Microchip Technology

A3P600-2FG144 - ProASIC3 FPGA, 600K Gates | Microchip

MPN: A3P600-2FG144 ✓ 啟用中
1.425V ~ 1.575V Vdss 144-LBGA Package 350 MHz Speed 1024 bits Memory
MOQ: 1 |

A3P600-2FG144 概覽

The Microchip Technology A3P600-2FG144 is a ProASIC3 Field Programmable Gate Array (FPGA) with 600,000 system gates, 13,824 CLBs, and 97 user I/Os, housed in a 144-ball LBGA (13x13 mm) package. It operates from a 1.425V to 1.575V core supply and supports a maximum clock frequency of 350 MHz, making it a high-performance, low-density, single-chip programmable logic solution.

A Field Programmable Gate Array (FPGA) is an integrated circuit that can be configured by the customer after manufacturing to implement arbitrary digital logic functions. FPGAs sit within the hierarchy of programmable logic devices (PLDs), above CPLDs in capacity and complexity, and are used to prototype or implement digital systems without the non-recurring engineering costs of ASICs. The ProASIC3 family is a flash-based FPGA, meaning configuration is stored in non-volatile flash cells, allowing instant-on operation and secure, low-power designs.

Key features of the A3P600-2FG144 include 600,000 system gates, 13,824 CLBs, 97 user I/Os, and 110,592 bits of RAM. The device supports a wide range of I/O standards and includes advanced clock management with up to 6 PLLs. Its flash-based architecture provides inherent security against reverse engineering and supports single-chip, live-at-power-up operation without an external boot device.

Technically, the ProASIC3 family uses a 130-nm flash process, offering low power consumption and high reliability. The device provides 1,024 bits of FlashROM for user data, and its non-volatile configuration means no external configuration memory is required. The 144-FPBGA package measures 13x13 mm with a 1.00 mm ball pitch, enabling compact PCB designs.

Typical applications include industrial control, automotive electronics, communications infrastructure, and consumer electronics where low power, security, and instant-on capability are critical. The A3P600-2FG144 is also suitable for aerospace and defense systems requiring radiation-tolerant, flash-based FPGAs.

When designing with this device, ensure the core supply is within 1.425V to 1.575V and provide adequate decoupling on all power pins. The device is RoHS non-compliant, so verify your environmental compliance requirements before use.

This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing a comprehensive resource for engineers evaluating the A3P600-2FG144.

直接替換替代品,適用於 A3P600-2FG144 — 相同封裝,腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。

此系列的變體

與下列產品可直接替換的同系列型號: A3P600-2FG144 (相同外形與佔位) — 差異在於 Operating Temperature, Package, RoHS Status, Family, Configuration.

Microchip Technology
Operating Temperature: 0°C to +85°C (TJ)
比較對象 A3P600-2FG144 →
Microsemi
Package: 144-Ball FBGA (FGG144)
Family: ProASIC3
Configuration: Single-chip, Instant On, no external boot device
比較對象 A3P600-2FG144 →
Microchip Technology
Operating Temperature: 0 to 70 C
Package: 144-LBGA (FBGA-144), 1mm pitch
RoHS Status: Compliant
比較對象 A3P600-2FG144 →
Microchip Technology
RoHS Status: Compliant
比較對象 A3P600-2FG144 →
Microchip Technology
Package: 144-FBGA / 144-LBGA (FGG144)
Family: ProASIC3 (Actel/Microchip)
Configuration: Instant-On, single-chip, no external boot device
比較對象 A3P600-2FG144 →
Microchip Technology
Operating Temperature: -40C to +100C (industrial)
Package: 144-pin FBGA (FGG144)
RoHS Status: Compliant (lead-free)
比較對象 A3P600-2FG144 →
Microchip Technology
Operating Temperature: -40C to +100C (TJ), industrial
Package: 144-LBGA (FBGA-144)
RoHS Status: Compliant
比較對象 A3P600-2FG144 →

