A3PE3000-2FGG324 vs A3PE3000-2FG324I 比較
詳細並排比較 A3PE3000-2FGG324 由 Microchip Technology 與 A3PE3000-2FG324I 由 Microchip Technology. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
Microchip Technology
A3PE3000-2FGG324 - ProASIC3E FPGA 3M Gates 324-BGA | Microchip
A3PE3000-2FGG324 ✓ 啟用中Microchip Technology
A3PE3000-2FG324I - ProASIC3E Flash FPGA 35K LEs | Microchip
A3PE3000-2FG324I ✓ 啟用中規格比較
| 參數 | A3PE3000-2FGG324 | A3PE3000-2FG324I |
|---|---|---|
| 品牌 | Microchip Technology | Microchip Technology |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 啟用中 | 啟用中 |
| Family | ProASIC3E | ProASIC3E |
| System Gates | 3000000 | 3M gates |
| Logic Cells | 75264 | — |
| CLBs | 75264 | — |
| Maximum System Frequency | 310 MHz | — |
| Process Technology | 130 nm CMOS flash | 130 nm flash |
| Core Supply Voltage | 1.5 V | 1.5 V |
| Configuration Memory | Flash (single-chip, instant-on) | Non-volatile Flash (single chip) |
| User I/O | 221 | — |
| Total Memory Bits | [DATA_NEEDED: embedded SRAM capacity] | — |
| 封裝 | 324-ball FBGA (FGG324) | — |
| Package Dimensions | 19 x 19 mm, 1 mm pitch, 1.63 mm height | — |
| 安裝類型 | Surface Mount | — |
| Speed Grade | 2 | -2 |
| 工作溫度 | [DATA_NEEDED: operating temperature range] | — |
| Packaging Type | Tray | — |
| RoHS 狀態 | Green (RoHS compliant) | — |
| Automotive Qualification | Not qualified (standard grade) | — |
| Manufacturer | — | Microchip Technology (Microsemi) |
| Logic Elements (LEs) | — | 35000 LEs |
| Maximum System Performance | — | 310 MHz |
| Number of I/Os | — | 221 I/O |
| 封裝 / 外殼 | — | 324-Ball FBGA |
| 安裝方式 | — | SMD/SMT |
| Operating Temperature (Min) | — | -40 C |
| Operating Temperature (Max) | — | +85 C |
| Temperature Grade | — | Industrial (I) |
| Packaging | — | Tray |
| Product Series | — | A3PE3000 |