EP3SE260F1152C4 vs EP3SE260F1152C2N 比較
詳細並排比較 EP3SE260F1152C4 由 Intel 與 EP3SE260F1152C2N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP3SE260F1152C4 | EP3SE260F1152C2N |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | NRND | Obsolete |
| Series | Stratix III E (Enhanced) | Stratix III E |
| Family | Stratix III | FPGA - Field Programmable Gate Array |
| Logic Elements (LE) | 255,000 | — |
| Logic Array Blocks (LABs) | 10,200 | — |
| Embedded Memory Bits | 16,672,768 | — |
| User I/O Count | 744 | — |
| Process Technology | 65 nm CMOS (TSMC) | 65 nm |
| Core Voltage | 1.1 V | — |
| Speed Grade | C4 (slowest commercial grade) | — |
| Maximum Internal Frequency | ~450 MHz (per FPGAkey listing) | — |
| 封裝 | 1152-pin FC-FBGA (Flip-Chip Fine-pitch BGA) | — |
| Package Code | BGA, square | — |
| I/O Standards Supported | LVDS, LVTTL, LVCMOS, SSTL, HSTL | — |
| Configuration Modes | Passive Serial, Fast Passive Parallel, JTAG | — |
| DSP Blocks (18x18 Multipliers) | 384 | — |
| PLL Count | [DATA_NEEDED: PLL count] | — |
| Transceivers | External PHY interface only (no integrated GXB) | — |
| RoHS 狀態 | Compliant (per distributor listings) | Compliant |
| 工作溫度 | Commercial (0C to +85C) - inferred from speed grade C4 | [DATA_NEEDED: operating temperature grade] |
| 安裝類型 | Surface Mount (BGA) | Surface Mount |
| Number of Logic Elements | — | 255000 |
| Number of LABs/CLBs | — | 10200 |
| Total Memory Bits | — | 16672768 |
| Number of I/O | — | 744 |
| Voltage - Supply | — | 1.1 V |
| 封裝 / 外殼 | — | 1152-BBGA, FCBGA |
| Maximum Frequency | — | 600 MHz |
| Supplier Device Package | — | 1152-FCBGA |
| MSL 等級 | — | [DATA_NEEDED: MSL rating] |
| Lead Free | — | Yes (per EP3SE260F1152C2G comparison) |
| ECCN | — | [DATA_NEEDED: ECCN code] |
| Moisture Sensitivity | — | [DATA_NEEDED: MSL level] |