FGG144I 由 Microchip Technology. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | A3P600-1FGG144 | A3P600-FGG144I |
|---|---|---|
| 品牌 | Microchip Technology | Microchip Technology |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 啟用中 | 啟用中 |
| Family | ProASIC3 | ProASIC3 |
| Total Gates | 600,000 | — |
| Logic Elements (CLBs) | 13,824 | — |
| Number of I/Os | 97 | — |
| Embedded RAM | 110,592 bits | — |
| Core Supply Voltage | 1.5 V | — |
| Maximum System Performance | 350 MHz | 231 MHz |
| 封裝 | 144-LBGA (FBGA) | 144-pin FBGA (FGG144) |
| Package Pitch | 1.00 mm | — |
| 安裝方式 | SMD/SMT | — |
| 工作溫度範圍 | 0 C to +70 C | — |
| Packaging | Tray | — |
| I/O Banks | 4 | — |
| Configuration | Flash-based (non-volatile) | — |
| RoHS 狀態 | Compliant | Compliant (lead-free) |
| System Gates | — | 600000 |
| Logic Modules (Tiles) | — | 13824 |
| RAM Bits | — | 110592 |
| User I/Os | — | 97 |
| Core Voltage | — | 1.5 V |
| 安裝類型 | — | Surface Mount |
| 工作溫度 | — | -40C to +100C (industrial) |
| Process Technology | — | 130nm flash |
| PLLs | — | 3 |
| I/O Standards | — | LVCMOS, LVTTL, PCI, etc. |
| Standard Package | — | 160 (tray) |