EP3SE50F484I4L vs EP3SE50F484I4 比較

詳細並排比較 EP3SE50F484I4L 由 Intel 與 EP3SE50F484I4 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Intel
EP3SE50F484I4L EP3SE50F484I4L - Stratix III E FPGA, 47.5K LE, 484-FBGA | Intel

EP3SE50F484I4L - Stratix III E FPGA, 47.5K LE, 484-FBGA | Intel

EP3SE50F484I4L ⚠ 最後購買機會

規格比較

參數 EP3SE50F484I4L EP3SE50F484I4
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 最後購買 NRND
Family Stratix III E Stratix III E (Enhanced)
Logic Elements (LE) 47,500 47,500
Logic Array Blocks (LABs) 1,900 —
Adaptive Logic Modules (ALMs) [DATA_NEEDED: ALM count] —
Embedded Memory 5,760 Kbit (5.625 Mbit) —
Embedded Multipliers (18x18) 384 —
Maximum User I/O 296 296
Maximum Core Clock 717 MHz (per third-party listing) —
Speed Grade 4 (slowest) —
工作溫度範圍 Industrial (I): -40C to +100C junction —
Process Node 40 nm CMOS —
封裝 484-ball FCBGA (FBGA-484) 484-ball FC-FBGA
安裝類型 Surface Mount (BGA) Surface Mount (BGA)
供應電壓 Multiple rails: core 0.9V, I/O 1.2V-3.3V (per Stratix III handbook) —
Configuration Method Quartus II / EPCS serial / parallel —
Lead-Free (Pb-free) Yes (L suffix) —
RoHS 狀態 Compliant Compliant
MSL 等級 MSL3 (per JEDEC J-STD-020, typical for FBGA-484) —
Logic Array Blocks (LAB) — 1,900
Embedded Memory (Bits) — 5,760,000
DSP Blocks (18x18 Multipliers) — 216
Process Technology — 65 nm CMOS
Core Voltage — 1.1 V
Maximum Operating Frequency — 450 MHz
Package Code — BBGA / FC-FBGA
Temperature / Speed Grade — I4 (Industrial)
工作接面溫度 — -40 C to +100 C

資料表與資源

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