EP3SE260H780I4 vs EP3SE260H780I4LG 比較
詳細並排比較 EP3SE260H780I4 由 Intel 與 EP3SE260H780I4LG 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP3SE260H780I4 | EP3SE260H780I4LG |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | NRND | NRND |
| Family | Stratix III Enhanced (Stratix III E) | EP3SE260 |
| Logic Elements | 255,000 | 255,000 LE |
| Logic Cells | 255,000 | — |
| Logic Array Blocks (LABs) | 10,200 | — |
| Adaptive Logic Modules (ALMs) | approximately 203,200 | 102,000 ALM |
| Maximum User I/Os | 488 | — |
| Process Technology | 65 nm CMOS | 65 nm low-power CMOS |
| Core Voltage | 1.1 V | — |
| Embedded RAM (total) | approximately 14.4 Mbit (M9K/M144K blocks) | — |
| DSP Blocks | approximately 768 (18x18 multipliers) | 304 |
| Maximum Operating Frequency | up to 450 MHz core / 717 MHz per Partstack record | — |
| 封裝 | 780-ball FC-HFBGA (HBGA) | 780-ball FineLine BGA (HBGA) |
| 工作溫度 | -40C to +100C (industrial, 'I' grade) | -40C to +100C |
| Speed Grade | 4 | -4 |
| 安裝類型 | Surface Mount (BGA) | — |
| Configuration Schemes | JTAG, Passive Serial, Fast Passive Parallel, Active Serial | — |
| RoHS 狀態 | [DATA_NEEDED: RoHS compliance status] | — |
| Series | — | Stratix III Enhanced |
| Embedded Memory | — | 15.90 Mbit |
| 18x18 Multipliers | — | 840 |
| User I/O | — | 488 |
| PLLs | — | 8 (4 fractional + 4 general-purpose) |
| Temperature Grade | — | Industrial (I) |
| Configuration Method | — | JTAG / Passive Serial / Fast Passive Parallel / Active Serial |