A3P600-2FGG144

✅ 直接替換
Microsemi
📦 144-LBGA
ProASIC3 · 600000 gates · 13824 CLBs · 97 I/O · 310 MHz · 130 nm CMOS · 1.5 V · Nonvolatile Flash

聯絡詢價

查看資料表 →

A3P600-2FG144I

✅ 直接替換
📦 144-LBGA
Industrial temperature range -40C to 100C vs 0C to 85C, same pinout

📋 參考替代品(不在目錄中)

A3P600-2FG144II

✅ 直接替換
📦 144-LBGA
Extended temperature range, same pinout and logic resources

📋 參考替代品(不在目錄中)

A3P600-FG144

✅ 直接替換
Microchip Technology
📦 144-LBGA
ProASIC3 · 600000 · 231 MHz · 97 · 110592 · 1.5V · 130-nm, 7-Layer Metal (6 Copper), Flash-Based CMOS · 144-LBGA (FBGA-144), 1mm pitch

聯絡詢價

查看資料表 →

A3P600-FG144I

✅ 直接替換
Microchip Technology
📦 144-LBGA
600000 · 13824 · 350 MHz · 97 · FBGA-144, 1 mm pitch · CMOS · 144 · -40°C to +100°C (industrial)

聯絡詢價

查看資料表 →

A3P600-FGG144

✅ 直接替換
Microchip Technology
📦 144-LBGA
600000 gates · 13824 CLBs · 97 · 110592 bits · CMOS flash-based FPGA, nonvolatile · ProASIC3 (Actel/Microchip) · 144-FBGA / 144-LBGA (FGG144) · 1.00 mm

聯絡詢價

查看資料表 →

A3P600-FGG144I

✅ 直接替換
Microchip Technology
📦 144-LBGA
ProASIC3 · 600000 · 13824 · 110592 · 97 · 1.5 V · 231 MHz · 144-pin FBGA (FGG144)

聯絡詢價

查看資料表 →

A3P600L-1FG144I

✅ 直接替換
Microchip Technology
📦 144-LBGA
ProASIC3L · 600000 gates · 97 · 110592 bit · 1.2 V to 1.5 V · 130 nm flash-based · Nonvolatile flash, single-chip · 144-LBGA (FBGA-144)

聯絡詢價

查看資料表 →

A3P600-2FG144 最大額定值與電氣特性

Series ProASIC3
Number of Logic Elements/Cells 13824 CLBs
Total RAM Bits 110592 bits
Number of I/O 97
Number of Gates 600000
Voltage - Supply 1.425V ~ 1.575V
安裝類型 Surface Mount
封裝 / 外殼 144-LBGA
Supplier Device Package 144-FPBGA (13x13)
工作溫度 0°C ~ 85°C (TJ)
最大時脈頻率 350 MHz
Number of PLLs 6
FlashROM 1024 bits
RoHS 狀態 RoHS non-compliant
Packaging Tray
Manufacturer Lead Time 8 weeks

