EP3SE50F780I4LG vs EP3CLS70F780I7N 比較

詳細並排比較 EP3SE50F780I4LG 由 Intel 與 EP3CLS70F780I7N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

規格比較

參數 EP3SE50F780I4LG EP3CLS70F780I7N
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 NRND 啟用中
Series Stratix III E Cyclone III LS
Family Stratix III —
Logic Elements 47,500 70,208
Adaptive Logic Modules (ALMs) 19,000 —
Embedded Memory 5.49 Mbit 3,068,928 bits
Maximum User I/Os 488 —
封裝 780-ball FCBGA (FBGA-780) —
Operating Supply Voltage (Core) 1.1 V —
安裝類型 Surface Mount Surface Mount
工作溫度範圍 -40 C to +100 C —
Process Node 65 nm —
DSP Blocks Yes (dedicated, count not in source data) —
High-Speed Transceivers Multi-gigabit, count not in source data —
Lead-Free / RoHS Yes (G suffix = Pb-free) —
Packaging Tray —
記憶體類型 Embedded SRAM block RAM —
Device Type — Field Programmable Gate Array (FPGA)
Maximum User I/O — 413 pins
供應電壓 — 1.2 V
Temperature Grade — Industrial
Package Type — BGA
Package Pin Count — 780 balls
Package Shape — Square
Terminal Form — Ball
Configuration Technology — SRAM-based FPGA
Configuration Method — [DATA_NEEDED: configuration method]
工作溫度 — [DATA_NEEDED: operating temperature]
RoHS 狀態 — unknown
REACH Status — unknown
AEC-Q100 Qualification — unknown

資料表與資源

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