EP3SE110F1152C4 - Stratix III E FPGA 107.5K LE 1152-FCBGA | Intel
MPN： EP3SE110F1152C4 ⚠ 最後購買機會EP3SE110F1152C4 概覽
A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit whose digital logic function is defined after manufacture through configuration memory (SRAM cells). FPGAs combine programmable logic elements, configurable interconnect, embedded memory blocks, DSP slices, and high-speed transceivers into a single die, occupying the application-specific integrated circuit (ASIC) prototyping and parallel-computing tier of the broader digital IC hierarchy. Within Intel's product lineup, the Stratix III family is positioned as a mid-to-high density, low-power 65nm generation that preceded Stratix IV and Stratix V families.
The EP3SE110F1152C4 delivers up to 896 embedded multiplier 18x18 blocks, dedicated high-speed DSP blocks, and modular I/O banks supporting LVDS, LVTTL, LVCMOS, HSTL, SSTL, and other differential signaling standards. It features dynamic on-chip termination, programmable output delay, and configurable current strength, all of which are engineered for best-in-class signal integrity at multi-gigabit rates.
Architecturally, the Stratix III E variant emphasizes memory density and multiplier count for data-centric applications, distinguishing it from the L (logic-optimized) and GX (transceiver-rich) siblings. The 1152-ball FCBGA package offers high pin escape for high I/O count designs, and the 1.1V core voltage reduces dynamic power relative to earlier 90nm Stratix II devices.
Typical applications include high-performance digital signal processing, ASIC prototyping, military and aerospace signal processing, telecom baseband processing, high-speed data acquisition systems, and industrial imaging and video processing platforms. The Stratix III E memory and DSP ratio particularly suits FFT, FIR, and video codec pipelines.
When designing with the EP3SE110F1152C4, careful power-rail sequencing is required because the Stratix III family mandates a specific core and I/O ramp profile. Use Intel's PowerPlay early power estimator tool before PCB layout to budget decoupling capacitor count and copper area.
This page synthesizes distributor pricing, drop-in package equivalents, and practical design notes not found in the standalone manufacturer datasheet, enabling faster sourcing and engineering decisions for legacy designs.
直接替換替代品，適用於 EP3SE110F1152C4 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP3SE110F1152C4 （相同外形與佔位） — 差異在於 Package, Operating Temperature, Speed Grade, Family, Process Technology.
EP3SE110F1152C3N
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP3SE110F1152C3
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP3SE110F1152C2N
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP3SE110F1152C2
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP3SE110F1152C2NES
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP3SE110F1152C4 最大額定值與電氣特性
| Family | Stratix III E |
| Logic Elements | 107,500 |
| Embedded Memory | 8,936,448 bits |
| Maximum User I/Os | 744 |
| Process Technology | 65 nm |
| Core Voltage | 1.1 V |
| Maximum Performance | 450 MHz |
| Package Type | 1152-ball FCBGA (Flip-Chip BGA) |
| Operating Temperature Grade | Commercial (C4) |
| Configuration Memory | SRAM-based (volatile) |
| On-chip Termination | Dynamic, programmable |
| I/O Standards Supported | LVDS, LVTTL, LVCMOS, HSTL, SSTL |
| RoHS 狀態 | Compliant |
EP3SE110F1152C4 1152-ball fcbga (flip-chip bga) 腳位配置指南
EP3SE110F1152C4（1152-ball fcbga (flip-chip bga) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP3SE110F1152C4.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP3SE110F1152C4 適用於 6 應用s: High-Performance DSP Pipelines, ASIC Prototyping and Emulation, Telecom Baseband Processing, High-Speed Data Acquisition Systems, Industrial Video and Image Processing, Military and Aerospace Signal Processing.
High-Performance DSP Pipelines
The EP3SE110F1152C4's 107,500 logic elements and high embedded memory density (8,936,448 bits) make it well suited for multi-channel DSP pipelines such as radar baseband processing, multi-carrier wireless demodulation, and medical imaging front-ends. The Stratix III E family's elevated multiplier-to-logic ratio accelerates FFT, FIR, and matrix-multiply kernels; in a 256-point FFT the device sustains >450MHz DSP slice throughput per the Stratix III Device Handbook. Pair with a TI ADS62P49 ADC front-end for a complete signal chain. The 1152-ball FCBGA package exposes enough I/O for parallel LVDS ADC/DAC interfaces without multiplexing.
推薦
ASIC Prototyping and Emulation
Designers use the EP3SE110F1152C4 as an ASIC prototype target because the 107.5K LE fabric maps RTL designs up to several million gates when combined with embedded memory blocks for FIFO and register-file emulation. Compared with ASIC tape-out, a Stratix III E prototype cuts bring-up time from months to weeks and supports in-system debug via SignalTap II embedded logic analyzer. The 744 I/O count accommodates wide bus prototyping, and the FCBGA package allows high-speed SERDES-style edge rates for ASIC clock tree validation.
推薦
Telecom Baseband Processing
In LTE and WCDMA baseband boards, the EP3SE110F1152C4 handles channel-card DSP, scrambling, FEC decode, and MAC-layer scheduling in a single fabric. The 1.1V core voltage limits dynamic power relative to 90nm Stratix II, which is critical for densely populated base-station line cards. The 1152-ball FCBGA package supports CPRI or OBSAI optical backhaul links through LVDS I/O banks, and the device's 8.9Mbit embedded RAM holds working sets for HARQ soft-combining without external SRAM access.
