A3PE600-FG256I - 600K Gate Flash FPGA, 256-FBGA | Microchip
MPN： A3PE600-FG256I ✓ 啟用中A3PE600-FG256I 概覽
A flash-based FPGA is a field-programmable gate array whose configuration is stored in on-chip flash memory rather than an external configuration device or SRAM cells. Within the programmable logic hierarchy, the A3PE600 belongs to the ProASIC3E enhanced family, positioned above the base ProASIC3 (A3P) family with added embedded memory bandwidth and DSP-friendly features, making it a single-chip, live-at-power-up solution for system logic integration.
Key differentiating features include nonvolatile Flash configuration (no boot PROM, instant-on operation, inherently single-chip), 1.5V core operation for low dynamic power, enhanced embedded SRAM blocks suited to FIFO and dual-port buffering, and support for DDR interfaces on the E variant. The fabric is built on a 130nm CMOS process with Microsemi's flash switch technology, giving high immunity to configuration upset compared with SRAM FPGAs.
Architecturally, the device is organized as 13,824 VersaTiles (CLB-equivalent cells) with a sea-of-tiles mesh, plus dedicated blocks: embedded SRAM, and flexible I/O banks supporting multiple single-ended and differential standards. Timing closure is achieved through the Libero SoC design suite with Synplify synthesis.
Typical applications include industrial control and automation, aerospace and defense subsystems, secure bridge logic, communications line cards, medical instrumentation, and test equipment, where instant-on nonvolatile configuration and long-lifecycle supply are valued.
Design consideration: the FG (standard) package variant is RoHS non-compliant / contains lead per distributor data - the FGG variant is the green, lead-free option in the identical 256-ball footprint, so new lead-free designs should specify A3PE600-FGG256I.
This page synthesizes verified distributor data, same-family drop-in packaging variants, and practical design guidance not consolidated on the manufacturer datasheet.
直接替換替代品，適用於 A3PE600-FG256I — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： A3PE600-FG256I （相同外形與佔位） — 差異在於 Package, RoHS Status, Configuration Memory, Process Technology, Family.
A3PE600-FGG256I
✅ 直接替換聯絡詢價
查看資料表 →A3PE600-FGG256
✅ 直接替換聯絡詢價
查看資料表 →A3PE600-2FGG256
✅ 直接替換聯絡詢價
查看資料表 →A3PE600-FG256
✅ 直接替換聯絡詢價
查看資料表 →A3P600-FG256I
✅ 直接替換聯絡詢價
查看資料表 →M7AFS600-FGG256I
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →A3PE600-FG256I 最大額定值與電氣特性
| Logic Gates | 600000 |
| D Flip-Flops (DFFs) | 13824 |
| CLBs / VersaTiles | 13824 |
| Number of User I/O | 165 |
| Maximum System Frequency | 350 MHz |
| Core Supply Voltage | 1.425 V to 1.575 V |
| Technology | 130 nm CMOS flash-based |
| Configuration Memory | Nonvolatile Flash (single-chip, live at power-up) |
| 工作溫度 | -40C to +100C (TJ), industrial |
| 封裝 | 256-FBGA (LBGA), 17 x 17 mm, 1.0 mm pitch |
| 安裝類型 | Surface Mount |
| Packaging | Tray |
| RoHS 狀態 | RoHS Non-Compliant (contains lead; FGG variant is green) |
| Lead Free Status | Contains Lead |
| Family | ProASIC3E |
| Speed Grade | Standard (-1) |
A3PE600-FG256I 256-fbga (lbga), 17 x 17 mm, 1.0 mm pitch 腳位配置指南
A3PE600-FG256I（256-fbga (lbga), 17 x 17 mm, 1.0 mm pitch 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： A3PE600-FG256I.
請參閱 資料表 以查看完整腳位配置。
典型應用
A3PE600-FG256I 適用於 6 應用s: Industrial Control and Automation, Aerospace and Defense Subsystems, Secure Bridge and Interface Logic, Communications Line Cards and Backplane Bridging, Medical Instrumentation, Test and Measurement Equipment.
Industrial Control and Automation
Factory automation and motor-control supervisory logic benefit directly from the A3PE600-FG256I's instant-on flash configuration: the FPGA is live within microseconds of power application, eliminating boot-delay hazards in interlock and safety-adjacent logic. With 13,824 D flip-flops and 165 user I/O, a single device can consolidate PLC glue logic, encoder interfaces, and parallel bus bridging, while the -40C to +100C industrial temperature range covers unconditioned cabinet environments. The 1.425V-1.575V core keeps dynamic power low relative to SRAM FPGAs of similar density, easing thermal design in sealed enclosures. Place the device near the I/O connector field and provide solid bank decoupling; use the industrial -I grade, not the commercial variant, for field equipment.
推薦
Aerospace and Defense Subsystems
Flash-based ProASIC3E fabric offers inherently high immunity to configuration upset, a decisive advantage over SRAM FPGAs in avionics, satellite payload logic, and defense platforms where single-event configuration errors are unacceptable. The A3PE600-FG256I stores its bitstream in nonvolatile flash, requires no external configuration PROM (reducing parts count and failure points), and its 600K-gate / 165 I/O capacity handles telemetry framing, bus bridging (MIL-STD-1553 companion logic, ARINC glue), and sensor aggregation. The industrial -40C to +100C rating suits conduction-cooled enclosures. For new aerospace designs, specify the FGG lead-free variant unless legacy solder processes dictate the leaded FG metallization.