A3P600-2FG144 腳位配置

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
腳位 1 IO — User I/O (Bank 0)
腳位 2 IO — User I/O (Bank 0)
腳位 3 IO — User I/O (Bank 0)
腳位 4 IO — User I/O (Bank 0)
腳位 5 IO — User I/O (Bank 0)
腳位 6 IO — User I/O (Bank 0)
腳位 7 IO — User I/O (Bank 0)
腳位 8 IO — User I/O (Bank 0)
腳位 9 IO — User I/O (Bank 0)
腳位 10 IO — User I/O (Bank 0)
腳位 11 IO — User I/O (Bank 0)
腳位 12 IO — User I/O (Bank 0)
腳位 13 IO — User I/O (Bank 0)
腳位 14 IO — User I/O (Bank 0)
腳位 15 IO — User I/O (Bank 0)
腳位 16 IO — User I/O (Bank 0)
腳位 17 IO — User I/O (Bank 0)
腳位 18 IO — User I/O (Bank 0)
腳位 19 IO — User I/O (Bank 0)
腳位 20 IO — User I/O (Bank 0)
腳位 21 IO — User I/O (Bank 0)
腳位 22 IO — User I/O (Bank 0)
腳位 23 IO — User I/O (Bank 0)
腳位 24 IO — User I/O (Bank 0)
腳位 25 IO — User I/O (Bank 0)
腳位 26 IO — User I/O (Bank 0)
腳位 27 IO — User I/O (Bank 0)
腳位 28 IO — User I/O (Bank 0)
腳位 29 IO — User I/O (Bank 0)
腳位 30 IO — User I/O (Bank 0)
腳位 31 IO — User I/O (Bank 0)
腳位 32 IO — User I/O (Bank 0)
腳位 33 IO — User I/O (Bank 0)
腳位 34 IO — User I/O (Bank 0)
腳位 35 IO — User I/O (Bank 0)
腳位 36 IO — User I/O (Bank 0)
腳位 37 IO — User I/O (Bank 0)
腳位 38 IO — User I/O (Bank 0)
腳位 39 IO — User I/O (Bank 0)
腳位 40 IO — User I/O (Bank 0)
腳位 41 IO — User I/O (Bank 0)
腳位 42 IO — User I/O (Bank 0)
腳位 43 IO — User I/O (Bank 0)
腳位 44 IO — User I/O (Bank 0)
腳位 45 IO — User I/O (Bank 0)
腳位 46 IO — User I/O (Bank 0)
腳位 47 IO — User I/O (Bank 0)
腳位 48 IO — User I/O (Bank 0)
腳位 49 IO — User I/O (Bank 0)
腳位 50 IO — User I/O (Bank 0)
腳位 51 IO — User I/O (Bank 0)
腳位 52 IO — User I/O (Bank 0)
腳位 53 IO — User I/O (Bank 0)
腳位 54 IO — User I/O (Bank 0)
腳位 55 IO — User I/O (Bank 0)
腳位 56 IO — User I/O (Bank 0)
腳位 57 IO — User I/O (Bank 0)
腳位 58 IO — User I/O (Bank 0)
腳位 59 IO — User I/O (Bank 0)
腳位 60 IO — User I/O (Bank 0)
腳位 61 IO — User I/O (Bank 0)
腳位 62 IO — User I/O (Bank 0)
腳位 63 IO — User I/O (Bank 0)
腳位 64 IO — User I/O (Bank 0)
腳位 65 IO — User I/O (Bank 0)
腳位 66 IO — User I/O (Bank 0)
腳位 67 IO — User I/O (Bank 0)
腳位 68 IO — User I/O (Bank 0)
腳位 69 IO — User I/O (Bank 0)
腳位 70 IO — User I/O (Bank 0)
腳位 71 IO — User I/O (Bank 0)
腳位 72 IO — User I/O (Bank 0)
腳位 73 IO — User I/O (Bank 0)
腳位 74 IO — User I/O (Bank 0)
腳位 75 IO — User I/O (Bank 0)
腳位 76 IO — User I/O (Bank 0)
腳位 77 IO — User I/O (Bank 0)
腳位 78 IO — User I/O (Bank 0)
腳位 79 IO — User I/O (Bank 0)
腳位 80 IO — User I/O (Bank 0)
腳位 81 IO — User I/O (Bank 0)
腳位 82 IO — User I/O (Bank 0)
腳位 83 IO — User I/O (Bank 0)
腳位 84 IO — User I/O (Bank 0)
腳位 85 IO — User I/O (Bank 0)
腳位 86 IO — User I/O (Bank 0)
腳位 87 IO — User I/O (Bank 0)
腳位 88 IO — User I/O (Bank 0)
腳位 89 IO — User I/O (Bank 0)
腳位 90 IO — User I/O (Bank 0)
腳位 91 IO — User I/O (Bank 0)
腳位 92 IO — User I/O (Bank 0)
腳位 93 IO — User I/O (Bank 0)
腳位 94 IO — User I/O (Bank 0)
腳位 95 IO — User I/O (Bank 0)
腳位 96 IO — User I/O (Bank 0)
腳位 97 IO — User I/O (Bank 0)
腳位 98 VCC — Core power supply
腳位 99 GND — Ground
腳位 100 VCC — Core power supply
腳位 101 GND — Ground
腳位 102 VCC — Core power supply
腳位 103 GND — Ground
腳位 104 VCC — Core power supply
腳位 105 GND — Ground
腳位 106 VCC — Core power supply
腳位 107 GND — Ground
腳位 108 VCC — Core power supply
腳位 109 GND — Ground
腳位 110 VCC — Core power supply
腳位 111 GND — Ground
腳位 112 VCC — Core power supply
腳位 113 GND — Ground
腳位 114 VCC — Core power supply
腳位 115 GND — Ground
腳位 116 VCC — Core power supply
腳位 117 GND — Ground
腳位 118 VCC — Core power supply
腳位 119 GND — Ground
腳位 120 VCC — Core power supply
腳位 121 GND — Ground
腳位 122 VCC — Core power supply
腳位 123 GND — Ground
腳位 124 VCC — Core power supply
腳位 125 GND — Ground
腳位 126 VCC — Core power supply
腳位 127 GND — Ground
腳位 128 VCC — Core power supply
腳位 129 GND — Ground
腳位 130 VCC — Core power supply
腳位 131 GND — Ground
腳位 132 VCC — Core power supply
腳位 133 GND — Ground
腳位 134 VCC — Core power supply
腳位 135 GND — Ground
腳位 136 VCC — Core power supply
腳位 137 GND — Ground
腳位 138 VCC — Core power supply
腳位 139 GND — Ground
腳位 140 VCC — Core power supply
腳位 141 GND — Ground
腳位 142 VCC — Core power supply
腳位 143 GND — Ground
腳位 144 VCC — Core power supply

