EP2SGX30CF780C6 vs EP2SGX30CF780I3 比較
詳細並排比較 EP2SGX30CF780C6 由 Intel 與 EP2SGX30CF780I3 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP2SGX30CF780C6 | EP2SGX30CF780I3 |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | NRND | 最後購買 |
| Family | Stratix II GX | Stratix II GX |
| Series | EP2SGX | — |
| Logic Elements (LE) | 33,880 | — |
| Adaptive Logic Modules (ALM) | 13,540 | — |
| Embedded Memory Bits | 1,369,728 bits (171 KBytes) | — |
| Embedded Multiplier 18x18 | 64 (estimated, datasheet required for exact count) | — |
| User I/O Pins | 361 | — |
| High-Speed Transceivers | Up to 8 channels (FPGA-dependent configuration) | — |
| Transceiver Data Rate | Up to 6.375 Gbps | — |
| 封裝 | 780-ball FineLine BGA (F780) | 780-ball FC-FBGA (29 mm x 29 mm, 1.0 mm pitch) |
| Speed Grade | C6 (commercial, mid-speed) | — |
| 工作溫度 | 0C to +85C (commercial) | -40 °C to +85 °C (Industrial) |
| Core Voltage | 1.2 V (typical) | 1.2 V |
| Configuration Mode | Enhanced passive/active (EPC) supported | — |
| Process Technology | 90 nm | 90 nm CMOS |
| RoHS 狀態 | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status not confirmed in supplied data] |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Logic Cells | — | 33,880 |
| Logic Array Blocks (LABs) | — | 33,880 |
| Maximum Internal Frequency | — | 622.08 MHz |
| Number of User I/O Pins | — | 361 |
| Transceivers | — | Embedded multi-gigabit transceivers (6.375 Gbps) |
| Terminal Pitch | — | 1.0 mm |
| Temperature Grade Suffix | — | I3 (Industrial) |
| 安裝類型 | — | Surface Mount (BGA) |
| Total Terminals | — | 780 |
| Package Code | — | BGA, square shape |