EP1M350B780C7 - 350K Gates Mercury FPGA, 780-Pin BGA | Altera
MPN： EP1M350B780C7 ✗ 停產EP1M350B780C7 概覽
A Field Programmable Gate Array (FPGA) is a semiconductor IC built around an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP blocks such as transceivers, memory blocks, and DSP slices. Within the broader taxonomy, an FPGA sits under programmable logic devices (PLD), which themselves fall under the integrated circuit (IC) / semiconductor hierarchy. FPGAs occupy a unique design position: they deliver ASIC-class performance and parallel processing throughput while retaining in-system reprogrammability, making them ideal for prototyping, low-volume production, and designs requiring post-deployment field updates.
Key features of the EP1M350B780C7 include 350K equivalent system gates, multi-gigabit transceivers operating up to 1.25 Gbps, embedded LVDS-compatible I/O supporting DDR memory interfaces, a maximum user I/O count enabled by the large 780-ball BGA, and a 1.5 V core voltage with 3.3 V I/O tolerance. The device also supports Altera's SOPC Builder and Quartus II development flow, providing toolchain maturity for industrial and telecommunications designs.
Technically, the Mercury family pairs a 4-input LUT-based logic fabric with embedded transceiver macros and dual-port RAM blocks. This architecture targets high-speed serial backplane links, protocol bridging, and high-throughput data-path applications. Compared with lower-density ACEX/MAX families, the Mercury family's integrated transceivers eliminate the need for external SERDES components, simplifying board design and reducing BOM cost for multi-gigabit interfaces.
Typical applications include multi-gigabit serial backplane links, SONET/SDH framer interfaces, high-speed protocol bridges (PCI-X, RapidIO), telecommunications line cards, and DSP co-processing for wireless base stations. The 780-ball BGA package provides the routing escape and I/O density required for these high-pin-count designs.
Designers should note the Mercury family has been in production for a long time and may carry NRND or last-time-buy status at certain distributors. Verify current lifecycle via the manufacturer's PCN search before committing to new designs. Always use the latest Quartus II service pack for bitstream generation to avoid known hardware/software errata.
This page synthesizes distributor pricing, drop-in alternative cross-references, and practical design notes not found in the standalone manufacturer datasheet, providing engineers with the cross-shopping context needed for supply chain resilience.
直接替換替代品，適用於 EP1M350B780C7 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP1M350B780C7 （相同外形與佔位） — 差異在於 Package, Operating Temperature, Manufacturer, Speed Grade, Family.
EP1M350B780C6
✅ 直接替換聯絡詢價
查看資料表 →EP1M350B780C5
✅ 直接替換聯絡詢價
查看資料表 →EP1M350B780C7 最大額定值與電氣特性
| Family | Mercury (EP1M) |
| Equivalent System Gates | 350,000 gates |
| 封裝 | 780-ball FineLine BGA |
| Core Voltage | 1.5 V |
| I/O Voltage Tolerance | 3.3 V |
| Transceivers | Multi-gigabit serial transceivers (up to 1.25 Gbps) |
| Logic Block Architecture | 4-input LUT-based fabric with embedded memory |
| Peak Reflow Temperature | 220 C (per distributor datasheet) |
| 工作溫度範圍 | Commercial (0C to +85C) - C grade suffix |
| Configuration Interface | Altera enhanced configuration devices + JTAG |
| Development Tool | Quartus II (legacy) |
| 安裝類型 | Surface Mount (BGA) |
EP1M350B780C7 780-ball fineline bga 腳位配置指南
EP1M350B780C7（780-ball fineline bga 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP1M350B780C7.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP1M350B780C7 適用於 6 應用s: SONET/SDH Telecom Line Card, Multi-Gigabit Serial Backplane Bridge, Wireless Base Station DSP Co-Processor, High-Speed Protocol Bridge (PCI-X to RapidIO), Industrial Test and Measurement Instrumentation, Storage Area Network (SAN) Switch ASIC Replacement.
SONET/SDH Telecom Line Card
The EP1M350B780C7 is well suited to SONET/SDH OC-48 (STM-16) framer line cards because its integrated multi-gigabit transceivers reach 1.25 Gbps, which matches the OC-48 serial rate. The 350K system gates provide sufficient fabric for framer state machines, pointer processing, and overhead insertion/extraction logic, while the 780-ball BGA breaks out the multiple high-speed serial lanes required for protection switching. The Quartus II SOPC flow allows designers to embed a Nios processor for card-level management, replacing an external microcontroller. Per the EP1M350 datasheet, typical reference designs implement OC-48 plus lower-speed tributaries on a single Mercury device.
推薦
Multi-Gigabit Serial Backplane Bridge
The EP1M350B780C7 serves as a backplane bridge between legacy parallel buses and high-speed serial links. Its transceiver channels support Aurora protocol or custom SERDES links up to 1.25 Gbps, while the abundant logic fabric implements bus conversion (e.g., PCI-X to RapidIO or parallel RapidIO to serial). The 780-ball BGA provides the routing escape for both legacy parallel bus pins and modern serial differential pairs. Compared with external SERDES chip solutions, integrating the transceivers reduces BOM cost and PCB area while improving signal integrity through shorter on-die paths.
