EP3SE110F780C3 vs EP3SE110F780C4N 比較
詳細並排比較 EP3SE110F780C3 由 Intel 與 EP3SE110F780C4N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP3SE110F780C3 | EP3SE110F780C4N |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 最後購買 | NRND |
| Series | Stratix III E | Stratix III E |
| Logic Elements | 107500 | — |
| Logic Array Blocks (LABs) | 4300 | — |
| Total Memory Bits | 8936448 | — |
| User I/O Count | 488 | 488 |
| 封裝 | 780-BBGA, FCBGA | — |
| Number of Terminals | 780 | 780 |
| Package Code | BGA | BGA |
| Package Shape | Square | Square |
| Form of Terminal | Ball | — |
| Temperature Grade | Other (Commercial) | — |
| Speed Grade | C3 | C4 |
| 安裝類型 | Surface Mount | Surface Mount |
| RoHS 狀態 | [DATA_NEEDED: RoHS status] | Compliant |
| 工作溫度 | [DATA_NEEDED: operating temperature range] | 0C to 85C (Commercial) |
| Family | — | Stratix III |
| Logic Elements (LEs) | — | 107500 |
| Embedded Memory Bits | — | 8936448 |
| Package Type | — | 780-BBGA, FCBGA |
| Terminal Form | — | Ball |
| Process Node | — | 65 nm |
| Configuration Mode | — | PS / FPP / JTAG |