EP3SE110F1152C2NES vs EP3SE110F1152C4 比較

詳細並排比較 EP3SE110F1152C2NES 由 Altera 與 EP3SE110F1152C4 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Intel
EP3SE110F1152C4 EP3SE110F1152C4 - Stratix III E FPGA 107.5K LE 1152-FCBGA | Intel

EP3SE110F1152C4 - Stratix III E FPGA 107.5K LE 1152-FCBGA | Intel

EP3SE110F1152C4 ⚠ 最後購買機會

規格比較

參數 EP3SE110F1152C2NES EP3SE110F1152C4
品牌 Altera Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 NRND 最後購買
Family Stratix III Enhanced (EP3SE110) Stratix III E
Manufacturer Altera (Intel) —
Process Technology 65 nm 65 nm
Logic Elements 107,500 107,500
User I/O Pins 744 —
Core Voltage 1.1 V 1.1 V
Maximum Operating Frequency 600 MHz —
封裝 FC-FBGA-1152 (Flip-Chip) —
安裝類型 Surface Mount —
工作溫度範圍 [DATA_NEEDED: temperature grade] —
Speed Grade C2 —
記憶體類型 Embedded M9K blocks —
DSP Blocks Yes (variable-precision DSP) [DATA_NEEDED: 18x18 multiplier count]
Transceivers [DATA_NEEDED: transceiver count] —
Configuration SRAM-based, volatile —
Programming Interface JTAG / Passive Serial / Fast Passive Parallel —
Toolchain Quartus II (Stratix III support) —
RoHS 狀態 Non-Compliant (per Kynix listing) Compliant
Embedded Memory — 8,936,448 bits
Maximum User I/Os — 744
Logic Array Blocks (LABs) — [DATA_NEEDED: LAB count]
Maximum Performance — 450 MHz
Package Type — 1152-ball FCBGA (Flip-Chip BGA)
Operating Temperature Grade — Commercial (C4)
Configuration Memory — SRAM-based (volatile)
On-chip Termination — Dynamic, programmable
I/O Standards Supported — LVDS, LVTTL, LVCMOS, HSTL, SSTL

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