AFS600-2FGG256 vs M7AFS600-FG256I 比較

詳細並排比較 AFS600-2FGG256 由 Microchip Technology 與 M7AFS600-FG256I 由 Microchip Technology. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Microchip Technology
AFS600-2FGG256 AFS600-2FGG256 - 600K-Gate Mixed-Signal FPGA | Microchip

AFS600-2FGG256 - 600K-Gate Mixed-Signal FPGA | Microchip

AFS600-2FGG256 ✓ 啟用中
Microchip Technology
M7AFS600-FG256I M7AFS600-FG256I - 600K Gate Mixed-Signal FPGA | Microchip

M7AFS600-FG256I - 600K Gate Mixed-Signal FPGA | Microchip

M7AFS600-FG256I ✓ 啟用中

規格比較

參數 AFS600-2FGG256 M7AFS600-FG256I
品牌 Microchip Technology Microchip Technology
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 啟用中 啟用中
Product Type Fusion mixed-signal FPGA —
System Gates Approximately 600,000 gates 600K
Configurable Logic Blocks 13,824 CLBs —
Reported Logic Elements 7,000 LE —
Number of I/O 119 I/O 119 I/O
封裝 256-LBGA —
Package Pin Count 256 balls —
Package Pitch 1.0 mm —
工作電源電壓 1.5 V —
工作溫度 0°C to +70°C —
Process Technology 130 nm CMOS 130 nm
Metal Layers 7 layers —
Configuration Memory Nonvolatile flash —
Power-Up Feature Live at Power-Up —
Maximum DDR Data Rate 700 Mbps —
I/O Features Hot-swappable I/O, programmable slew rate, programmable drive strength, weak pull-up/pull-down —
安裝類型 SMD/SMT —
Packaging Tray Tray
RoHS 狀態 RoHS compliant —
Lead-Free Status Lead free —
Series — M7AFS600 (Fusion)
Logic Capacity (DigiKey listing) — 110592
Embedded Processor — ARM CoreMP7
Core Supply Voltage — 1.5 V
封裝 / 外殼 — 256-LBGA (FBGA)
Terminal Form — Ball
Package Shape — Square
安裝方式 — SMD/SMT
Minimum Operating Temperature — -40 C
Maximum Operating Temperature — +85 C
Programmable Logic Type — Flash-based, non-volatile
Analog Integration — Mixed-signal (configurable analog + flash memory)

資料表與資源

瀏覽所有產品 建立 BOM 索取報價