EP2SGX60DF780C3 vs EP2SGX60DF780C5 比較
詳細並排比較 EP2SGX60DF780C3 由 Intel 與 EP2SGX60DF780C5 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP2SGX60DF780C3 | EP2SGX60DF780C5 |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | Obsolete | 最後購買 |
| Family | Stratix II GX | Stratix II GX |
| Series | Stratix II | — |
| Logic Elements / Cells | 60,440 | — |
| Logic Array Blocks (LABs) | 3,022 | 3,022 |
| Total RAM Bits | [DATA_NEEDED: total embedded memory bits] | — |
| Number of I/O | 364 | — |
| Number of Transceivers | Up to 20 | — |
| Transceiver Data Rate | Up to 6.375 Gbps | — |
| Core Voltage | 1.2 V | — |
| Process Technology | 90 nm | 90 nm |
| Internal Frequency (max) | ~717 MHz | — |
| 封裝 | 780-ball FC-FBGA (FineLine BGA), 29 x 29 mm, 1.0 mm pitch | 780-ball FC-FBGA |
| 安裝類型 | Surface Mount | Surface Mount |
| Operating Temperature (TJ) | 0 °C to +85 °C (commercial, C speed grade) | — |
| Speed Grade | C3 (fastest commercial) | -C5 (commercial, mid-band) |
| RoHS 狀態 | Non-compliant (legacy Altera-era BGAs use SnPb or non-RoHS bump finish; verify per lot) | [DATA_NEEDED: RoHS status] |
| Logic Elements | — | 60,440 |
| User I/O Pins | — | 364 |
| Package Body Size | — | 23 x 23 mm |
| Ball Pitch | — | 1.0 mm |
| Core Supply Voltage | — | 1.2 V |
| Internal Frequency (max, typical) | — | ~717 MHz |
| Device Type | — | Field-Programmable Gate Array (FPGA) |
| 工作溫度 | — | Commercial (0C to +85C) |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |