EP1M350B780C7 vs EP1M350F780C7ES 比較
詳細並排比較 EP1M350B780C7 由 Altera 與 EP1M350F780C7ES 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP1M350B780C7 | EP1M350F780C7ES |
|---|---|---|
| 品牌 | Altera | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | NRND | 啟用中 |
| Family | Mercury (EP1M) | — |
| Device Logic Elements | [DATA_NEEDED: exact LE count] | — |
| Equivalent System Gates | 350,000 gates | — |
| 封裝 | 780-ball FineLine BGA | — |
| Core Voltage | 1.5 V | — |
| I/O Voltage Tolerance | 3.3 V | — |
| Maximum User I/O Count | [DATA_NEEDED: per-package I/O count for 780 BGA] | — |
| Transceivers | Multi-gigabit serial transceivers (up to 1.25 Gbps) | — |
| Logic Block Architecture | 4-input LUT-based fabric with embedded memory | — |
| Embedded Memory | [DATA_NEEDED: total RAM bits] | — |
| Peak Reflow Temperature | 220 C (per distributor datasheet) | — |
| 工作溫度範圍 | Commercial (0C to +85C) - C grade suffix | — |
| Configuration Interface | Altera enhanced configuration devices + JTAG | — |
| Development Tool | Quartus II (legacy) | — |
| 安裝類型 | Surface Mount (BGA) | Surface Mount |
| RoHS 狀態 | [DATA_NEEDED: confirm per lot] | unknown |
| MSL 等級 | [DATA_NEEDED: MSL per JEDEC J-STD-020] | — |
| Product Type | — | Field Programmable Gate Array (FPGA) |
| Logic Family | — | CMOS |
| User I/O Count | — | 486 pins |
| Total Package Pins | — | 780 pins |
| Package Type | — | FINE LINE BGA-780 |
| Package Category | — | 780-BBGA |
| 供應電壓 | — | 1.8 V |
| Maximum Stated Transceiver Data Rate | — | 1.25 Gbps |
| Channels Supported at 1.25 Gbps | — | 8 channels |
| Remaining Channel Limit | — | 10 channels at 1.0 Gbps or less |
| 工作溫度 | — | 0 C to 85 C |
| Clock Data Recovery | — | Supported |
| High-Speed Transceivers | — | Integrated |
| REACH Status | — | unknown |
| Logic Element Count | — | [DATA_NEEDED: logic element count] |
| Embedded Memory Capacity | — | [DATA_NEEDED: embedded memory capacity] |
| Transceiver Count | — | [DATA_NEEDED: transceiver count] |
| Package Dimensions | — | [DATA_NEEDED: package dimensions] |
| 熱阻 | — | [DATA_NEEDED: junction-to-ambient thermal resistance] |