A3PE3000-FG324 vs A3PE3000-2FGG324 比較

詳細並排比較 A3PE3000-FG324 由 Microchip Technology 與 A3PE3000-2FGG324 由 Microchip Technology. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Microchip Technology
A3PE3000-FG324 A3PE3000-FG324 - ProASIC3E FPGA 3M Gates 324-BGA | Microchip

A3PE3000-FG324 - ProASIC3E FPGA 3M Gates 324-BGA | Microchip

A3PE3000-FG324 ✓ 啟用中
Microchip Technology
A3PE3000-2FGG324 A3PE3000-2FGG324 - ProASIC3E FPGA 3M Gates 324-BGA | Microchip

A3PE3000-2FGG324 - ProASIC3E FPGA 3M Gates 324-BGA | Microchip

A3PE3000-2FGG324 ✓ 啟用中

規格比較

參數 A3PE3000-FG324 A3PE3000-2FGG324
品牌 Microchip Technology Microchip Technology
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 啟用中 啟用中
Family ProASIC3E Flash Family ProASIC3E
System Gates 3,000,000 3000000
Logic Elements / CLBs 75,264 —
Maximum System Frequency 231 MHz 310 MHz
Process Technology 130 nm CMOS 130 nm CMOS flash
Core Supply Voltage 1.5 V 1.5 V
User I/Os 221 —
Configuration Technology Flash (non-volatile, single-chip) —
In-System Programming Yes (JTAG, IEEE 1532-compliant) —
Security 128-bit AES decryption via JTAG; FlashLock —
封裝 324-ball FBGA (FG324), 19 x 19 mm, 1.63 mm height, 1.0 mm pitch 324-ball FBGA (FGG324)
安裝類型 Surface Mount Surface Mount
Packaging Tray —
工作溫度 [DATA_NEEDED: operating temperature range] [DATA_NEEDED: operating temperature range]
Embedded Memory [DATA_NEEDED: embedded SRAM bits] —
PLLs [DATA_NEEDED: number of PLLs] —
I/O Standards Supported [DATA_NEEDED: supported I/O standards] —
RoHS 狀態 RoHS Non-Compliant (contains lead, per digichip listing) Green (RoHS compliant)
Lead Free Status Contains Lead (per digichip listing) —
Device ESD/HBM Rating [DATA_NEEDED: ESD rating] —
Logic Cells — 75264
CLBs — 75264
Configuration Memory — Flash (single-chip, instant-on)
User I/O — 221
Total Memory Bits — [DATA_NEEDED: embedded SRAM capacity]
Package Dimensions — 19 x 19 mm, 1 mm pitch, 1.63 mm height
Speed Grade — 2
Packaging Type — Tray
Automotive Qualification — Not qualified (standard grade)

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