A3P600-2FG144 vs A3P600-2FGG144 比較

詳細並排比較 A3P600-2FG144 由 Microchip Technology 與 A3P600-2FGG144 由 Microsemi. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Microchip Technology
A3P600-2FG144 A3P600-2FG144 - ProASIC3 FPGA, 600K Gates | Microchip

A3P600-2FG144 - ProASIC3 FPGA, 600K Gates | Microchip

A3P600-2FG144 ✓ 啟用中
Microsemi
A3P600-2FGG144 A3P600-2FGG144 - 600K Gate Flash FPGA 144-FBGA | Microchip

A3P600-2FGG144 - 600K Gate Flash FPGA 144-FBGA | Microchip

A3P600-2FGG144 ✓ 啟用中

規格比較

參數 A3P600-2FG144 A3P600-2FGG144
品牌 Microchip Technology Microsemi
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 啟用中 啟用中
Series ProASIC3 —
Number of Logic Elements/Cells 13824 CLBs —
Total RAM Bits 110592 bits —
Number of I/O 97 —
Number of Gates 600000 —
Voltage - Supply 1.425V ~ 1.575V —
安裝類型 Surface Mount Surface Mount
封裝 / 外殼 144-LBGA —
Supplier Device Package 144-FPBGA (13x13) —
工作溫度 0°C ~ 85°C (TJ) [DATA_NEEDED: operating temperature range]
最大時脈頻率 350 MHz —
Number of PLLs 6 —
FlashROM 1024 bits —
RoHS 狀態 RoHS non-compliant [DATA_NEEDED: RoHS status]
Packaging Tray Tray
Manufacturer Lead Time 8 weeks —
Family — ProASIC3
Equivalent Gate Count — 600000 gates
Logic Cells (CLBs) — 13824 CLBs
User I/O — 97 I/O
System Performance — 310 MHz
Process Technology — 130 nm CMOS
Core Voltage — 1.5 V
Program Technology — Nonvolatile Flash
封裝 — 144-Ball FBGA (FGG144)
Ball Pitch — 1 mm
Speed Grade — -2
Configuration — Single-chip, Instant On, no external boot device
I/O Banks — 4 (independently supplied VCCIB banks)
Embedded Memory — [DATA_NEEDED: embedded RAM bits]

資料表與資源

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