EP2SGX30CF780I3 vs EP2SGX30CF780C7 比較
詳細並排比較 EP2SGX30CF780I3 由 Intel 與 EP2SGX30CF780C7 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP2SGX30CF780I3 | EP2SGX30CF780C7 |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 最後購買 | NRND |
| Family | Stratix II GX | — |
| Logic Cells | 33,880 | — |
| Logic Array Blocks (LABs) | 33,880 | — |
| Maximum Internal Frequency | 622.08 MHz | — |
| Number of User I/O Pins | 361 | — |
| Process Technology | 90 nm CMOS | 90 nm |
| Core Voltage | 1.2 V | 1.2 V |
| Transceivers | Embedded multi-gigabit transceivers (6.375 Gbps) | — |
| 封裝 | 780-ball FC-FBGA (29 mm x 29 mm, 1.0 mm pitch) | 780-ball FineLine BGA (CF780) |
| Terminal Pitch | 1.0 mm | — |
| 工作溫度 | -40 °C to +85 °C (Industrial) | 0C to +85C (commercial) |
| Temperature Grade Suffix | I3 (Industrial) | — |
| 安裝類型 | Surface Mount (BGA) | — |
| Total Terminals | 780 | — |
| Package Code | BGA, square shape | — |
| RoHS 狀態 | [DATA_NEEDED: RoHS status not confirmed in supplied data] | Compliant (lead-free Fineline BGA) |
| Series | — | Stratix II GX |
| Logic Elements | — | 33,000 |
| Embedded Memory | — | 1.9 Mbits |
| DSP Blocks (18x18 multipliers) | — | 256 |
| Maximum User I/O | — | 361 |
| Multi-Gigabit Transceivers | — | 4 channels |
| Transceiver Data Rate | — | 600 Mbps to 3.125 Gbps |
| PLLs | — | 4 |
| Ball Pitch | — | 1.0 mm |
| Speed Grade | — | C7 (fastest commercial) |
| Configuration Modes | — | Passive Serial, Fast Passive Parallel, Passive Parallel Asynchronous, JTAG |