EP2AGZ350FH29I3G vs EP2AGZ300FH29I3G 比較

詳細並排比較 EP2AGZ350FH29I3G 由 Intel 與 EP2AGZ300FH29I3G 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

規格比較

參數 EP2AGZ350FH29I3G EP2AGZ300FH29I3G
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 啟用中 啟用中
Family Arria II GZ Arria II GZ
Logic Elements (LE) 350000 (approximately) 300,000
Process Node 40 nm 40 nm TSMC
User I/O Count 281 —
封裝 780-FBGA (FineLine BGA, FH29) 780-pin FineLine BGA (FH29), 29x29 mm
Temperature Grade Industrial (-40C to +100C) Industrial (-40C to +100C)
安裝類型 Surface Mount Surface Mount (BGA)
工作溫度範圍 -40C to +100C —
Supply Voltage Core [DATA_NEEDED: VCC core voltage] —
Transceivers Multi-gigabit transceivers (family supports up to 16 channels at up to 6.375 Gbps per family datasheet) —
Memory Interface DDR3 with read/write leveling support (family feature) —
Embedded Multipliers 18x18 hardware multipliers (family feature) —
Configuration Method Serial or parallel via Quartus II (family feature) —
MSL 等級 3 (per BGA package handling guidelines) —
RoHS 狀態 Compliant Compliant
Lead Free Yes —
無鹵素 [DATA_NEEDED: halogen free status] —
Product Type — Field Programmable Gate Array (FPGA)
Embedded Memory — 18,520 Kbits
DSP Blocks (18x18 multipliers) — 720
Maximum Transceiver Data Rate — 6.375 Gbps
Number of Transceivers — 24
Speed Grade — -3
Operating Voltage (Core) — 0.9 V
External Memory Interface — DDR3 up to 800 MHz

資料表與資源

瀏覽所有產品 建立 BOM 索取報價