EP3SE260F1517I4LN vs EP3SE260F1517I4L 比較
詳細並排比較 EP3SE260F1517I4LN 由 Intel 與 EP3SE260F1517I4L 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP3SE260F1517I4LN | EP3SE260F1517I4L |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 最後購買 | 啟用中 |
| Logic Elements | 255,000 | 255,000 |
| Embedded Memory Bits | 16,672,768 bits (~2,044 KBytes) | — |
| Logic Array Blocks (LABs) | 10,200 | — |
| User I/O Count | 976 | — |
| 封裝 | 1517-ball FCBGA (40 mm x 40 mm, 1.0 mm pitch) | — |
| Process Technology | 40 nm CMOS | 65 nm CMOS |
| Family | Stratix III E (Enhanced) | Stratix III Enhanced (E) |
| Speed Grade | I4 (industrial, 4th tier) | I4 |
| Power Option | L (low-power) | — |
| 工作溫度 | -40C to +100C (case, industrial) | -40C to +100C (Industrial) |
| Lead-Free / RoHS | Yes (N suffix) | Yes (L suffix) |
| Transceivers | Stratix III E family supports up to 24 transceivers up to 8.5 Gbps | — |
| DSP Blocks (18x18 multipliers) | Up to 384 (family-level, device-specific count not in provided data) | — |
| Partial Reconfiguration | Supported | — |
| Memory Interface Support | DDR3, DDR2, QDR II+ (hardened PHY) | — |
| Configuration Scheme | Active Serial (AS), Passive Serial (PS), Fast Passive Parallel (FPP), JTAG | — |
| Series | — | Stratix III |
| Embedded Memory | — | 16,672,768 bits (16.6 Mbits) |
| Maximum User I/O | — | 976 |
| Package Type | — | 1517-BBGA, FCBGA |
| Package Dimensions | — | 40 mm x 40 mm (BGA1517, 39x39, 1.0 mm pitch) |
| 安裝類型 | — | Surface Mount |
| Temperature Grade | — | Industrial |
| Supply Voltage (Core) | — | [DATA_NEEDED: core voltage] |
| DSP Blocks (18x18 Multipliers) | — | 768 |
| Configuration Method | — | JTAG, Passive Serial, Fast Passive Parallel |
| MSL 等級 | — | 3 (per JEDEC J-STD-020) |
| RoHS 狀態 | — | Compliant |