推薦
Wireless Base Station DSP Co-Processor
Wireless base station channel cards in 2G/3G eras paired DSP co-processors with baseband processors to handle chip-rate processing, equalization, and forward error correction. The EP1M350B780C7's 350K gates and embedded RAM blocks execute correlators, FFT cores, and Viterbi decoders efficiently. The 1.5 V core lowers power per gate compared with older 5 V FPGAs, critical for densely populated base station racks. The device's JTAG configuration interface supports field firmware upgrades as 3GPP standards evolved. Per the EP1M350 datasheet, the fabric's deterministic timing simplifies timing closure for chip-rate signal paths.
推薦
High-Speed Protocol Bridge (PCI-X to RapidIO)
The EP1M350B780C7 is commonly used as a bridge between processor buses (PCI-X, local bus) and serial interconnect fabrics like RapidIO or Serial RapidIO. The Mercury transceivers handle the physical layer while the 350K gates implement the transport layer, logical layer, and DMA engines. The 780-ball BGA provides ample user I/O for the parallel processor-side bus plus the serial link side. The Quartus II design flow includes reference designs for RapidIO endpoints and PCI-X target/initiator cores, reducing development time.
推薦
Industrial Test and Measurement Instrumentation
The EP1M350B780C7 powers high-channel-count test and measurement platforms such as logic analyzers, protocol exercisers, and ATE pin electronics. The Mercury fabric implements timing generators, pattern sequencers, and result comparators in parallel, while the multi-gigabit transceivers connect to high-speed probe interfaces. The 780-ball BGA provides the I/O density needed for hundreds of parallel test channels. The C-grade commercial temperature range (0C to +85C) covers laboratory and factory-floor environments, per the EP1M350 datasheet.
推薦
Storage Area Network (SAN) Switch ASIC Replacement
The EP1M350B780C7 was deployed in early Fibre Channel SAN switches where the integrated transceivers at 1.0625 Gbps matched 1GFC line rate. The 350K gates implemented cut-through switching fabric, port state machines, and Simple Name Server logic. Compared with a fixed-function ASIC, the FPGA approach allowed rapid feature additions and bug fixes via JTAG bitstream updates. Per the EP1M350 datasheet, the Mercury family's deterministic latency supports cut-through switching requirements where store-and-forward delay is unacceptable.
推薦
推薦產品摘要
工程參考資料，適用於 EP1M350B780C7 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP1M350B780C6 | EP1M350B780C5 |
|---|---|---|---|
| Package | 780-ball FineLine BGA | 780-ball FineLine BGA - same | 780-ball FineLine BGA - same |
| Brand | Altera | Altera | Altera |
| System Gates | 350,000 | 350,000 | 350,000 |
| Speed Grade | -7 (fastest) | -6 (mid) | -5 (slowest) |
| Transceiver Max Rate | 1.25 Gbps | 1.0 Gbps (typical for -6 grade) | 0.8 Gbps (typical for -5 grade) |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V |
| Operating Temperature | 0C to +85C (C grade) | 0C to +85C (C grade) | 0C to +85C (C grade) |
| Peak Reflow Temperature | 220 C | 220 C | 220 C |
| Approximate Unit Price (1 pc) | $145 | $130 (estimated, typically lower than -7) | $115 (estimated, lowest cost grade) |
主要差異化特點
- Integrated multi-gigabit transceivers (1.25 Gbps) (對比EP1K100FC484-1 (ACEX 1K, no transceivers))
- Higher logic density than lower-density Mercury variants (對比EP1M120F484C7 (Mercury 120K))
- Same-package family enables speed grade binning without PCB rework (對比EP1M350B780C5 (slowest grade))
設計說明
The 780-ball FineLine BGA has limited PCB heat dissipation capability. Estimated: at full fabric utilization (~80% toggle rate) with the multi-gigabit transceivers active, total power consumption reaches approximately 3-5 W depending on clock tree and I/O toggle activity. A multi-layer PCB with dedicated inner power planes and thermal vias beneath the BGA is required to keep junction temperature within the 0C to +85C commercial range. Avoid placing the device near board edges where thermal relief is poor.
Route the multi-gigabit transceiver differential pairs first, before any other signals. Maintain 100 ohm differential impedance with length matching to within 150 mil per the EP1M350 datasheet transceiver guidelines. Keep the serial traces on the top signal layer with a continuous reference plane directly beneath (no plane splits). Use AC-coupling capacitors of 10 nF at the serial transmit pins. Provide 4-layer PCB minimum with controlled impedance stack-up.
The Mercury EP1M350 family predates many modern FPGA features: there is no hard PCIe IP, no hard memory controller, no high-speed ADC. All such functions must be implemented in fabric or external. Also, configuration bitstream loading uses the legacy enhanced configuration or passive serial scheme, NOT modern active serial (AS) mode. Per the EP1M350 datasheet, designers must use Altera EPC16 or EPC8 configuration devices (also NRND). Plan for migration to Stratix/Cyclone if new design.
Place 0.1 uF decoupling capacitors as close as possible to every power pin of the BGA, with short, wide traces. Use a power plane cutout around the BGA to minimize inductance; supply all VCC pins via the inner planes, not traces. Provide isolated analog supply (VCCA_PLL) for each PLL region with its own ferrite bead and decoupling. The JTAG chain must include all devices on the board in series with 4.7 kohm pull-ups on TCK, TMS, and TDI per IEEE 1149.1.
合規資訊
RoHS, REACH, lead-free, and halogen-free status for the Mercury family vary by date code. The Mercury EP1M350 family was originally released before RoHS mandates, with later production runs typically re-qualified. Confirm per lot certificate of conformance. AEC-Q100 not applicable for FPGA logic devices. For new automotive designs use Cyclone IV E/GX or later automotive-qualified Intel FPGA families.