EP3SE50F484I4N vs EP3SE50F484I4L 比較

詳細並排比較 EP3SE50F484I4N 由 Intel 與 EP3SE50F484I4L 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Intel
EP3SE50F484I4L EP3SE50F484I4L - Stratix III E FPGA, 47.5K LE, 484-FBGA | Intel

EP3SE50F484I4L - Stratix III E FPGA, 47.5K LE, 484-FBGA | Intel

EP3SE50F484I4L ⚠ 最後購買機會

規格比較

參數 EP3SE50F484I4N EP3SE50F484I4L
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 NRND 最後購買
Device Family Stratix III E —
Logic Elements (LE) 47,500 47,500
Adaptive Logic Modules (ALMs) 19,000 [DATA_NEEDED: ALM count]
Logic Array Blocks (LABs) 1,900 1,900
Embedded Memory (TriMatrix) 2,136 Kbits —
Embedded Multipliers (18x18) 384 384
User I/Os 296 —
I/O Banks 12 —
PLLs 8 —
Global Clock Networks 16 —
Maximum User I/O Frequency 800 MHz (per DigChip datasheet summary) —
Process Technology 65 nm CMOS —
Core Voltage 1.1 V —
封裝 484-ball FC-FBGA (F484) 484-ball FCBGA (FBGA-484)
工作溫度 0 C to +85 C (Industrial) —
Speed Grade I4 4 (slowest)
Lead-Free / RoHS Lead-free (per ampheo listing) —
Family — Stratix III E
Embedded Memory — 5,760 Kbit (5.625 Mbit)
Maximum User I/O — 296
Maximum Core Clock — 717 MHz (per third-party listing)
工作溫度範圍 — Industrial (I): -40C to +100C junction
Process Node — 40 nm CMOS
安裝類型 — Surface Mount (BGA)
供應電壓 — Multiple rails: core 0.9V, I/O 1.2V-3.3V (per Stratix III handbook)
Configuration Method — Quartus II / EPCS serial / parallel
Lead-Free (Pb-free) — Yes (L suffix)
RoHS 狀態 — Compliant
MSL 等級 — MSL3 (per JEDEC J-STD-020, typical for FBGA-484)

資料表與資源

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