EP3SE110F780C4N vs EP3SE110F780C4LN 比較
詳細並排比較 EP3SE110F780C4N 由 Intel 與 EP3SE110F780C4LN 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP3SE110F780C4N | EP3SE110F780C4LN |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | NRND | 啟用中 |
| Series | Stratix III E | — |
| Family | Stratix III | Stratix III E |
| Logic Elements (LEs) | 107500 | — |
| Embedded Memory Bits | 8936448 | — |
| User I/O Count | 488 | — |
| Number of Terminals | 780 | — |
| Package Type | 780-BBGA, FCBGA | — |
| Package Code | BGA | — |
| Terminal Form | Ball | — |
| Package Shape | Square | — |
| Speed Grade | C4 | C4 |
| 工作溫度 | 0C to 85C (Commercial) | 0C to +85C (Commercial) |
| 安裝類型 | Surface Mount | Surface Mount (SMT) |
| RoHS 狀態 | Compliant | — |
| Process Node | 65 nm | — |
| Configuration Mode | PS / FPP / JTAG | — |
| Logic Elements (LE) | — | 107,500 |
| Logic Array Blocks (LABs) | — | 4,300 |
| Embedded Memory | — | 8,936,448 bits |
| User I/O Pins | — | 488 |
| 封裝 | — | 780-BBGA, FCBGA (Fine-pitch) |
| Supply Voltage Core | — | 0.9 V (typical) |
| Lead-Free / RoHS | — | Yes (N suffix) |
| Process Technology | — | 40 nm TSMC |
| DSP Blocks | — | Yes (18x18 multipliers) |
| MSL 等級 | — | 3 (per JEDEC J-STD-020) |
| Tray Packaging | — | Yes (per distributor listings) |