EP3SE50F484I4LG vs EP3SE50F484I4L 比較

詳細並排比較 EP3SE50F484I4LG 由 Intel 與 EP3SE50F484I4L 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Intel
EP3SE50F484I4LG EP3SE50F484I4LG - 47.5K LE Stratix III E FPGA, 484-FCBGA | Intel

EP3SE50F484I4LG - 47.5K LE Stratix III E FPGA, 484-FCBGA | Intel

EP3SE50F484I4LG ⚠ 最後購買機會
Intel
EP3SE50F484I4L EP3SE50F484I4L - Stratix III E FPGA, 47.5K LE, 484-FBGA | Intel

EP3SE50F484I4L - Stratix III E FPGA, 47.5K LE, 484-FBGA | Intel

EP3SE50F484I4L ⚠ 最後購買機會

規格比較

參數 EP3SE50F484I4LG EP3SE50F484I4L
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 最後購買 最後購買
Series Stratix III E —
Family Stratix III (Enhanced) Stratix III E
Logic Elements (LE) 47,500 47,500
Adaptive Logic Modules (ALMs) 19,000 [DATA_NEEDED: ALM count]
LABs/CLBs 1,900 —
Total Embedded Memory 5,760,000 bits (5.49 Mbit / 5.76 Mbit per source) —
Number of DSP Blocks 104 (18x18 multipliers) —
Number of PLLs 8 —
User I/O Count 296 —
Core Supply Voltage (Vccint) 0.86 V to 1.15 V (1.1 V nominal) —
工作溫度範圍 -40C to +100C (Industrial, TJ) Industrial (I): -40C to +100C junction
安裝類型 Surface Mount (SMD/SMT) Surface Mount (BGA)
封裝 484-ball FBGA / FCBGA 484-ball FCBGA (FBGA-484)
Packaging Tray —
Process Technology 40 nm CMOS —
Configuration Interface Passive Serial / Fast Passive Parallel / JTAG —
Bitstream Encryption 256-bit AES —
RoHS 狀態 Compliant Compliant
Logic Array Blocks (LABs) — 1,900
Embedded Memory — 5,760 Kbit (5.625 Mbit)
Embedded Multipliers (18x18) — 384
Maximum User I/O — 296
Maximum Core Clock — 717 MHz (per third-party listing)
Speed Grade — 4 (slowest)
Process Node — 40 nm CMOS
供應電壓 — Multiple rails: core 0.9V, I/O 1.2V-3.3V (per Stratix III handbook)
Configuration Method — Quartus II / EPCS serial / parallel
Lead-Free (Pb-free) — Yes (L suffix)
MSL 等級 — MSL3 (per JEDEC J-STD-020, typical for FBGA-484)

資料表與資源

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