推薦
High-Speed Data Acquisition Systems
Multi-channel data acquisition cards pair the EP3SE110F1152C4 with high-speed ADCs and DACs over LVDS links, leveraging the device's 744 I/O count to ingest 16+ parallel ADC lanes without time-division multiplexing. The embedded RAM (8.9Mbit) serves as deep capture buffers between ADC bursts and downstream PCIe or Ethernet transfer, eliminating external SRAM in many designs. Designers should budget thermal dissipation carefully: at 450MHz utilization the FCBGA package typically requires forced-air cooling per Intel PowerPlay estimator guidance.
推薦
Industrial Video and Image Processing
Machine-vision and broadcast video routers exploit the EP3SE110F1152C4's memory bandwidth to perform real-time SD/HD/3G-SDI bridging, color-space conversion, and frame-rate conversion. The embedded DSP blocks accelerate 2D convolution and Sobel edge detection kernels commonly used in defect-inspection cameras. With 744 I/Os the device can directly interface to multiple Camera Link or CoaXPress channels, simplifying PCB routing compared with smaller FPGAs that require channel multiplexing.
推薦
Military and Aerospace Signal Processing
Defense and avionics platforms use the EP3SE110F1152C4 for radar pulse compression, electronic-warfare (EW) channelization, and software-defined radio (SDR) baseband processing where high logic density, large memory, and abundant I/O are critical. The commercial (C4) temperature grade limits deployment to benign environments; for harsh-environment programs, designers should pair this device with ruggedized carrier boards and use industrial-grade (-40C to +100C) sibling parts such as EP3SE110F1152I4. The 65nm Stratix III process and SRAM-based configuration support secure bitstream loading and reconfiguration in field.
推薦
推薦產品摘要
工程參考資料，適用於 EP3SE110F1152C4 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP3SE110F1152C3N | EP3SE110F1152C3 | EP3SE110F1152C2N | EP3SE110F1152C2 | EP3SE110F1152C2NES |
|---|---|---|---|---|---|---|
| Package | 1152-ball FCBGA | 1152-ball FCBGA - same | 1152-ball FCBGA - same | 1152-ball FCBGA - same | 1152-ball FCBGA - same | 1152-ball FCBGA - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 107,500 | 107,500 | 107,500 | 107,500 | 107,500 | 107,500 |
| Speed Grade | C4 (slowest commercial) | C3 (faster by one bin) | C3 | C2 (slower by one bin) | C2 | C2 |
| Embedded Memory (bits) | 8,936,448 | 8,936,448 | 8,936,448 | 8,936,448 | 8,936,448 | 8,936,448 |
| Maximum User I/Os | 744 | 744 | 744 | 744 | 744 | 744 |
| Core Voltage | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V |
| Temperature Grade | Commercial | Commercial | Commercial | Commercial | Commercial | Commercial |
| Process Technology | 65 nm | 65 nm | 65 nm | 65 nm | 65 nm | 65 nm |
主要差異化特點
- Stratix III E family - memory and DSP rich variant (對比EP3SL110F1152C4 (Stratix III L))
- Commercial C4 speed grade - lowest-cost option (對比EP3SE110F1152C3N (C3 speed grade))
- 1152-ball FCBGA - highest I/O count in EP3SE110 family (對比Smaller-package EP3SE110 variants (e.g. 780-pin F780))
設計說明
Estimated: At full 107.5K LE utilization and 450MHz clock, the EP3SE110F1152C4 can draw up to ~10-15W from the 1.1V core rail based on toggle-rate assumptions used in Altera PowerPlay. Use a 4-6 phase buck regulator with at least 20A capability on VCCINT and place decoupling capacitors (0402 or 0201 ceramics) within 2mm of every VCC/VSS pair per Intel's Stratix III power distribution guidelines.
Estimated: The 1152-ball FCBGA package has a typical theta_JB of approximately 0.5 C/W when mounted on a 12-layer PCB with full thermal via array under the die. At 12W dissipation the junction-to-board rise is roughly 6C; however, at 18W this rises to 9C, so for high-utilization designs a heatsink or forced airflow of at least 200 LFM is recommended to keep Tj below 100C in commercial operation.
The 1152-ball FCBGA requires high-density interconnect (HDI) PCB fabrication with at least 1oz copper on outer layers and microvia-in-pad or stacked-via structures. Use Intel's Stratix III pin connection guidelines to identify which balls require connection vs. which can be left NC (no-connect), and follow the recommended 8-layer stack-up with dedicated ground and power planes adjacent to the signal layers to control return-path impedance.
Do not assume the EP3SE110F1152C4 can be substituted for a Stratix III GX or SL variant even when the package matches - the I/O bank count and SERDES availability differ. Verify pin compatibility in the Quartus II Pin Planner before committing to a substitution. Also note that the SRAM-based configuration memory requires a configuration device (EPCS) or JTAG programming on every power-up.
合規資訊
RoHS compliance inferred from Intel/Altera Stratix III family documentation. Reach, halogen-free, and conflict-minerals status were not explicitly stated in the verified web data and remain unknown.