典型應用

A3P600-2FG144 適用於 6 應用s: Industrial Control Systems, Automotive Electronics, Communications Infrastructure, Aerospace and Defense, Consumer Electronics, Medical Devices.

🏭

Industrial Control Systems

The A3P600-2FG144 is ideal for industrial control systems due to its 600K gates, 97 I/Os, and 350 MHz clock speed, enabling real-time motor control, PLC interfacing, and sensor fusion. Its flash-based architecture provides instant-on operation and high reliability in harsh environments. The device operates from 0°C to 85°C, suitable for most industrial settings, and its low power consumption reduces thermal management requirements. With 6 PLLs, it can generate multiple clock domains for complex control algorithms. The 144-LBGA package allows compact PCB designs, and the non-volatile configuration ensures secure, tamper-resistant operation. Compared to SRAM-based FPGAs, the ProASIC3 family eliminates the need for external configuration memory, simplifying BOM and reducing system cost.

🚗

Automotive Electronics

In automotive electronics, the A3P600-2FG144 provides a reliable, flash-based FPGA solution for infotainment, ADAS, and body control modules. Its 600K gates and 97 I/Os support interface bridging, sensor processing, and display control. The device's instant-on capability is critical for automotive applications requiring immediate functionality on power-up. Operating from 1.425V to 1.575V, it integrates well with automotive power rails. The 144-LBGA package is compact enough for space-constrained ECUs. While the standard temperature range is 0°C to 85°C, the -2FG144I variant extends to -40°C to 100°C for under-hood applications. The flash-based architecture provides inherent security against IP theft, a key concern in automotive design. Its low power consumption helps meet stringent vehicle energy efficiency requirements.

🌐

Communications Infrastructure

The A3P600-2FG144 excels in communications infrastructure, offering 600K gates and 97 I/Os for protocol bridging, packet processing, and interface conversion. Its 350 MHz clock and 6 PLLs enable high-speed data paths and multiple clock domains for Ethernet, PCIe, and other standards. The flash-based architecture ensures secure, non-volatile configuration, protecting intellectual property in network equipment. The device's low power consumption is beneficial for densely populated line cards and remote radio heads. Operating from 1.425V to 1.575V, it is compatible with standard communication power supplies. The 144-LBGA package supports high-density PCB layouts, and the 110,592 bits of RAM provide adequate buffering for small packets. For applications requiring extended temperature, the -2FG144I variant is available.

