EP3C40F780C8 vs EP3C40F780C8N 比較
詳細並排比較 EP3C40F780C8 由 Intel 與 EP3C40F780C8N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP3C40F780C8 | EP3C40F780C8N |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 啟用中 | 啟用中 |
| Family | Cyclone III | Cyclone III |
| Series | EP3C40 | Cyclone® III |
| Logic Elements | 39,600 | — |
| Total Memory Bits | 1,161,216 bits (1134 Kbit) | 1,161,216 bits |
| Embedded Memory | M9K blocks, 486 Kbit total (per family datasheet) | — |
| Embedded 18x18 Multipliers | 126 | 126 (up to 396 9x9) |
| General Purpose PLLs | 4 | — |
| Global Clock Networks | 20 | — |
| Maximum User I/O Pins | 535 | — |
| Process Technology | 65 nm low-power CMOS | 65nm TSMC low-power |
| 封裝 | 780-ball FBGA (FineLine BGA) | 780-ball FBGA, 1.0mm pitch |
| Speed Grade | C8 (commercial, -40C to +85C operating range per 'C' designator family convention) | 8 (C8) |
| User I/O Banks | [DATA_NEEDED: user I/O bank count] | — |
| Supported Memory Interfaces | DDR, DDR2, QDRII SRAM (via dedicated PHY) | — |
| Configuration | Serial (AS) / Parallel (AP) / JTAG | — |
| RoHS 狀態 | Compliant | Compliant |
| 安裝類型 | Surface Mount (BGA) | Surface Mount (BGA) |
| Logic Elements (LE) | — | 39,600 |
| Number of LABs/CLBs | — | 2,475 |
| Embedded Memory Blocks | — | M9K x 126 |
| Number of PLLs | — | 4 |
| Maximum User I/Os | — | 535 |
| Number of I/O Banks | — | 9 |
| Core Voltage | — | 1.15V to 1.25V |
| 工作溫度 | — | 0°C to +85°C (Commercial) |
| Configuration Modes | — | AS, PS, FPP, JTAG |