推薦
Secure Bridge and Interface Logic
The nonvolatile flash fabric of the A3PE600-FG256I makes it well suited to secure bridge logic, anti-tamper glue logic, and proprietary interface conversion where the bitstream must not be externally readable at power-up - unlike SRAM FPGAs whose configuration streams over the bus and can be intercepted. The single-chip design removes the configuration read path entirely. With 165 user I/O and 350 MHz-class system performance, it converts between legacy parallel buses, memory-style interfaces, and custom serial links. Microchip's flash FPGA security features (flash lock) should be enabled in the bitstream generation step of Libero. The industrial temperature grade supports extended field deployment in network and defense infrastructure.
推薦
Communications Line Cards and Backplane Bridging
Telecom and datacom line cards use the A3PE600-FG256I as backplane glue: PCI-style parallel bridges, framing logic, and FIFO buffering between PHYs and processors. The ProASIC3E variant's enhanced embedded SRAM blocks implement deep FIFOs and dual-port buffers natively, and the 350 MHz system ceiling comfortably covers line-rate byte-parallel processing at OC-3/STM-1 class rates. The 1.5V core limits switching power on densely populated cards, and instant-on flash startup lets the card enumerate before host bring-up completes. Budget I/O banks by voltage domain early, since 165 user I/O across FBGA banks constrains mixed-voltage floorplanning on a 17 x 17 mm package.
推薦
Medical Instrumentation
Diagnostic and laboratory instruments employ the A3PE600-FG256I for sensor timing, ADC framing, and display/control interface logic. Flash configuration means measurement subsystems are operational the instant power is applied - important for instruments that perform power-on self-calibration sequences. The 130nm flash fabric produces no configuration-read radiation and low core noise at 1.5V, helping sensitive analog front ends sharing the board. The 600K-gate fabric consolidates touch-panel interfaces, motor-stage control, and acquisition timing in one device, reducing validation surface. Medical OEMs also value the pin-compatible FGG lead-free variant for RoHS-driven supply-chain resilience; qualify both suffixes on the same footprint during design.
推薦
Test and Measurement Equipment
Bench instruments, protocol analyzers, and automatic test equipment use the A3PE600-FG256I for pattern generation, capture logic, and DUT interface adaptation. The 350 MHz system performance and 13,824 DFFs support high-frequency pattern engines, while 165 user I/O maps well to probe heads and multi-channel pod interfaces. Instant-on flash startup means the instrument's digital subsystem is ready during the host OS boot, cutting measurement-cycle latency. The FBGA footprint's 1.0 mm pitch simplifies signal-access probing compared with finer-pitch BGA families. For instruments requiring higher-speed capture, the -2 speed grade in the same 256-FBGA footprint (A3PE600-2FGG256) provides faster I/O timing without PCB redesign.
推薦
推薦產品摘要
工程參考資料，適用於 A3PE600-FG256I — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | A3PE600-FGG256I | A3PE600-FGG256 | A3PE600-2FGG256 | A3P600-FG256I |
|---|---|---|---|---|---|
| Package | 256-FBGA (17 x 17 mm, 1.0 mm pitch) | 256-FBGA - same footprint | 256-FBGA - same footprint | 256-FBGA - same footprint | 256-LBGA - same footprint |
| Brand / Family | Microchip Technology - ProASIC3E | Microchip - ProASIC3E | Microchip - ProASIC3E | Microchip - ProASIC3E | Microchip - ProASIC3 (base) |
| System Gates | 600,000 | 600,000 | 600,000 | 600,000 | 600,000 |
| User I/O | 165 | 165 | 165 | 165 | 177 |
| Operating Temperature | -40C to +100C (TJ), industrial | -40C to +100C (TJ), industrial | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (TJ), industrial |
| Core Supply Voltage | 1.425 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V |
主要差異化特點
- Nonvolatile flash configuration, single-chip instant-on (對比A3P600-FG256I)
- Industrial temperature rating with lead-free option in the same footprint (對比A3PE600-FGG256)
- Faster timing headroom without PCB change (對比A3PE600-2FGG256)
設計說明
Supply the 1.5V core rail from a regulator holding 1.425V-1.575V across load transients; core dynamic current scales with clock activity, so budget per Libero power-analysis reports rather than worst-case sheet values. I/O banks each need their own VCCI rails matched to the selected I/O standards - mixed 3.3V/2.5V/1.8V banks are common in bridge applications. Add bulk (47-100 uF) plus per-ball-pair 0.1 uF decoupling; the FBGA ball field makes inner-ball decoupling placement critical in early layout passes.
The 256-FBGA has 1.0 mm pitch with escape routing feasible on 4 layers minimum (signal via-in-pad or dog-bone escapes under the array). Reserve the two outermost ball rows for user I/O where possible and keep power/ground balls near the center for short via throws to internal planes. Because 91 of 256 balls are non-user-I/O (power, ground, programming), confirm bank assignments in the datasheet package chapter before committing the stack-up; fanout errors here are the most common cause of respins.
The FG suffix is RoHS non-compliant (contains lead) - for new global-market builds, migrate the identical design to A3PE600-FGG256I; the footprint and bitstream are unchanged, but green molding compound may shift the reflow profile, so re-qualify the assembly process. Also verify speed-grade timing margins with the actual -1 grade models in Libero before locking the design; if STA margins are under ~10%, move to the -2 grade rather than attempting over-constraint workarounds.
合規資訊
Per distributor datasheet data (digchip), the A3PE600-FG256I has Lead Free Status 'Contains Lead' and RoHS Status 'RoHS Non-Compliant'. The FGG suffix variants are the green/lead-free equivalents in the same 256-FBGA footprint.