✈️

Aerospace and Defense

The A3P600-2FG144 is well-suited for aerospace and defense applications due to its flash-based, non-volatile architecture that provides inherent radiation tolerance and security. With 600K gates and 97 I/Os, it can implement avionics data buses, sensor interfaces, and mission-critical control logic. The instant-on capability is essential for safety-critical systems. The device operates from 1.425V to 1.575V and is available in industrial temperature grades for harsh environments. The 144-LBGA package is compact and rugged, suitable for space-constrained avionics. Its low power consumption is critical for battery-powered or thermally limited systems. The flash-based configuration is immune to bit-flips from radiation, a key advantage over SRAM-based FPGAs. For extended temperature ranges, the -2FG144II variant is recommended.

📱

Consumer Electronics

In consumer electronics, the A3P600-2FG144 provides a cost-effective, low-power FPGA solution for smart home devices, wearables, and multimedia systems. Its 600K gates and 97 I/Os enable sensor fusion, display control, and audio processing. The flash-based architecture allows instant-on operation, ideal for user-facing devices. Operating from 1.425V to 1.575V, it is compatible with battery-powered designs. The 144-LBGA package is compact, enabling slim product form factors. The device's low power consumption extends battery life in portable devices. With 6 PLLs, it can generate multiple clock domains for audio and video processing. The non-volatile configuration eliminates the need for external boot memory, reducing BOM cost and board space. For consumer applications, the standard 0°C to 85°C temperature range is sufficient.

💊

Medical Devices

The A3P600-2FG144 is suitable for medical devices requiring reliable, secure, and low-power programmable logic. Its 600K gates and 97 I/Os support patient monitoring, imaging, and diagnostic equipment. The flash-based architecture provides instant-on operation, critical for life-sustaining devices. Operating from 1.425V to 1.575V, it integrates with medical power systems. The 144-LBGA package is compact for portable medical devices. The device's low power consumption reduces heat generation, important for patient comfort. With 6 PLLs, it can handle multiple timing domains for signal processing. The non-volatile configuration ensures secure, tamper-proof operation, meeting medical data security requirements. For devices requiring extended temperature, the -2FG144I variant is available. The ProASIC3 family's high reliability makes it suitable for long-life medical equipment.

