AFS600-FGG256 vs M7AFS600-FGG256I 比較
詳細並排比較 AFS600-FGG256 由 Microchip Technology 與 M7AFS600-FGG256I 由 Microchip Technology. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
Microchip Technology
M7AFS600-FGG256I - 600K-Gate Mixed-Signal FPGA | Microchip
M7AFS600-FGG256I ✓ 啟用中規格比較
| 參數 | AFS600-FGG256 | M7AFS600-FGG256I |
|---|---|---|
| 品牌 | Microchip Technology | Microchip Technology |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | Unknown | 啟用中 |
| Device Type | Fusion mixed-signal FPGA | — |
| System Gates | 600,000 gates | 600K |
| Configurable Logic Cells | 13,824 cells | — |
| I/O Count | 119 I/Os | — |
| 供應電壓 | 1.5 V | — |
| Logic Family | CMOS | — |
| Process Technology | 130 nm | 130 nm |
| Metal Layers | 7 layers | — |
| Configuration Memory | Flash-based nonvolatile memory | — |
| Configuration Feature | Live at Power-Up (LAPU) | — |
| 最大時脈頻率 | 1098.9 MHz | — |
| 工作溫度 | 0°C to 70°C | — |
| Package Type | 256-pin FBGA | — |
| Package Pitch | 1.0 mm | — |
| 安裝類型 | Surface mount | Surface Mount |
| Packing Media | Tray | — |
| RoHS | Compliant | — |
| Family | — | Fusion Mixed-Signal FPGA |
| User I/O | — | 119 |
| 封裝 | — | 256-LBGA (FBGA), 1 mm ball pitch |
| Core Voltage | — | 1.5 V |
| Maximum System Frequency | — | 1098.9 MHz (per distributor parametric listing) |
| Embedded Processor | — | ARM CoreMP7 |
| Fabric Type | — | Flash-based, non-volatile, instant-on |
| Analog Subsystem | — | Integrated configurable analog (per Microchip Fusion family page) |
| On-chip Flash Memory | — | Yes (large flash memory blocks, per Microchip Fusion family page) |
| Clock Management | — | Integrated clock generation and management circuitry (PLLs) |
| Temperature Grade | — | Industrial (I suffix) |
| 工作溫度範圍 | — | -40C to +85C (industrial grade standard range) |
| Packaging | — | Tray |
| MSL 等級 | — | [DATA_NEEDED: MSL Level] |
| Thermal Resistance (theta_JA) | — | [DATA_NEEDED: Thermal Resistance] |