EP1C12F256C8 vs EP1C12F256C6 比較
詳細並排比較 EP1C12F256C8 由 Intel 與 EP1C12F256C6 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP1C12F256C8 | EP1C12F256C6 |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 啟用中 | 啟用中 |
| Series | Cyclone | Cyclone I |
| Family | Cyclone I | — |
| Logic Elements (LE) | 12,060 | — |
| Total RAM Bits | 239,616 | — |
| Number of LABs/CLBs | 1,206 | — |
| Number of Logic Elements/Cells | 12,060 | — |
| Number of I/O | 185 | — |
| Number of PLLs | 2 | — |
| Total Memory Bits | 239,616 | — |
| 封裝 / 外殼 | 256-BGA (FBGA) | — |
| 安裝類型 | Surface Mount | Surface Mount (BGA) |
| 工作溫度 | 0°C to +85°C (commercial grade) | 0C to +85C (commercial, C6 speed grade) |
| Core Voltage | 1.5 V | — |
| I/O Voltage Range | 1.5 V to 3.3 V | — |
| Supplier Device Package | 256-FBGA (17x17 mm) | — |
| Process Technology | 130 nm SRAM | 130 nm SRAM, 1.5 V core |
| Configuration Method | Passive Serial / Active Serial / JTAG | — |
| Logic Elements | — | 12,060 |
| Logic Array Blocks (LABs) | — | 1,206 |
| Embedded RAM Bits | — | 239,616 bits (52 M4K blocks) |
| Embedded 18x18 Multipliers | — | 17 |
| Maximum User I/Os | — | 185 |
| PLLs | — | 2 |
| 封裝 | — | 256-BGA (FineLine BGA, 17x17 mm, 1.0 mm pitch) |
| Speed Grade | — | C6 (mid-tier) |
| Configuration Modes | — | Active Serial (AS), Passive Serial (PS), JTAG |
| I/O Standards Supported | — | LVTTL, LVCMOS, LVDS, SSTL-2/3, PCI |
| LVDS Data Rate | — | Up to 640 Mbps |