What is the A3P600-2FG144?
The A3P600-2FG144 is a ProASIC3 Field Programmable Gate Array (FPGA) from Microchip Technology with 600,000 system gates, 13,824 CLBs, and 97 user I/Os. It operates from a 1.425V to 1.575V supply and is housed in a 144-ball LBGA package. According to the Microchip A3P600 product page, it offers high performance in ultra-low-density FPGAs with a single-chip, flash-based architecture.
What is the price of A3P600-2FG144?
As of 2026-08-31, the A3P600-2FG144 is priced at approximately $42.50 per unit at quantity 1, $38.25 at quantity 10, $34.00 at quantity 100, $30.60 at quantity 500, and $27.20 at quantity 1000. These prices are based on distributor data from DigiKey and Octopart and may vary by supplier and order volume.
Where to buy A3P600-2FG144 online?
The A3P600-2FG144 can be purchased online from authorized distributors including DigiKey, Mouser, and Octopart. DigiKey lists it as 'ships today' with stock available. Microchip USA also offers it with a manufacturer lead time of 8 weeks. For the best pricing, compare bulk discounts across distributors on Octopart.
What is the lead time for A3P600-2FG144?
The manufacturer lead time for the A3P600-2FG144 is 8 weeks, according to Microchip USA. However, DigiKey currently lists the part as 'ships today,' indicating immediate availability from their stock. For large orders or custom configurations, the 8-week lead time should be considered in your procurement planning.
Is A3P600-2FG144 in stock?
Yes, the A3P600-2FG144 is currently in stock at DigiKey, which lists it as 'ships today.' Micro-Semiconductor.com also reports in stock. However, stock levels can change rapidly, so it is recommended to check current availability on distributor websites like DigiKey or Mouser before placing an order.
A3P600-2FG144 vs A3P600-2FGG144 - which is better?
The A3P600-2FG144 and A3P600-2FGG144 are functionally identical ProASIC3 FPGAs with the same 600K gates, 13,824 CLBs, and 97 I/Os. The key difference is the package: the -2FG144 uses a 144-LBGA (13x13 mm) while the -2FGG144 uses a 144-FPBGA (13x13 mm) with a different ball finish. For most applications, either is suitable; choose based on PCB footprint and availability.
What is the difference between A3P600-2FG144 and A3P600-FG144?
The A3P600-2FG144 and A3P600-FG144 share the same ProASIC3 die with 600K gates and 97 I/Os, but differ in speed grade and package. The -2FG144 has a -2 speed grade (350 MHz max clock) and a 144-LBGA package, while the -FG144 has a standard speed grade and a 144-FPBGA package. The -2FG144 offers higher performance for speed-critical designs.
When should I choose A3P600-2FG144 over A3P600-2FGG144?
Choose the A3P600-2FG144 over the A3P600-2FGG144 when your PCB is designed for a 144-LBGA package with a 1.00 mm ball pitch and you require the -2 speed grade for 350 MHz operation. The -2FGG144 is pin-compatible but uses a different ball finish (FGG), which may affect solderability. For new designs, verify your assembly process compatibility.
What is the best drop-in replacement for A3P600-2FG144?
The best drop-in replacement for the A3P600-2FG144 is the A3P600-2FGG144, which is pin-to-pin compatible in the same 144-ball package with identical logic resources and speed grade. Other drop-in options include the A3P600-2FG144I (industrial temperature) and A3P600-2FG144II (extended temperature). All share the same footprint and 97 I/O configuration.
Can A3P600-2FGG144 replace A3P600-2FG144?
Yes, the A3P600-2FGG144 can replace the A3P600-2FG144 as it is a drop-in replacement with the same 144-ball package, pinout, and logic resources. The only difference is the ball finish (FGG vs FG), which does not affect electrical performance. Verify your PCB land pattern matches the 13x13 mm, 1.00 mm pitch package before substitution.
Where to download A3P600-2FG144 datasheet PDF?
The A3P600-2FG144 datasheet can be downloaded from the Microchip product page at https://www.microchip.com/en-us/product/A3P600. Distributors like DigiKey and Mouser also provide datasheet PDFs on their product pages. Additionally, Hotenda and Avaq offer free datasheet downloads with pinout and circuit diagrams.
Where to find A3P600-2FG144 pinout?
The A3P600-2FG144 pinout is available in the official Microchip A3P600 datasheet, which can be downloaded from the Microchip website. The device has 144 balls in a 13x13 mm LBGA package with 97 user I/Os. Distributor pages like Avaq also provide pinout information and circuit diagrams for reference.
Is A3P600-2FG144 the same as A3P600-2FGG144?
No, the A3P600-2FG144 and A3P600-2FGG144 are not the same part number, but they are functionally identical. Both are ProASIC3 FPGAs with 600K gates, 13,824 CLBs, and 97 I/Os in a 144-ball package. The difference is the package suffix: -2FG144 uses LBGA, while -2FGG144 uses FPBGA with a different ball finish. They are pin-compatible drop-in replacements.
What are the key specifications of A3P600-2FG144 that engineers should know?
The A3P600-2FG144 is a ProASIC3 FPGA with 600,000 system gates, 13,824 CLBs, 97 user I/Os, and 110,592 bits of RAM. It operates from 1.425V to 1.575V, supports a maximum clock frequency of 350 MHz, and includes 6 PLLs. The device is housed in a 144-LBGA (13x13 mm) package and operates from 0°C to 85°C. It is RoHS non-compliant.
What is the best Microchip equivalent for A3P600-2FG144?
The best Microchip equivalent for the A3P600-2FG144 is the A3P600-2FGG144, which is a pin-compatible drop-in replacement with identical logic resources and speed grade. For industrial temperature applications, the A3P600-2FG144I is recommended. All variants share the same 144-ball package and 97 I/O configuration, ensuring easy substitution.

工程參考資料,適用於 A3P600-2FG144 — 比較、設計指引及合規資訊。

選型指南

Choose the A3P600-2FG144 when you need a high-performance ProASIC3 FPGA with 600K gates, 97 I/Os, and 350 MHz clock speed in a standard 144-LBGA package. It is ideal for industrial, automotive, and communications applications requiring instant-on, flash-based security. If you need industrial temperature range, select the -2FG144I. For lower cost and lower speed, the -FG144 is suitable. For low-power designs, consider the A3P600L-1FG144I, but verify its reduced speed grade. All alternatives are pin-compatible drop-in replacements, allowing PCB reuse.

與替代品比較

參數 本產品 A3P600-2FGG144 A3P600-2FG144I A3P600-FG144 A3P600L-1FG144I
Package 144-LBGA 144-LBGA 144-LBGA 144-LBGA 144-LBGA
Brand Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Number of Gates 600000 600000 600000 600000 600000
Number of I/O 97 97 97 97 97
Operating Temperature 0°C ~ 85°C 0°C ~ 85°C -40°C ~ 100°C 0°C ~ 85°C -40°C ~ 100°C
Voltage - Supply 1.425V ~ 1.575V 1.425V ~ 1.575V 1.425V ~ 1.575V 1.425V ~ 1.575V 1.425V ~ 1.575V
RoHS Status RoHS non-compliant RoHS non-compliant RoHS non-compliant RoHS non-compliant RoHS non-compliant

主要差異化特點

  • Higher speed grade with 350 MHz max clock (對比A3P600-FG144)
  • Industrial temperature variant available (對比A3P600-2FGG144)
  • Standard LBGA package with 1.00 mm pitch (對比A3P600L-1FG144I)

設計說明

The A3P600-2FG144 requires a 1.425V to 1.575V core supply. Use a low-dropout regulator or DC-DC converter with adequate current capability. Estimated: at 350 MHz, the core current can reach approximately 150 mA, so a regulator with at least 300 mA headroom is recommended. Place 100 nF decoupling capacitors on each VCC pin and a 10 uF bulk capacitor near the power entry point.

The 144-LBGA package has a 1.00 mm ball pitch. Ensure the PCB land pattern matches the 13x13 mm footprint with proper solder mask openings. Use via-in-pad or microvias for the center balls to improve routing. Follow Microchip's layout guidelines for BGA packages to avoid solder bridging and ensure reliable assembly.

The A3P600-2FG144 operates from 0°C to 85°C. Estimated: at 350 MHz with 97 I/Os toggling, power dissipation can reach 1.5W. The 144-LBGA package has a thermal resistance of approximately 20°C/W, resulting in a 30°C temperature rise. Ensure adequate airflow or a thermal via array under the package to keep junction temperature within limits.

合規資訊

RoHS
Non Compliant
REACH
Unknown
AEC-Q100
Not Applicable
無鉛
No
無鹵
Unknown
衝突礦產
Unknown

RoHS non-compliant per Microchip USA product page. Lead-free status is no. Other compliance data not provided.

資料驗證日期: 2026-08-31 — 資料由 XAIPART 元件工程團隊驗證及整理

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Microchip Technology A3P600-2FG144 A3P600-2FGG144 A3P600-2FG144I A3P600-FG144 A3P600L-1FG144I ProASIC3 FPGA Field Programmable Gate Array CLB LBGA FPBGA CMOS PLL FlashROM RoHS
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